H01L2224/8493 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector; Post-treatment of the connector or bonding area Reshaping, e.g. for severing the strap, modifying the loop shape

• H01L2224/84931 » by chemical means, e.g. etching 3
• H01L2224/84935 » by heating means, e.g. reflowing 0
• H01L2224/84947 » by mechanical means, e.g. pressing, stamping 5

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