H01L2224/84935 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector; Post-treatment of the connector or bonding area; Reshaping, e.g. for severing the strap, modifying the loop shape by heating means, e.g. reflowing

• H01L2224/84937 » using a polychromatic heating lamp 0
• H01L2224/84939 » using a laser 2
• H01L2224/84941 » Induction heating, i.e. eddy currents 0
• H01L2224/84943 » using a flame torch, e.g. hydrogen torch 0
• H01L2224/84945 » using a corona discharge, e.g. electronic flame off [EFO] 0