SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCIATED SYSTEMS AND METHODS

Semiconductor apparatus having side surface wiring

WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

Method of manufacturing printed wiring board

Stacked semiconductor device and semiconductor memory device

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Electrically connecting substrate with electrical device

Method of fabricating chip package

Chip package

Semiconductor device

Integrated circuit package system with flex bump

ELECTRONIC APPARATUS

Method for fabricating semiconductor package free of substrate

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SYMMETRIC PACKAGING

Two-sided die in a four-sided leadframe based package

Semiconductor memory device and semiconductor memory card using the same

Electrical shielding in stacked dies by using conductive die attach adhesive

Structure and manufactruing method of chip scale package

Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the Same

Method for designing dummy pattern, exposure mask, semiconductor device, method for semiconductor device, and storage medium

Method Of Manufacturing A Fingerprint Sensor And Corresponding Sensor

REDUCED-DIMENSION MICROELECTRONIC COMPONENT ASSEMBLIES WITH WIRE BONDS AND METHODS OF MAKING SAME

MEMORY DEVICES INCLUDING SEPARATING INSULATING STRUCTURES ON WIRES AND METHODS OF FORMING

Semiconductor chip mounting board with multiple ports

Semiconductor device and process for fabrication thereof

Bonding pad structure disposed in semiconductor device and related method

Integrated circuit for various packaging modes

MULTI-STRAND SUBSTRATE FOR BALL-GRID ARRAY ASSEMBLIES AND METHOD

Packaging Substrate with Flat Bumps for Electronic Devices and Method of Manufacturing the Same

Metallization with tailorable coefficient of thermal expansion

Bidirectional multiplexed RF isolator

Semiconductor chip with post-passivation scheme formed over passivation layer

On chip transformer isolator

Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the Same

Power-MOSFETs with improved efficiency for multi-channel class-D audio amplifiers and packaging thereof

Plastic package and method of fabricating the same

Semiconductor device

SEMICONDUCTOR PACKAGE

Integrated circuit carrier arrangement with electrical connection islands

Semiconductor device and method of manufacturing same

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

CIRCUIT BOARD STRUCTURE FOR EMBEDDING SEMICONDUCTOR CHIP THEREIN AND METHOD FOR FABRICATING THE SAME

Method of creating contour structures to highlight inspection region

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Integrated circuit package system with bonding in via

Light emitting diode lamp with low thermal resistance

Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

Semiconductor device, semiconductor package for use therein, and manufacturing method thereof

Semiconductor light emitting device

Wire bonding method and related device for high-frequency applications

Semiconductor module with multiple semiconductor chips

Lead frame, semiconductor device, and method of manufacturing the semiconductor device

Semiconductor device and manufacturing method of the same

Thin film deposition as an active conductor and method therefor

Resin molded semiconductor device and differential amplifier circuit

Thermosetting die bonding film

Memory IC package assembly having stair step metal layer and apertures

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POWER CONVERSION APPARATUS INCORPORATING THIS SEMICONDUCTOR DEVICE

High current semiconductor power device SOIC package

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION THEREOF

Package board and method for manufacturing thereof

Semiconductor device and semiconductor module using the same

Apparatus for wire bonding and integrated circuit chip package

Ribbon bonding tool and process

Method For Establishing an Electrical and Mechanical Connection Between Chip Contact Surfaces and Antenna Contact Surfaces and Transponder

SEMICONDUCTOR PACKAGE WIRE BONDING

Stacked semiconductor package

SEMICONDUCTOR PACKAGE

Ribbon bonding tool and process

INTEGRATED CIRCUIT SYSTEM WITH PRE-CONFIGURED BOND WIRE BALL

Semiconductor substrate

Heat dissipating device with preselected designed interface for thermal interface materials

High performance sub-system design and assembly

Passivation layer for a circuit device and method of manufacture

Stacked semiconductor device and method of manufacturing the same

Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package

Circuit substrate and the semiconductor package having the same

System-in-package packaging for minimizing bond wire contamination and yield loss

Semiconductor device and programming method

Ball grid array structures having tape-based circuitry

Method for reduction of soft error rates in integrated circuits

Chip mount, methods of making same and methods for mounting chips thereon

Semiconductor device package having pseudo chips

Semiconductor device

Semiconductor package having leadframe with exposed anchor pads

Methods of connecting an antenna to a transponder chip

SEMICONDUCTOR DICE HAVING BACK SIDE REDISTRIBUTION LAYER ACCESSED USING THROUGH-SILICON VIAS, METHODS

Accessible electronic storage apparatus

Stacked die package with stud spacers

Stacked-die packages with silicon vias and surface activated bonding

Semiconductor device and electronic device

Semiconductor apparatus and manufacturing method of semiconductor apparatus

Semiconductor package having non-ceramic based window frame

Semiconductor chip and production process therefor

Stacked die in die BGA package

Semiconductor device

Amplifier chip mounted on a lead frame

METHOD OF DIE STACKING USING INSULATED WIRE BONDS

Method of fabricating a film-on-wire bond semiconductor device

DIE STACKING USING INSULATED WIRE BONDS

Semiconductor chip and method of producing the same

Semiconductor integrated circuit providing for wire bonding directly above an active circuit region, and manufacturing method thereof

PARTIALLY INSULATION COATED METAL WIRE FOR WIRE BONDING AND WIRE BONDING METHOD FOR SEMICONDUCTOR PACKAGE USING THE SAME

Semiconductor device

Card adapter for use with a storage apparatus

Accessible electronic storage apparatus for use with support frame

Wirebond Package Design for High Speed Data Rates

WIRE BOND AND METHOD OF FORMING SAME

Method of manufacturing a memory card

Low loop height ball bonding method and apparatus

Semiconductor package

PACKAGE DESIGNS FOR VERTICAL CONDUCTION DIE

Micromachine Device

Base plate for a power semiconductor module

Resilient carrier assembly for an integrated circuit

Low fabrication cost, high performance, high reliability chip scale package

Stacked die with a recess in a die BGA package

Microelectronic packages fabricated at the wafer level and methods therefor

Semiconductor package and method for manufacturing the same

ATTACHING AND INTERCONNECTING DIES TO A SUBSTRATE

Stacked semiconductor package having fan-out structure through wire bonding

Semiconductor device and wire bonding method therefor

Microelectronic component assemblies and microelectronic component lead frame structures

Integrated circuit package system with pad to pad bonding

Semiconductor element comprising a supporting structure and production method

Elimination of RDL using tape base flip chip on flex for die stacking

Wire pad of semiconductor device

Structure of high performance combo chip and processing method

Structure of high performance combo chip and processing method

Castellation wafer level packaging of integrated circuit chips

Semiconductor device with a semiconductor chip stack and plastic housing, and methods for producing the same

Modularized Die Stacking System and Method

Microelectronic component assemblies and microelectronic component lead frame structures

Packaged microelectronic components with terminals exposed through encapsulant

Perimeter matrix ball grid array circuit package with a populated center

Bonding wire and bond using a bonding wire

WIRE-BONDED PACKAGE WITH ELECTRICALLY INSULATING WIRE ENCAPSULANT AND THERMALLY CONDUCTIVE OVERMOLD

Mounting structure for IC tag and IC chip for mounting

Compact impedance transformation circuit

Wire bonders and methods of wire-bonding

Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time

Semiconductor device

High frequency line-to-waveguide converter and high frequency package

Components, methods and assemblies for stacked packages

Semiconductor element and manufacturing method thereof

Light emitting device

Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages

Circuit board including solder ball land having hole and semiconductor package having the circuit board

Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

Method of fabricating a stacked die having a recess in a die BGA package

Chip-stacked package structure

Interposer and semiconductor package with reduced contact area

On-chip magnetic components

SEMICONDUCTOR MULTI-CHIP PACKAGE AND FABRICATION METHOD

Methods for providing and using grid array packages

Nonvolatile memory apparatus

SEMICONDUCTOR CHIP

Chip having two groups of chip contacts

System and method of attenuating electromagnetic interference with a grounded top film

CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEMBLING SAME

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Structure of high performance combo chip and processing method

Miniature optical element for wireless bonding in an electronic instrument

Integrated circuit packaging system with ultra-thin die

Bond and method for bonding two contact surfaces

Semiconductor device

Semiconductor package having optimal interval between bond fingers for reduced substrate size

Methods of operating electronic devices, and methods of providing electronic devices

Method of manufacturing a semiconductor device

Semiconductor device, and life prediction circuit and life prediction method for semiconductor device

Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages

SEMICONDUCTOR DEVICE HAVING WIRE LOOP AND METHOD AND APPARATUS FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

Thermal improvement for hotspots on dies in integrated circuit packages

Magnetic shielding for magnetic random access memory

Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component

Mounting integrated circuit dies for high frequency signal isolation

Wire bonding method for forming low-loop profiles

Encapsulated electronic device

Semiconductor package substrate and semiconductor package having the same

Multiple die stack apparatus employing T-shaped interposer elements

Dual MOSFET package

Method for fabricating semiconductor package with multi-layer die contact and external contact

Stacked bump structure and manufacturing method thereof

Semiconductor device having shifted stacked chips

Lead frame and semiconductor device using the same

Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips

Low resistance integrated MOS structure

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Semiconductor device

MOSFET power package

Chip with power and signal pads connected to power and signal lines on substrate

Semiconductor device having an adhesion promoting layer and method for producing it

QFN housing having optimized connecting surface geometry

Methods of forming semiconductor assemblies

Method for making a wedge wedge wire loop

Method of correcting bonding coordinates using reference bond pads

Stacked integrated circuit package system with connection protection

Integrated circuit (IC) carrier assembly incorporating an integrated circuit (IC) retainer

Folding chip planar stack package

Method of forming a semiconductor device having bonding pad of the second chip thinner than bonding pad of the first chip

Chip Package Structure

Semiconductor chip assembly

Integrated circuit package system having interconnect stack and external interconnect

Layer between interfaces of different components in semiconductor devices

Semiconductor device and semiconductor module therewith

Multi-row lead frame

Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine

Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor

Semiconductor chip package having an adhesive tape attached on bonding wires

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

Semiconductor component with semiconductor chip and adhesive film, and method for its production

Active area bonding compatible high current structures

Method for producing a surface-mountable semiconductor component

Stacked integrated circuit package system with face to face stack configuration

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Micromechanical Getter Anchor

Bonding pad structure

Plastic ball grid array package with integral heatsink

Optical bond-wire interconnections and a method for fabrication thereof

Semiconductor device, interposer chip and manufacturing method of semiconductor device

Microelectronic interconnect device comprising localised conductive pins

Nonvolatile memory system

Managed memory component

Leadless lead-frame

Method of manufacturing wiring substrate

Semiconductor device package and method for manufacturing same

Through-hole contacts in a semiconductor device

Pad layout

Multi-chip package system

Semiconductor device

Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages

Vertical power semiconductor component, semiconductor device and methods for the production thereof

Package having exposed integrated circuit device

Multi-strand substrate for ball-grid array assemblies and method

Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device

Microelectronic component assemblies having lead frames adapted to reduce package bow

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Package substrate

Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another

Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes

Semiconductor device having high frequency components and manufacturing method thereof

Circuit under pad structure and bonding pad process

Radio-frequency system in package including antenna

Semiconductor device

Interposer and stacked chip package

Semiconductor/printed circuit board assembly, and computer system

Method and apparatus that provides differential connections with improved ESD protection and routing

INTEGRATED CIRCUIT PACKAGE SYSTEM

Semiconductor device and method for producing it, and use of an electrospinning method

Low voltage drop and high thermal performance ball grid array package

Chip stack package and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Wire bonding method

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Constant voltage diode

Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device

Method for making stacked integrated circuits (ICs) using prepackaged parts

IC card with bonding wire connections of different lengths

IC card

IC card

Ultrathin leadframe BGA circuit package

Method of making stacked die package

METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP IN A MULTI-TIER BONDING DEVICE AND A DEVICE PRODUCED BY THE METHOD

Semiconductor chip with post-passivation scheme formed over passivation layer

High frequency chip packages with connecting elements

Method and apparatus for attaching a workpiece to a workpiece support

Semiconductor device that attains a high integration

Housed DRAM chip for high-speed applications

Thin package system with external terminals

CHIP PACKAGE METHOD

Power semiconductor module with overcurrent protective device

Conductor substrate, semiconductor device and production method thereof

Semiconductor device with semiconductor chip and adhesive film and method for producing the same

Electronic apparatus

Microelectronic packages and methods therefor

Packaged die on PCB with heat sink encapsulant and methods

Insulated gate semiconductor device having a clamping element to clamp gate-emitter voltage and method of manufacturing thereof

Semiconductor device with a resin-sealed optical semiconductor element

Method of forming an electrical contact

Wire sweep resistant semiconductor package and manufacturing method therefor

Method for producing bonding connection of semiconductor device

Semiconductor apparatus integrating an electrical device under an electrode pad

Monitoring deformation and time to logically constrain a bonding process

Selective consolidation methods for fabricating semiconductor device components and conductive features thereof

Method of forming an electrical contact

Multi-part lead frame with dissimilar materials

Multi-part lead frame with dissimilar materials

Method for fabricating semiconductor component having conductors and bonding pads with wire bondable surfaces and selected thickness

Multi-chip package type semiconductor device

Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology

Semiconductor device, semiconductor package for use therein, and manufacturing method thereof

Printed circuit board assembly with strain-alleviating structures

Test carrier for semiconductor components having conductors defined by grooves

Microelectronic devices and methods for manufacturing microelectronic devices

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Method for producing an electronic component or module and a corresponding component or module