211649 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Bonding interfaces outside the semiconductor or solid-state body Material
Semiconductor power component with a vertical current path through a semiconductor power chip
#902Semiconductor connection component
#903Semiconductor device and capacitance regulation circuit
#904Semiconductor device and capacitance regulation circuit
#905METHODS OF FABRICATING A SEMICONDUCTOR DEVICE USING A PHOTOSENSITIVE POLYIMIDE LAYER AND SEMICONDUCTOR DEVICES FABRICATED THEREBY
#906Semiconductor device and a manufacturing method of the same
#907Semiconductor device
#908Semiconductor device
#909Method and apparatus for removing encapsulating material from a packaged microelectronic device
#910Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same
#911SEMICONDUCTOR DEVICE
#912Electrical interconnect structures for integrated circuits and methods of manufacturing the same
#913Radio frequency power amplifier module
#914ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE
#915Integrated circuit chip and integrated device
#916Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device
#917METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A MULTICHIP DEVICE
#918Method and apparatus for attaching microelectronic substrates and support members
#919Relay board with bonding pads connected by wirings
#920Method and apparatus for attaching microelectronic substrates and support members
#921Stress and force management techniques for a semiconductor die
#922Electrically connecting substrate with electrical device
#923Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the same
#924Adhesive/spacer island structure for multiple die package
#925Bumped die and wire bonded board-on-chip package
#926Method and structure for reduction of soft error rates in integrated circuits
#927Semiconductor power module with SiC power diodes and method for its production
#928Packaging of a microchip device
#929Wire-bonding method and semiconductor package using the same
#930Surface mount package
#931Cavity ball grid array apparatus having improved inductance characteristics
#932METHOD OF FABRICATING A HIGH-DENSITY LEAD ARRANGEMENT PACKAGE STRUCTURE
#933Semiconductor device with semiconductor device components embedded in a plastics composition
#934Semiconductor device with improved signal transmission characteristics
#935Semiconductor device
#936Stacked semiconductor package
#937Multi-part lead frame with dissimilar materials
#938Methods of operating electronic devices, and methods of providing electronic devices
#939Standoffs for centralizing internals in packaging process
#940Method of fabricating a stacked die in die BGA package
#941Method of fabricating a stacked die in die BGA package
#942Stacked die in die BGA package
#943Wire bonding structure to electrically connect a printhead chip to a flexible printed circuit of an ink cartridge and method thereof
#944Alignment using fiducial features
#945Chip-on-board assemblies
#946Leadless semiconductor package
#947Method for producing a protective assembly for protecting an electronic component from electrostatic discharge, and correspondingly configured electronic component
#948Semiconductor element and manufacturing method thereof
#949Taped semiconductor device and method of manufacture
#950Semiconductor device having capacitive insulation means and communication terminal using the device
#951Varied-thickness heat sink for integrated circuit (IC) package
#952Image sensitive electronic device packages
#953Method for efficiently producing removable peripheral cards
#954Chip package and wire bonding process thereof
#955Composite material, electrical circuit or electric module
#956Wafer level pre-packaged flip chip systems
#957Multi-chip module and methods
#958Wafer level pre-packaged flip chip
#959Wafer level pre-packaged flip chip
#960Method and system for solder die attach
#961Integrated circuit package including miniature antenna
#962Wafer level pre-packaged flip chip system
#963Flip chip package having protective cap and method of fabricating the same
#964Semiconductor component in a housing with mechanically inforcing flat conductor webs
#965Wire loop, semiconductor device having same and wire bonding method
#966Semiconductor device with substrate having penetrating hole having a protrusion
#967Semiconductor power module package
#968Semiconductor device and method of manufacturing the same
#969Semiconductor device with terminals, and method of manufacturing the same
#970Method of making a multi-chip electronic package having laminate carrier
#971Standoffs for centralizing internals in packaging process
#972Semiconductor device and electronic device
#973Shielding arrangement to protect a circuit from stray magnetic fields
#974Semiconductor package accomplishing fan-out structure through wire bonding
#975High density direct connect LOC assembly
#976Semiconductor device including ROM interface pad
#977Strobe light control circuit and IGBT device
#978Leadless semiconductor package and manufacturing method thereof
#979Semiconductor device to be applied to various types of semiconductor package
#980ELECTRONIC DEVICE PACKAGE
#981Semiconductor device having bonding pad of the first chip thicker than bonding pad of the second chip
#982Semiconductor device and manufacturing method thereof
#983Memory card with connecting portions for connection to an adapter
#984Memory card with connecting portions for connection to an adapter
#985Stacked die-in-die BGA package with die having a recess
#986Integrated circuit carrier
#987Semiconductor device including an arrangement for detection of tampering
#988Flip-chip adaptor package for bare die
#989Double density method for wirebond interconnect
#990Miniature optical element for wireless bonding in an electronic instrument
#991Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#992Contact securing element for bonding a contact wire and for establishing an electrical connection
#993Solder masks used in encapsulation, assemblies including the solar mask, and methods
#994Semiconductor device, semiconductor body and method of manufacturing thereof
#995High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package
#996Low profile small outline leadless semiconductor device package
#997Electrical device allowing for increased device densities
#998Stacked microfeature devices
#999Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded
#1000Semiconductor light emitting device
#1001Package for high frequency usages and its manufacturing method
#1002Encapsulation of circuit components to reduce thermal cycling stress
#1003High frequency semiconductor device
#1004Input and output circuit of an integrated circuit chip
#1005Semiconductor device with chip-on-board structure
#1006Semiconductor device and manufacturing method thereof
#1007Semiconductor device
#1008Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#1009Wire bonding method
#1010Substrate for an FBGA semiconductor component
#1011Ground arch for wirebond ball grid arrays
#1012Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectonic devices
#1013Chip package and producing method thereof
#1014Semiconductor device and process for fabrication thereof
#1015Perimeter matrix ball grid array circuit package with a populated center
#1016Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methods
#1017Wire bonding method
#1018Device packages
#1019Method for making a semiconductor multi-package module having wire bond interconnect between stacked packages
#1020Device packages having stable wirebonds
#1021Semiconductor module
#1022Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages
#1023Transducer assembly, capillary and wire bonding method using the same
#1024Molding tool and a method of forming an electronic device package
#1025Integrated circuit die connection methods and apparatus
#1026Thermal enhanced package for block mold assembly
#1027Chip package and producing method thereof
#1028Semiconductor device with sense structure
#1029Method and apparatus for forming a low profile wire loop
#1030Ribbon bonding tool and process
#1031Method in the fabrication of a memory device
#1032Electronic component with semiconductor chip and semiconductor wafer with contact pads, and method for the production thereof
#1033Multimedia card and transfer molding method
#1034Low profile ball-grid array package for high power
#1035Method for making a semiconductor multipackage module including a processor and memory package assemblies
#1036On-pad broadband matching network
#1037Semiconductor device with split pad design
#1038Support device for monolithically integrated circuits
#1039Wire loop, semiconductor device having same and wire bonding method
#1040Semiconductor package device having reduced mounting height and method for manufacturing the same
#1041Micromechanical getter anchor
#1042Accessible electronic storage apparatus
#1043Semiconductor device and method of fabricating the same
#1044IC substrate with over voltage protection function
#1045IC substrate with over voltage protection function
#1046Ball grid array IC substrate with over voltage protection function
#1047IC substrate with over voltage protection function
#1048IC substrate with over voltage protection function
#1049Method of marking a low profile packaged semiconductor device
#1050Package that integrates passive and active devices with or without a lead frame
#1051Carrier with metal bumps for semiconductor die packages
#1052Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component
#1053Memory package
#1054Semiconductor device package
#1055Multi-chip module
#1056Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
#1057Multi-chip module having bonding wires and method of fabricating the same
#1058Thermally enhanced package for an integrated circuit
#1059High density package interconnect wire bond strip line and method therefor
#1060Multi-part lead frame with dissimilar materials
#1061Electrical-interference-isolated transistor structure
#1062Mold assembly, method and a package stack via bottom-leaded plastic (BLP) packaging
#1063Microelectronic assemblies incorporating inductors
#1064Method for two-stage transfer molding device to encapsulate MMC module
#1065Multilayered circuit substrate, semiconductor device and method of producing same
#1066Multi-chip package and method of fabricating the same
#1067Encapsulated electronic device structure
#1068Die bonded device and method for transistor packages
#1069Electronic device and method of manufacturing the same
#1070Semiconductor chip package having an adhesive tape attached on bonding wires
#1071Power amplifier module
#1072Semiconductor packages with asymmetric connection configurations
#1073Semiconductor system with fine pitch lead fingers
#1074Active area bonding compatible high current structures
#1075Fabricating surface mountable semiconductor components with leadframe strips
#1076High density direct connect loc assembly
#1077Semiconductor package device and method for fabricating the same
#1078IC chip package with cover
#1079Semiconductor package with conductive molding compound and manufacturing method thereof
#1080Staggered wirebonding configuration
#1081IC chip package with isolated vias
#1082Methods for designing and tuning one or more packaged integrated circuits
#1083Cavity-down Package and Method for Fabricating the same
#1084Semiconductor device and method for fabricating the same
#1085Multiple die stack apparatus employing t-shaped interposer elements
#1086Multiple die stack apparatus employing T-shaped interposer elements
#1087Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module
#1088Circuit carrier and production thereof
#1089Integrated circuit package employing a heat-spreader member
#1090Integrated circuit package employing a flexible substrate
#1091Semiconductor device
#1092Contour structures to highlight inspection regions
#1093Semiconductor device
#1094Method of forming a stacked semiconductor package
#1095Surface-mounted microwave package and corresponding mounting with a multilayer circuit
#1096Chip package
#1097Method for producing a packaged integrated circuit
#1098Stacked die module and techniques for forming a stacked die module
#1099Production methods for a leadframe and electronic devices
#1100Assembly for stacked BGA packages
#1101Method of forming a wafer backside interconnecting wire
#1102Light-emitting semiconductor device having an overvoltage protector
#1103Semiconductor equipment having a pair of heat radiation plates
#1104Method of fabricating a semiconductor die package having improved inductance characteristics
#1105Apparatus for and method of packaging semiconductor devices
#1106Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment
#1107Methods for forming conductive bumps and wire loops
#1108Module assembly and method for stacked BGA packages
#1109Methods for packaging image sensitive electronic devices
#1110Methods for packaging image sensitive electronic devices
#1111Methods for packaging image sensitive electronic devices
#1112Chip module
#1113Semiconductor chip stack structure and method for forming the same
#1114Semiconductor device and wire bonding chip size package therefor
#1115Module assembly for stacked BGA packages
#1116Method of manufacturing a semiconductor device
#1117Methods for packaging image sensitive electronic devices
#1118Magnetic shielding for magnetic random access memory card
#1119Surface-mounting semiconductor device and method of making the same
#1120Wire sweep resistant semiconductor package and manufacturing method thereof
#1121Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same
#1122Method of making a semiconductor device adapted to remove noise from a signal
#1123Electronic component with multilayered rewiring plate and method for producing the same
#1124Semiconductor integrated circuit device which restricts an increase in the area of a chip, an increase in the number of lead terminals of a package, and can reduce parasitic inductance
#1125Method of manufacturing printed wiring board
#1126Submember mounted on a chip of electrical device for electrical connection
#1127Electronic packages with dice landed on wire bonds
#1128Methods for designing spacers for use in stacking semiconductor devices or semiconductor device components
#1129Integrated circuit package including miniature antenna
#1130Stacked packages
#1131Memory card with an adaptor
#1132Wire bond with improved shear strength
#1133Programmable radio transceiver
#1134Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components
#1135Apparatus and methods for constructing antennas using wire bonds as radiating elements
#1136Radio frequency power amplifier module
#1137Stacked chip electronic package having laminate carrier and method of making same
#1138Hermetic chip in wafer form
#1139Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance
#1140LOC semiconductor assembled with room temperature adhesive
#1141Chip structure with redistribution traces
#1142Method for manufacturing plastic ball grid array package with integral heatsink
#1143Magnetic shield for integrated circuit packaging
#1144Electronic module with layer of adhesive and process for producing it
#1145Castellation wafer level packaging of integrated circuit chips
#1146Method of packaging integrated circuits, and integrated circuit packages produced by the method
#1147Electronic device with semiconductor chip including a radiofrequency power module
#1148Heat dissipation device for integrated circuits
#1149Semiconductor device and manufacturing method therefor
#1150Formation of a wire bond with enhanced pull
#1151Semiconductor device
#1152Castellation wafer level packaging of integrated circuit chips
#1153BGA package with concave shaped bonding pads
#1154Castellation wafer level packaging of integrated circuit chips
#1155Semiconductor device packages including hermetic packaging elements for at least partially encapsulating conductive elements and other package elements for protecting the portions of semiconductor devices not covered by the hermetic package elements, and packaging methods
#1156Method for fabricating semiconductor components using conductive layer and grooves
#1157Methods and apparatus for integrated circuit ball bonding using stacked ball bumps
#1158Castellation wafer level packaging of integrated circuit chips
#1159Castellation wafer level packaging of integrated circuit chips
#1160Taped lead frames and methods of making and using the same in semiconductor packaging
#1161Circular wire-bond pad, package made therewith, and method of assembling same
#1162Method and structure for manufacturing improved yield semiconductor packaged devices
#1163Semiconductor device with wire bond inductor and method
#1164Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#1165Method for encapsulating multiple integrated circuits
#1166Apparatus for molding a semiconductor die package with enhanced thermal conductivity
#1167Multiple device package
#1168Memory card with a cap having indented portions
#1169Semiconductor device and manufacturing method therefor
#1170Package and method for packaging an integrated circuit die
#1171Method and system for improved wire bonding
#1172Methods of making microelectronic packages
#1173RF isolator with differential input/output
#1174Method of making photolithographically-patterned out-of-plane coil structures
#1175Electrical contact
#1176Optimized driver layout for integrated circuits with staggered bond pads
#1177On chip transformer isolator
#1178Semiconductor device
#1179Semiconductor integrated circuit device and method for fabricating the same
#1180Electronic system including a semiconductor device with at least one semiconductor die, a carrier, and an encapsulant that fills a space between the die and the carrier and covers intermediate conductive elements that connect the die and the carrier
#1181Layout structure for providing stable power source to a main bridge chip substrate and a motherboard
#1182Moisture-resistant electronic device package and methods of assembly
#1183Multi-band tunable resonant circuit
#1184Method for fabricating leadless packages with mold locking characteristics
#1185Integrated ball and via package and formation process
#1186Fine-pitch packaging substrate and a method of forming the same
#1187Double density method for wirebond interconnect
#1188Adhesive/spacer island structure for multiple die package
#1189Semiconductor device, method for mounting the same, and method for repairing the same
#1190Leadless leadframe with an improved die pad for mold locking
#1191Method of attaching a leadframe to singulated semiconductor dice
#1192Integrated circuit packaging method and structure for redistributing configuration thereof
#1193Package design and method for electrically connecting die to package
#1194Semiconductor device structure with adhesion-enhanced semiconductor die
#1195Semiconductor device assemblies including an encapsulant located over intermediate conductive elements and filling a space between a semiconductor die and a carrier of the assembly
#1196Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly
#1197Power module and electric transportation apparatus incorporating the same
#1198Resin-molded package with cavity structure
#1199Method for internal electrical insulation of a substrate for a power semiconductor module
#1200High data rate chip mounting