ClassID:

211701

H01L2224/85916 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Post-treatment of the connector or wire bonding area; Cleaning, e.g. oxide removal step, desmearing; Thermal cleaning, e.g. using laser ablation or by electrostatic corona discharge using a laser