211707 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Post-treatment of the connector or wire bonding area; Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape by heating means, e.g. reflowing
Sub-classes:Die package with low electromagnetic interference interconnection
#2Die packaging with fully or partially fused dielectric leads
#3Heat isolation structures for high bandwidth interconnects
#4Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same
#5Electronic device having a lead with selectively modified electrical properties