211709 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Post-treatment of the connector or wire bonding area; Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape by heating means, e.g. reflowing using a laser
Semiconductor module and method for manufacturing the same
#2Method for determining a bonding connection in a component arrangement and test apparatus
#3Die package with low electromagnetic interference interconnection
#4Die packaging with fully or partially fused dielectric leads
#5Heat isolation structures for high bandwidth interconnects
#6Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same
#7Electronic device having a lead with selectively modified electrical properties
#8Chip package and method of forming the same
#9Heavy-wire bond arrangement and method for producing same
#10Processes and structures for IC fabrication
#11Processes and structures for IC fabrication