211758 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]; Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, e.g. nozzle Translational movements