211847 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups - ; Specific sequence of method steps; Connecting a surface with connectors of different types; Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
INTERCONNECTING A PRINTED-CIRCUIT-BOARD SUBSTRATE TO ANOTHER SUBSTRATE OR TO A DIE
#2METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH SUBSTRATE FOR ELECTRICAL CONNECTION
#3Semiconductor Device and Method of Making a Semiconductor Package with a Pre-Installed Glass Cover
#4SEMICONDUCTOR PACKAGE
#5SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#6MICROMECHANICAL COMPONENT
#7POWER MODULE FOR A VEHICLE
#8SEMICONDUCTOR DEVICE
#9SEMICONDUCTOR DEVICE
#10SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
#11Method for manufacturing semiconductor device with substrate for electrical connection
#12METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE
#13SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#14METHOD FOR FABRICATING AN ELECTRONIC DEVICE
#15Power die package
#16Multi-die package with bridge layer
#17Light emitting device and method of manufacturing the light emitting device
#18Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#19Pressure sensor, in particular a microphone with improved layout
#20Wafer level flat no-lead semiconductor packages and methods of manufacture
#21Wafer level flat no-lead semiconductor packages and methods of manufacture
#22Wafer level flat no-lead semiconductor packages and methods of manufacture
#23Semiconductor device
#24Package structure of fingerprint identification chip
#25Shielded magnetoresistive random access memory devices and methods for fabricating the same
#26Light emitting device and method of manufacturing the light emitting device
#27SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#28Semiconductor device
#29Structures and methods for shielding magnetically sensitive components
#30Wafer level flat no-lead semiconductor packages and methods of manufacture
#31Semiconductor device and method of manufacturing the same
#32Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#33Methods for making multi-die package with bridge layer
#34Wire bonded electronic devices to round wire
#35Microelectronic package with stacked microelectronic units and method for manufacture thereof
#36Semiconductor device, semiconductor package, and method for manufacturing semiconductor device
#37Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
#38ELECTRONIC CONNECTION STRUCTURE FOR COUPLING PINS OF CHIP WITH WIRING CIRCUIT AND PANEL USING SAME
#39Semiconductor device and method of forming an embedded SoP fan-out package
#40Method of manufacturing semiconductor device
#41Semiconductor device, semiconductor package, and method for manufacturing semiconductor device
#42Semiconductor package including a plurality of stacked chips
#43Semiconductor device and manufacturing method thereof
#44Semiconductor device
#45Chip package and method for forming the same
#46Multi-die package with bridge layer and method for making the same
#47Semiconductor device
#48Microelectronic package with stacked microelectronic units and method for manufacture thereof
#49Semiconductor device
#50Support member, wiring substrate, method for manufacturing wiring substrate, and method for manufacturing semiconductor package
#51Stacked synchronous buck converter having chip embedded in outside recess of leadframe
#52Wafer level flat no-lead semiconductor packages and methods of manufacture
#53Direct die solder of gallium arsenide integrated circuit dies and methods of manufacturing gallium arsenide wafers
#54Packaging structure for thin die and method for manufacturing the same
#55Structures and methods for shielding magnetically sensitive components
#56Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor device
#57Semiconductor device
#58Single layer coreless substrate
#59Microelectronic package with stacked microelectronic units and method for manufacture thereof
#60Semiconductor device and method of manufacturing the same
#61Method for manufacturing a chip package
#62Semiconductor device and method of forming an embedded SOP fan-out package
#63Thermally enhanced electronic package
#64Package structure and substrate bonding method
#65Semiconductor device
#66Integrated circuit chip using top post-passivation technology and bottom structure technology
#67Microelectronic package with stacked microelectronic units and method for manufacture thereof
#68PACKAGE STACKS AND METHOD OF MANUFACTURING THE SAME
#69Chip-packaging module for a chip and a method for forming a chip-packaging module
#70SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#71Semiconductor device including a contact clip having protrusions and manufacturing thereof
#72Fabrication method of semiconductor integrated circuit device
#73SEMICONDUCTOR DEVICE WITH HEAT SPREADER
#74MOLD ARRAY PROCESS METHOD TO PREVENT EXPOSURE OF SUBSTRATE PERIPHERIES
#75Routable array metal integrated circuit package fabricated using partial etching process
#76Integrated circuit packaging system with vertical interconnection and method of manufacture thereof
#77Semiconductor package device with cavity structure and the packaging method thereof
#78High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor device
#79BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
#80Printed Circuit Board For Board-On-Chip Package, Board-On-Chip Package Including The Same, And Method Of Fabricating The Board-On-Chip Package
#81SEMICONDUCTOR DEVICE
#82Semiconductor device
#83Fabrication method of semiconductor integrated circuit device
#84Routable array metal integrated circuit package fabricated using partial etching process
#85ACTIVE ENERGY RAY-CURABLE PRESSURE-SENSITIVE ADHESIVE FOR RE-RELEASE AND DICING DIE-BONDING FILM
#86Thermally enhanced electronic package
#87Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer
#88Thermally enhanced electronic package utilizing carbon nanocapsules and method of manufacturing the same
#89Stacked chip package with redistribution lines
#90METAL-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME
#91Semiconductor device
#92Fabrication method of semiconductor integrated circuit device
#93Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereof
#94Fabrication method of semiconductor integrated circuit device
#95Integrated circuit chip using top post-passivation technology and bottom structure technology
#96Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire
#97Heat dissipating package structure and method for fabricating the same
#98Semiconductor package fabricated by cutting and molding in small windows
#99Method for manufacturing microelectronic devices
#100NON-PLANAR SUBSTRATE STRIP AND SEMICONDUCTOR PACKAGING METHOD UTILIZING THE SUBSTRATE STRIP
#101Substrate and semiconductor package for lessening warpage
#102Board on chip package and method of manufacturing the same
#103Method for forming a die-attach layer during semiconductor packaging processes
#104Method for cutting and molding in small windows to fabricate semiconductor packages
#105SEMICONDUCTOR PACKAGE
#106Chip packaging process including simpification and mergence of burn-in test and high temperature test
#107Manufacturing process of leadframe-based BGA packages
#108Stacked chip package with redistribution lines
#109CHIP-TO-CHIP PACKAGE AND PROCESS THEREOF
#110CHIP PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
#111Method of manufacturing semiconductor device
#112Chip package structure and manufacturing method thereof
#113Fabrication method of semiconductor integrated circuit device
#114Chip package and wafer treating method for making adhesive chips
#115Semiconductor chip package having a slot type metal film carrying a wire-bonding chip
#116Multi-chip ball grid array package and method of manufacture
#117FINE-SIZED CHIP PACKAGE STRUCTURE
#118Method for fabricating semiconductor package
#119Board on chip package and method of manufacturing the same
#120Semiconductor packaging process and carrier for semiconductor package
#121Semiconductor device having metallic plate with groove
#122Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#123Manufacturing process for chip package without core
#124Method and apparatus for attaching microelectronic substrates and support members
#125Method and apparatus for attaching microelectronic substrates and support members
#126Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer
#127Chip-on-board assemblies
#128Stacked chip package with redistribution lines
#129Pillar grid array package
#130Semiconductor component having stiffener, circuit decal and terminal contacts
#131Encapsulation method for semiconductor device having center pad
#132Semiconductor package and fabrication method thereof
#133Semiconductor package and manufacturing method thereof
#134Flexible leaded stacked semiconductor package
#135Heat dissipating package structure and method for fabricating the same
#136Semiconductor device and a method of assembling a semiconductor device
#137Method for fabricating semiconductor package with circuit side polymer layer
#138LOC semiconductor assembled with room temperature adhesive
#139Semiconductor chip package manufacturing method including screen printing process
#140Method for manufacturing semiconductor device
#141Chip fixed structure
#142Semiconductor component having stiffener, stacked dice and circuit decals
#143Method for fabricating semiconductor component with stiffener and circuit decal
#144Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip
#145Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#146Semiconductor component and system having stiffener and circuit decal
#147Method of fabrication of semiconductor integrated circuit device
#148Method and apparatus for attaching microelectronic substrates and support members