211875 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups - ; Specific sequence of method steps; Connecting different surfaces of the semiconductor or solid-state body with connectors of different types; Sequential connecting processes the first connecting process involving a layer connector
Sub-classes:SEMICONDUCTOR PACKAGE
#2SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN EXTENDED SUBSTRATE AND A BOTTOM SUBSTRATE
#3SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#4WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
#5FINE PITCH BVA USING RECONSTITUTED WAFER WITH AREA ARRAY ACCESSIBLE FOR TESTING
#6SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH INTERPOSER AND OPPOSING SUBSTRATES
#7SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH INTERPOSER AND OPPOSING SUBSTRATES
#8SEMICONDUCTOR PACKAGE
#9Close butted collocated variable technology imaging arrays on a single ROIC
#10MICROELECTRONIC ASSEMBLIES WITH THROUGH DIE ATTACH FILM CONNECTIONS
#11Fine pitch BVA using reconstituted wafer with area array accessible for testing
#12Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate
#13Methods of manufacturing semiconductor packaging device and heat dissipation structure
#14Heat dissipation structure, semiconductor packaging device, and manufacturing method of the semiconductor packaging device
#15Close butted collocated variable technology imaging arrays on a single ROIC
#16Integrated circuit (IC) packages employing split, double-sided metallization structures to facilitate a semiconductor die (“die”) module employing stacked dice, and related fabrication methods
#17Semiconductor module, DIMM module, manufacturing method of semiconductor module, and manufacturing method of DIMM module
#18Semiconductor package including offset stack of semiconductor dies between first and second redistribution structures, and manufacturing method therefor
#19Wafer-level stack chip package and method of manufacturing the same
#20Semiconductor structure and manufacturing method thereof
#21Die stack assembly using an edge separation structure for connectivity through a die of the stack
#22Multi-die package with bridge layer
#23Semiconductor device manufacturing method
#24Fine pitch bva using reconstituted wafer with area array accessible for testing
#25Semiconductor structure and manufacturing method thereof
#26Substrate with embedded stacked through-silicon via die
#27Semiconductor device assembly with heat transfer structure formed from semiconductor material
#28Semiconductor device and electronic device having a chip size package (CSP)
#29Semiconductor device modules including a die electrically connected to posts and related methods
#30Semiconductor device assembly with heat transfer structure formed from semiconductor material
#31Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate
#32METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
#33Semiconductor device and method of integrating power module with interposer and opposing substrates
#34Semiconductor device and electronic device having a chip size package (CSP) stack
#35Semiconductor device
#36Integrated circuit module and method of forming same
#37Method of producing an interposer-chip-arrangement for dense packaging of chips
#38Fine pitch BVA using reconstituted wafer with area array accessible for testing
#39Semiconductor device manufacturing method
#40Semiconductor device assembly with heat transfer structure formed from semiconductor material
#41Methods of assembling a flip chip on a locking dual leadframe
#42Locking dual leadframe for flip chip on leadframe packages
#43Thin stack packages
#44Die stack assembly using an edge separation structure for connectivity through a die of the stack
#45Methods for making multi-die package with bridge layer
#46Semiconductor device and corresponding method
#47Power semiconductor package device having locking mechanism, and preparation method thereof
#48Electronic device with periphery contact pads surrounding central contact pads
#49Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
#50Semiconductor device assembly with heat transfer structure formed from semiconductor material
#51Magnetic shielding of MRAM package
#52Lead frames with wettable flanks
#53Manufacturing method of ultra-thin semiconductor device package assembly
#54Method of manufacturing semiconductor device
#55Chip package and method for forming the same
#56Integrated circuit package with embedded bridge
#57Wafer-level stack chip package and method of manufacturing the same
#58Electronic device with first and second contact pads and related methods
#59Multi-die package with bridge layer and method for making the same
#60Semiconductor package having cascaded chip stack
#61Semiconductor package structure with polymeric layer and manufacturing method thereof
#62Hybrid interconnect for chip stacking
#63Stacked synchronous buck converter having chip embedded in outside recess of leadframe
#64GaN power device with solderable back metal
#65Chip-scale packaging with protective heat spreader
#66Thin stack packages
#67Method for manufacturing semiconductor device and semiconductor device
#68Interposer package-on-package structure
#69Fine pitch BVA using reconstituted wafer with area array accessible for testing
#70Semiconductor device
#71Integrated circuit package with embedded bridge
#72Interposer-chip-arrangement for dense packaging of chips
#73Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate
#74Semiconductor device and method for manufacturing same
#75Wafer-level package device having high-standoff peripheral solder bumps
#76Package structure and method for manufacturing same
#77Method for manufacturing electronic device and electronic device
#78Bondable top metal contacts for gallium nitride power devices
#79Method of manufacturing semiconductor device
#80GaN power device with solderable back metal
#81Semiconductor package, semiconductor device having the same, and method of manufacturing the same
#82Substrate with embedded stacked through-silicon via die
#83Integrated circuit assembly and method of making
#84Integrated circuit packaging system with chip stacking and method of manufacture thereof
#85Power device and method of packaging same
#86Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
#87Semiconductor package comprising an interposer and method of manufacturing the same
#88Method for fabricating 3D integrated circuit device using interface wafer as permanent carrier
#893D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer
#90Substrate with embedded stacked through-silicon via die
#91Semiconductor device and manufacturing method of a semiconductor device
#92Integrated circuit packaging system with warpage control and method of manufacture thereof
#93Semiconductor apparatus and the method of manufacturing the same
#94PACKAGING METHOD OF SEMICONDUCTOR DEVICE
#95Manufacturing method for electronic devices
#96Semiconductor device package having a buffer structure and method of fabricating the same
#97Method for fabricating a 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer
#98Stacking multiple devices using single-piece interconnecting element
#99Manufacturing method for electronic devices
#100Chip-scale packaging with protective heat spreader
#101Semiconductor device and manufacturing method of a semiconductor device
#1023D integrated circuit device fabrication using interface wafer as permanent carrier
#103Chip arrangement and method of manufacturing a chip arrangement
#104Semiconductor chip assembly
#105Manufacturing method for electronic devices
#106Integrated circuit (IC) package stacking and IC packages formed by same
#107Flip-chip wire bondless power device