207721 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
System-in-package type semiconductor device
#2102Wiring board with built-in component and method for manufacturing the same
#2103METHOD AND COMPUTER PROGRAM FOR AUTOMATED ASSIGNMENT AND INTERCONNECTION OF DIFFERENTIAL PAIRS WITHIN AN ELECTRONIC PACKAGE
#2104Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs
#2105Land grid array semiconductor package
#2106GROUNDED SHIELD FOR BLOCKING ELECTROMAGNETIC INTERFERENCE IN AN INTEGRATED CIRCUIT PACKAGE
#2107Semiconductor device and wiring part thereof
#2108Semiconductor device
#2109Semiconductor device
#2110Electrical connection board and assembly of such a board and a semiconductor component comprising an integrated circuit chip
#2111Semiconductor packaging with internal wiring bus
#2112Semiconductor device with power noise suppression
#2113Layout circuit
#2114Multi-functional energy conditioner
#2115Power grid structure to optimize performance of a multiple core processor
#2116SEMICONDUCTOR PACKAGE
#2117Method For Increasing a Routing Density For a Circuit Board and Such a Circuit Board
#2118Capacitor and wiring board including the capacitor
#2119Interconnect for chip level power distribution
#2120Semiconductor device
#2121Semiconductor device
#2122CAPACITOR BUILT-IN WIRING BOARD
#2123Semiconductor device
#2124Circuit board with decoupling capacitors
#2125Composite semiconductor device
#2126Semiconductor device with different sized ESD protection elements
#2127Power core devices and methods of making thereof
#2128Semiconductor package land grid array substrate and plurality of first and second electrodes
#2129Semiconductor device
#2130Interposer structure with embedded capacitor structure, and methods of making same
#2131Wiring board and capacitor to be built into wiring board
#2132Stacked-Chip Semiconductor Device
#2133Integrated multilayer chip capacitor module and integrated circuit apparatus having the same
#2134Semiconductor integrated circuit device
#2135Multi-chip module and single-chip module for chips and proximity connectors
#2136Semiconductor device and display apparatus
#2137Structure and method of high performance two layer ball grid array substrate
#2138Passive electronic device
#2139ELECTRIC CIRCUIT PACKAGE
#2140SYSTEM FOR DISTRIBUTING ELECTRICAL POWER FOR A CHIP
#2141Stacked semiconductor package
#2142SEMICONDUCTOR PACKAGE
#2143Power conversion apparatus
#2144Electronics Package And Manufacturing Method Thereof
#2145POWER CONTROL STRUCTURE FOR MANAGING A PLURALITY OF VOLTAGE ISLANDS
#2146Integrated circuit assembly with passive integration substrate for power and ground line routing on top of an integrated circuit chip
#2147Techniques for providing decoupling capacitance
#2148Techniques for providing decoupling capacitance
#2149PACKAGE STRUCTURE WITH EMBEDDED CAPACITOR, FABRICATING PROCESS THEREOF AND APPLICATIONS OF THE SAME
#2150Techniques for providing decoupling capacitance
#2151Electronic component built-in substrate and method of manufacturing electronic component built-in substrate
#2152Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same
#2153Semiconductor device using wiring substrate having a wiring structure reducing wiring disconnection
#2154Chip carrier substrate capacitor and method for fabrication thereof
#2155Semiconductor device including ground and power-supply planes and a dielectric layer between the ground and power-supply planes
#2156METHOD FOR MANUFACTURING WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD
#2157Printed circuit board
#2158Circuit board structure having electronic components integrated therein
#2159SUBSTRATE WITH EMBEDDED PASSIVE ELEMENT AND METHODS FOR MANUFACTURING THE SAME
#2160Manufacture including shield structure
#2161Printed circuit board
#2162Printed circuit board
#2163Universal energy conditioning interposer with circuit architecture
#2164Integrated circuit package with molded cavity
#2165Array capacitor for decoupling multiple voltages
#2166Individual sub-assembly containing a ceramic interposer, silicon voltage regulator, and array capacitor
#2167Semiconductor integrated circuit
#2168Wiring substrate, manufacturing method thereof, and semiconductor device
#2169Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths
#2170Systems and methods to laminate passives onto substrate
#2171Semiconductor device and electronic device
#2172Increasing the resistance of a high frequency input/output power delivery decoupling path
#2173Printed circuit board
#2174Reprogrammable circuit board with alignment-insensitive support for multiple component contact types
#2175Interposer and electronic device using the same
#2176Integrated circuit packages, systems, and methods
#2177Circuit device with at least partial packaging and method for forming
#2178Integrated circuit package system employing a support structure with a recess
#2179Printed circuit board
#2180Manufacturing process of a carrier
#2181Printed circuit board having coplanar LC balance
#2182Method of fabricating a microelectronic device including embedded thin film capacitor by over-etching thin film capacitor bottom electrode and microelectronic device made according to the method
#2183Semiconductor device
#2184Packaged integrated circuit with enhanced thermal dissipation
#2185High power semiconductor package and method of making the same
#2186Semiconductor device
#2187Integrated circuit package with improved power signal connection
#2188Amplifier chip mounted on a lead frame
#2189Method for fabricating an interposer
#2190Wire bond integrated circuit package for high speed I/O
#2191Semiconductor device
#2192Embedded array capacitor with top and bottom exterior surface metallization
#2193WIRING BOARD WITH BUILT-IN CAPACITOR
#2194Semiconductor device
#2195Vertical electrical device
#2196Wiring board with built-in capacitor
#2197Decoupling capacitor, wafer stack package including the decoupling capacitor, and method of fabricating the wafer stack package
#2198Semiconductor integrated circuit and multi-chip module
#2199Method and apparatus of power ring positioning to minimize crosstalk
#2200Package substrate with inserted discrete capacitors
#2201Semiconductor device, method of manufacturing the same
#2202Layout structure having a fill element arranged at an angle to a conducting line
#2203Continuously Referencing Signals over Multiple Layers in Laminate Packages
#2204Ceramic package in which far end noise is reduced using capacitive cancellation by offset wiring
#2205Power network reconfiguration using MEM switches
#2206Interconnections for fine pitch semiconductor devices and manufacturing method thereof
#2207I/O Architecture for integrated circuit package
#2208SEMICONDUCTOR PACKAGE HAVING PAD ARRANGEMENT
#2209Semiconductor integrated circuit device having reduced terminals and I/O area
#2210Ceramic Package in Which Far End Noise is Reduced Using Capacitive Cancellation by Offset Wiring
#2211Single footprint family of integrated power modules
#2212Wiring board
#2213Embedded array capacitor with side terminals
#2214Semiconductor device
#2215Package assembly pinout with superior crosstalk and timing performance
#2216Interposer and method for manufacturing the same
#2217Microelectronic package, method of manufacturing same, and system containing same
#2218Via structure
#2219Techniques for providing decoupling capacitance
#2220Wiring board and method of manufacturing wiring board
#2221Semiconductor device power interconnect striping
#2222Perimeter matrix ball grid array circuit package with a populated center
#2223Packaging structure
#2224Semiconductor Device
#2225Printed circuit board
#2226Stacking integrated circuit dies
#2227Method for implementing component placement suspended within grid array packages for enhanced electrical performance
#2228STRIP LINE DEVICE, PRINTED WIRING BOARD MOUNTING MEMBER, CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD OF FORMING SAME
#2229Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time
#2230Power/ground network of integrated circuits and arrangement thereof
#2231Electric component with a flip-chip construction
#2232Semiconductor Device
#2233Circuit Board Assembly Having Passive Component and Stack Structure Thereof
#2234Monolithic capacitor, circuit board, and circuit module
#2235Layout of a printed circuit board
#2236Multilayer capacitor
#2237Multi-chip structure
#2238System and method for ESD protection
#2239COMBINATION HEAT DISSIPATION DEVICE WITH TERMINATION AND A METHOD OF MAKING THE SAME
#2240Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby
#2241Capacitor built-in interposer and method of manufacturing the same and electronic component device
#2242Intergrated circuit utilizing down bond to define the function of the die and the implementing method thereof
#2243Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques
#2244Power delivery using an integrated heat spreader
#2245Semiconductor package having passive component and semiconductor memory module including the same
#2246Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit
#2247High speed, high density, low power die interconnect system
#2248Interposer and electronic device using the same
#2249Power grid structure to optimize performance of a multiple core processor
#2250Semiconductor device
#2251Auto connection assignment system and method
#2252SEMICONDUCTOR PACKAGE
#2253Semiconductor package having embedded passive elements and method for manufacturing the same
#2254Semiconductor apparatus comprising a semiconductor chip with a power supply circuit and a smoothing circuit disposed outside the semiconductor chip
#2255Wiring board with built-in capacitor
#2256System and apparatus for power distribution for a semiconductor device
#2257Modular heat sink fin modules for CPU
#2258Semiconductor apparatus with decoupling capacitor
#2259IC packages with internal heat dissipation structures
#2260Interposer containing bypass capacitors for reducing voltage noise in an IC device
#2261Printed circuit board and circuit structure for power supply
#2262Semiconductor Device and Method for Manufacturing the Same
#2263Circuit carrier and manufacturing process thereof
#2264Wiring Board and Semiconductor Device
#2265Programming semiconductor dies for pin map compatibility
#2266Method for manufacturing wiring board
#2267Semiconductor package with bypass capacitor
#2268Manufacturing method of multilayer core board
#2269Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
#2270Wiring board
#2271Semiconductor Device, Power Supply Apparatus Using Same, and Electronic Device
#2272Printed circuit board
#2273Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques
#2274Array capacitors with voids to enable a full-grid socket
#2275Hybrid integrated circuit device, and method for fabricating the same, and electronic device
#2276Circuit apparatus and method of fabricating the apparatus
#2277Thermally enhanced BGA package with ground ring
#2278System, method and computer program product for designing connecting terminals of semiconductor device
#2279Inkjet patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same
#2280Multi-port memory device having serial input/output interface
#2281Electronic component package
#2282Isolating electric paths in semiconductor device packages
#2283Chip with power and signal pads connected to power and signal lines on substrate
#2284Semiconductor package and method using isolated Vplane to accommodate high speed circuitry ground isolation
#2285Reducing layer count in semiconductor packages
#2286POWER SUPPLY STRUCTURE FOR HIGH POWER CIRCUIT PACKAGES
#2287CIRCUIT SUBSTRATE
#2288Semiconductor device including a DC-DC converter
#2289Sol-gel and mask patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same
#2290Grounding structure of semiconductor device including a conductive paste
#2291Method and system for stacking integrated circuits
#2292WIRING STRUCTURE, MULTILAYER WIRING BOARD, AND ELECTRONIC DEVICE
#2293Capacitor structure
#2294Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor
#2295Semiconductor device
#2296Semiconductor Device Including a Plurality of Semiconductor Chips Packaged in a Common Housing
#2297Chip carrier with reduced interference signal sensitivity
#2298Semiconductor device having capacitors for reducing power source noise
#2299Thin film capacitor device used for a decoupling capacitor and having a resistor inside
#2300Multilayer printed board, electronic apparatus, and packaging method
#2301Method for designing semiconductor package, system for aiding to design semiconductor package, and computer program product therefor
#2302Wiring configuration for semiconductor component
#2303Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device
#2304Semiconductor component comprising an integrated semiconductor chip and a chip housing, and electronic device
#2305Arrangement of non-signal through vias and wiring board applying the same
#2306Single-chip and multi-chip module for proximity communication
#2307Semiconductor module and method of manufacturing the same
#2308Method to align mask patterns
#2309Interconnect design for reducing radiated emissions
#2310Driver module structure with flexible circuit board
#2311System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices
#2312Customizable power and ground pins
#2313Fabricating substrates having low inductance via arrangements
#2314Composition and method for pre-surgical skin disinfection
#2315Capacitor and manufacturing method thereof
#2316High performance chip carrier substrate
#2317Semiconductor device and manufacturing method of them
#2318Ball grid array
#2319Semiconductor memory card
#2320Package board having internal terminal interconnection and semiconductor package employing the same
#2321GAP CONTROL BETWEEN INTERPOSER AND SUBSTRATE IN ELECTRONIC ASSEMBLIES
#2322Integrated capacitors in package-level structures, processes of making same, and systems containing same
#2323Electronic circuit package
#2324Semiconductor device having a metal plate conductor
#2325Semiconductor chip and semiconductor device
#2326Packaged chip having features for improved signal transmission on the package
#2327Thin-film capacitor and method for fabricating the same, electronic device and circuit board
#2328Semiconductor chip, film substrate, and related semiconductor chip package
#2329Method and power control structure for managing plurality of voltage islands
#2330Thick film capacitors on ceramic interconnect substrates
#2331Semiconductor device and manufacturing method of the same
#2332Package using array capacitor core
#2333High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof
#2334Printed circuit board
#2335Multilayer printed circuit board for high-speed differential signal, communication apparatus, and data storage apparatus
#2336System and method for implementing transformer on package substrate
#2337Semiconductor device
#2338Dielectric lamination structure, manufacturing method of a dielectric lamination structure, and wiring board including a dielectric lamination structure
#2339Semiconductor device
#2340Semiconductor integrated circuit with improved power supply system
#2341Semiconductor device
#2342Semiconductor/printed circuit board assembly, and computer system
#2343Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof
#2344Method and apparatus that provides differential connections with improved ESD protection and routing
#2345PACKAGE STIFFENER
#2346Mounting substrate, manufacturing method of mounting substrate and manufacturing method of semiconductor device
#2347Via array capacitor, wiring board incorporating a via array capacitor, and method of manufacturing the same
#2348Integrated circuit package with improved power signal connection
#2349Semiconductor device having a heat spreader exposed from a seal resin
#2350Integrated passive device system
#2351Semiconductor integrated circuit
#2352Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area
#2353Device having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuitry of an integrated circuit
#2354Packaging for high speed integrated circuits
#2355Reduction of Electromagnetic Interference in Integrated Circuit Device Packages
#2356Interposer and method for fabricating the same
#2357Closed loop thermally enhanced flip chip BGA
#2358Power core devices
#2359Capacitor structure
#2360Method of improving power distribution in wirebond semiconductor packages
#2361Capacitor-built-in substrate and method of manufacturing the same
#2362Semiconductor device
#2363Capacitor interconnection
#2364Printed wiring board and method of suppressing power supply noise thereof
#2365Decoupling capacitor closely coupled with integrated circuit
#2366Thermal expansion compensation graded IC package
#2367Semiconductor device including semiconductor chip with two pad rows
#2368Printed circuit board with differential pair arrangement
#2369Depopulation of a ball grid array to allow via placement
#2370Receiving device
#2371Method for manufacturing semiconductor device, semiconductor device and apparatus comprising same
#2372Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
#2373Decoupling capacitor closely coupled with integrated circuit
#2374Ceramic capacitor
#2375Method for forming component mounting hole in semiconductor substrate
#2376Embedded capacitor device having a common coupling area
#2377Substrate structure and method for wideband power decoupling
#2378Semiconductor device with operation mode set by external resistor
#2379Low height vertical sensor packaging
#2380Semiconductor device package
#2381Semiconductor multi-chip package including two semiconductor memory chips having different memory densities
#2382Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader
#2383Heat sink packaging assembly for electronic components
#2384Wiring board construction including embedded ceramic capacitors(s)
#2385Quad flat pack (QFP) package and flexible power distribution method therefor
#2386Stacked bit line dual word line nonvolatile memory
#2387Structures and methods for a flexible bridge that enables high-bandwidth communication
#2388Two layer substrate ball grid array design
#2389Multi-chip package for reducing parasitic load of pin
#2390Integrated circuit package
#2391Electronic device and carrier substrate
#2392Semiconductor device, laminated semiconductor device, and wiring substrate
#2393Techniques for providing decoupling capacitance
#2394Using rows/columns of micro-vias to create PCB routing channels in BGA interconnect grid (micro-via channels)
#2395Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load
#2396Integral charge storage basement and wideband embedded decoupling structure for integrated circuit
#2397Semiconductor device
#2398SEMICONDUCTOR DEVICE
#2399Multilayer printed wiring board
#2400High speed interface design