BEOL vertical fuse formed over air gap

BEOL vertical fuse formed over air gap

STACKED DEVICE, MANUFACTURING METHOD, AND ELECTRONIC INSTRUMENT

SEMICONDUCTOR MEMORY DEVICE

Semiconductor package

Devices and methods of reducing damage during BEOL M1 integration

Semiconductor device having sub-block stack structures

Word line decoder circuitry under a three-dimensional memory array

Interconnect reliability structures

Kelvin contact assembly and method of installation thereof

Semiconductor device and method for manufacturing semiconductor device

Integrated circuit and computer-implemented method of manufacturing the same

Semiconductor device

Ion flow barrier structure for interconnect metallization

Semiconductor memory device and method of manufacturing the same

Device with interconnection structure for forming a conduction path or a conducting plane with high decoupling capacitance

Methods of forming wiring structures for semiconductor devices

Ion flow barrier structure for interconnect metallization

Multi-tier memory device with through-stack peripheral contact via structures and method of making thereof

Semiconductor device, manufacturing method thereof, solid-state imaging device, and electronic apparatus

Device packaging using a recyclable carrier substrate

Semiconductor storage device

Semiconductor device

Semiconductor structure and associated fabricating method

Method of manufacturing a capacitor

Memory device

Multi-tier replacement memory stack structure integration scheme

Vertical field-effect-transistors having multiple threshold voltages

Method and structure for semiconductor mid-end-of-line (MEOL) process

Patterning approach for improved via landing profile

Novel 3D Integration Method Using SOI Substrates and Structures Produced Thereby

Method for making semiconductor device with stacked analog components in back end of line (BEOL) regions

Semiconductor device with interconnect structure having catalys layer

Semiconductor structure and fabrication method thereof

Self-aligned nanowire formation using double patterning

Method of forming trenches

Alternative ground lines for inter-slot grounding

Apparatus and method to balance the parasitic capacitances between metal tracks on an integrated circuit chip

Semiconductor device, semiconductor wafer, module, electronic device, and manufacturing method thereof

Manufacturing method of semiconductor device and semiconductor device

Non-volatile memory devices including vertical NAND channels and methods of forming the same

SRAM cell and logic cell design

Semiconductor integrated circuit layout structure

Tri-layer CoWoS structure

Interconnect structure having tungsten contact copper wiring

Logic cell including single layer via contact and deep via contact

Semiconductor device and method of producing semiconductor device

Method and apparatus for back end of line semiconductor device processing

Interconnect structure having substractive etch feature and damascene feature

Semiconductor device

Integrated circuit device including vertical memory device and method of manufacturing the same

Interconnection structure and method of forming the same

Self-aligned via and plug patterning for back end of line (BEOL) interconnects

Semiconductor apparatus

Method for forming semiconductor device structure

Three-dimensional memory device containing an aluminum oxide etch stop layer for backside contact structure and method of making thereof

Semiconductor devices and methods of fabricating the same

3D semiconductor device and structure

Implant structure for area reduction

Semiconductor device structure and method for forming the same

Semiconductor device structure and method for forming the same

Cu wiring manufacturing method and Cu wiring manufacturing system

Opening fill process and structures formed thereby

Connection structure for vertical gate all around (VGAA) devices on semiconductor on insulator (SOI) substrate

Three-dimensional semiconductor memory device

Method of manufacturing semiconductor device

Memory circuit having resistive device coupled with supply voltage line

Semiconductor device

Copper contact plugs with barrier layers

Method, apparatus, and system for offset metal power rail for cell design

Method for fabricating semiconductor structures including a high resistivity layer, and related semiconductor structures

Semiconductor device and manufacturing method of the same

Packaged microelectronic elements having blind vias for heat dissipation

Methods and apparatuses to form self-aligned caps

Interlayer dielectric film in semiconductor devices

Monolithic integration of antenna switch and diplexer

Semiconductor device

Monolithic integration techniques for fabricating photodetectors with transistors on same substrate

Integrated structures and methods of forming vertically-stacked memory cells

Semiconductor device and manufacturing method thereof

Anti-fuse one-time programmable (OTP) device

Semiconductor layout structure

3D semiconductor device and structure

Power and ground design for through-silicon via structure

Interconnect structures for assembly of multi-layer semiconductor devices

Power overlay structure and reconstituted semiconductor wafer having wirebonds

Three-dimensional (3D) semiconductor memory devices and methods of manufacturing the same

Semiconductor devices including a through via structure and methods of forming the same

Metholodogy for profile control and capacitance reduction

Wafers having a die region and a scribe-line region adjacent to the die region

Semiconductor structure and manufacturing method thereof

Method of manufacturing porous body, porous body, method of manufacturing device, device, method of manufacturing wiring structure, and wiring structure

Semiconductor device and manufacturing method thereof

Via patterning using multiple photo multiple etch

Implant after through-silicon via (TSV) etch to getter mobile ions

Transistor with field electrode

Vertical semiconductor device

Self aligned active trench contact

Multi-level chip interconnect

Semiconductor device and method

Semiconductor device with graphene encapsulated metal and method therefor

Stacked multilayer structure and manufacturing method thereof

Copper etching integration scheme

Junctionless back end of the line via contact

Electronic device and method for fabricating the same

Semiconductor memory device and method for manufacturing the same

Methods for reducing dual damascene distortion

Integrated circuit having a staggered fishbone power network

Package substrate and method of fabricating the same

Multi-layer semiconductor structure and methods for fabricating multi-layer semiconductor structures

Interconnection structure with sidewall dielectric protection layer

MIMCAP structure in a semiconductor device package

ON-CHIP VARIABLE CAPACITOR WITH GEOMETRIC CROSS-SECTION

Via, trench or contact structure in the metallization, prematallization dielectric or interlevel dielectric layers of an integrated circuit

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor structure and method making the same

Underfill control structures and method

Method for forming conductive structure using polishing process

Method of fine line space resolution lithography for integrated circuit features using double patterning technology

Chemoepitaxy etch trim using a self aligned hard mask for metal line to via

Interconnect structure, interconnect layout structure, and manufacturing method thereof

Integrated circuit having a plurality of conductive segments

Method of forming a semiconductor structure having integrated snubber resistance

Dual-layer dielectric in memory device

Light sensing device and fabricating method thereof

Semiconductor Chip Including Integrated Circuit Defined Within Dynamic Array Section

Memory devices

Memory device with reduced-resistance interconnect

Semiconductor device

Resistance mitigation in physical design

Seal-ring structure for stacking integrated circuits

Adhesive bonding composition and electronic components prepared from the same

Bond structures and the methods of forming the same

Packaging substrate and electronic package having the same

Semiconductor device and method of forming inductor over insulating material filled trench in substrate

METHODS AND DEVICES FOR METAL FILLING PROCESSES

Method for selective re-routing of selected areas in a target layer and in adjacent interconnecting layers of an IC device

Semiconductor device and manufacturing method thereof

Method of forming metal interconnection

Self-aligned via forming to conductive line and related wiring structure

Structure for die probing

Flying and twisted bit line architecture for dual-port static random-access memory (DP SRAM)

Structure for reduced source and drain contact to gate stack capacitance

Structure for reduced source and drain contact to gate stack capacitance

Through-memory-level via structures for a three-dimensional memory device

Through-memory-level via structures for a three-dimensional memory device

Through-memory-level via structures for a three-dimensional memory device

Semiconductor device

Manufacturing method for semiconductor device having hole penetrating stack structure

Semiconductor memory device

Semiconductor device and manufacturing method thereof

Routing for three-dimensional integrated structures

System in package

Vertical interconnects for self shielded system in package (SiP) modules

Plurality of substrates bonded by direct bonding of copper recesses

Composite manganese nitride/low-K dielectric cap

Oxidation resistant barrier metal process for semiconductor devices

Methods of forming metal pad structures over TSVS to reduce shorting of upper metal layers

Increased contact alignment tolerance for direct bonding

Three-dimensional semiconductor device

Through-memory-level via structures for a three-dimensional memory device

VERTICAL MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME

Hybrid subtractive etch/metal fill process for fabricating interconnects

Semiconductor structure and manufacturing method thereof

Electronic component package and method of manufacturing the same

Trench liner for removing impurities in a non-copper trench

Interconnection structure and manufacturing method thereof

Methods and devices for back end of line via formation

Via corner engineering in trench-first dual damascene process

Semiconductor devices

Interlevel airgap dielectric

Capacitive coupled plasma source for sputtering and resputtering

Semiconductor device and method of fabricating the same

Twin memory cell interconnection structure

Static random access memory unit structure

Multilevel via placement with improved yield in dual damascene interconnection

Electromigration test structure for Cu barrier integrity and blech effect evaluations

Magnetically enhanced low temperature-high density plasma-chemical vapor deposition plasma source for depositing diamond and diamond like films

ROM segmented bitline circuit

Integrated circuit having spare circuit cells

Semiconductor memory device and method for manufacturing the same

MULTILAYER FILM INCLUDING A TANTALUM AND TITANIUM ALLOY AS A SCALABLE BARRIER DIFFUSION LAYER FOR COPPER INTERCONNECTS

Structural enhancement of Cu nanowires

Semiconductor device and manufacturing method of the same

Semiconductor package having a variable redistribution layer thickness

Via connection to a partially filled trench

Gate tie-down enablement with inner spacer

Voidless contact metal structures

Semiconductor device interconnect structures formed by metal reflow process

Etch stop in a dep-etch-dep process

Method of manufacturing 3-D semiconductor device

Memory array and method of forming the same

Differential etch of metal oxide blocking dielectric layer for three-dimensional memory devices

Semiconductor device and method of manufacturing semiconductor device having parallel contact holes between adjacent trenches

Semiconductor device and method of manufacturing the same

Electronic component package and electronic device including the same

Interlevel conductor pre-fill utilizing selective barrier deposition

Semiconductor structures for assembly in multi-layer semiconductor devices including at least one semiconductor structure

Interconnect structure and method of forming same

Semiconductor device allowing metal layer routing formed directly under metal pad

Metal line structure and method

Semiconductor devices and methods of forming same

CRACK STOP LAYER IN INTER METAL LAYERS

Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium

Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium

Trench silicide with self-aligned contact vias

Chip-size, double side connection package and method for manufacturing the same

Phase changing on-chip thermal heat sink

Gate tie-down enablement with inner spacer

Method of component partitions on system on chip and device thereof

Semiconductor device

Semiconductor device and method for fabricating the same

Semiconductor device and method of manufacturing the same

3D IC with serial gate MOS device, and method of making the 3D IC

SEMICONDUCTOR DEVICE COMPRISING POWER ELEMENTS IN JUXTAPOSITION ORDER

Semiconductor device having air gap structures and method of fabricating thereof

Electronic device including switching element and semiconductor memory

Integrated circuit package substrate

Heterojunction semiconductor device for reducing parasitic capacitance

Semiconductor module that have multiple paths for heat dissipation

Electronic device and method for fabricating the same

Hybrid subtractive etch/metal fill process for fabricating interconnects

Interconnect structure and methods of making same

Enhanced via fill material and processing for dual damscene integration

Semiconductor device including air spacer

Semiconductor device and manufacturing method thereof

Etchstop layers and capacitors

Split memory cells with unsplit select gates in a three-dimensional memory device

Within array replacement openings for a three-dimensional memory device

Hybrid logic and SRAM contacts

Package structures and methods of forming the same

Three-dimensional semiconductor devices having vertical structures of different lengths

Advanced metallization for damage repair

Advanced metallization for damage repair

SELECTIVE DIFFUSION BARRIER BETWEEN METALS OF AN INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE

Methods of forming a semiconductor device comprising first and second nitride layers

Critical dimension shrink through selective metal growth on metal hardmask sidewalls

Advanced metallization for damage repair

Semiconductor device including a gate electrode and a conductive structure

Conductive paths through dielectric with a high aspect ratio for semiconductor devices

Semiconductor memory device and method of fabricating the same

Semiconductor via structure with lower electrical resistance

Semiconductor structures having low resistance paths throughout a wafer

Method, apparatus, and system for MOL interconnects without titanium liner

Method for fabricating semiconductor structure with passivation sidewall block

Device manufacture and packaging method thereof

Active CMOS sensor array for electrochemical biomolecular detection

Nanosheet MOSFET with full-height air-gap spacer

Semiconductor device and method for manufacturing the same

Gate stack integrated metal resistors

Semiconductor devices for integration with light emitting chips and modules thereof

Method and apparatus for forming backside die planar devices and saw filter

Semiconductor structure and manufacturing method thereof

Method of forming stacked trench contacts and structures formed thereby

Power line layout structure of semiconductor device and method for forming the same

Active atomic reservoir for enhancing electromigration reliability in integrated circuits

Semiconductor device and manufacturing method thereof

Hybrid airgap structure with oxide liner

Enhancing integrated circuit density with active atomic reservoir

Method of manufacturing semiconductor structure comprising plurality of through holes using metal hard mask

Conductively doped polymer pattern placement error compensation layer

Series MIM structures

Method of treating a microelectronic substrate using dilute TMAH

Gate stack integrated metal resistors

MOSFET with asymmetric self-aligned contact

Self-aligned conductive polymer pattern placement error compensation layer

Method for forming conductive structure in semiconductor structure

Multi-barrier deposition for air gap formation

Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath

Non-volatile semiconductor memory device

Vertical memory devices and methods of manufacturing the same

Integrated circuit and semiconductor device

Power rail inbound middle of line (MOL) routing

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Methods of self-forming barrier formation in metal interconnection applications

Chemical direct pattern plating method

Interconnect structure with misaligned metal lines coupled using different interconnect layer

Conductive structure and method of forming the same

Semiconductor device and method of fabricating the same

Board for electronic component package, electronic component package, and method of manufacturing board for electronic component package

Chamferless via structures

Low-profile microdisplay module

Semiconductor device and method for manufacturing the semiconductor device

3D NAND device with five-folded memory stack structure configuration

Stitched devices

Semiconductor package

Connector formation methods and packaged semiconductor devices

Method of fabricating semiconductor structure

System in package

System in package

Package structures and methods of making the same

Semiconductor device

Semiconductor constructions

Integrated circuit structure and method of forming the same

Self-aligned interconnection structure and method

Semiconductor device

Etch stop for airgap protection

Tungsten gates for non-planar transistors