Semiconductor device and method of stacking semiconductor die for system-level ESD protection

Method for manufacturing semiconductor apparatus, method for manufacturing flip-chip type semiconductor apparatus, semiconductor apparatus, and flip-chip type semiconductor apparatus

Semiconductor device and method of forming insulating layers around semiconductor die

Chip embedding package with solderable electric contact

Conductive traces in semiconductor devices and methods of forming same

Method for singulating packaged integrated circuits and resulting structures

Fingerprint sensor device and method

SOLDER BUMPS FORMED ON WAFERS USING PREFORMED SOLDER BALLS WITH DIFFERENT COMPOSITIONS AND SIZES

Connector structure and method of forming same

Semiconductor arrangement and formation thereof

Method of manufacturing printed circuit board

Fingerprint sensor and manufacturing method thereof

Semiconductor device and method of making wafer level chip scale package

Semiconductor devices and processing methods

Semiconductor device

Reliable passivation for integrated circuits

Methods for making multi-die package with bridge layer

Semiconductor device with reduced parasitic drain-gate capacitance and method of manufacturing the same

Packages and methods of forming packages

Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices

Connector structures of integrated circuits

Device with optimized thermal characteristics

Bonding film for signal communication between central chip and peripheral chips and fabricating method thereof

Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area

Semiconductor devices, methods of manufacture thereof, and methods of singulating semiconductor devices

Method of producing optoelectronic component with integrated protection diode

Semiconductor device including built-in crack-arresting film structure

Packaging devices and methods of manufacture thereof

Semiconductor devices and methods of manufacture thereof

Power semiconductor device load terminal

Method for thermo-mechanical stress reduction in semiconductor devices and corresponding device

Semiconductor device processing method for material removal

Fabricating method for wafer-level packaging

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Testing of semiconductor chips with microbumps

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

Structure and method of reinforcing a conductor soldering point of semiconductor device

SEMICONDUCTOR DEVICE

Methods for forming interconnect assemblies with probed bond pads

Method of processing a porous conductive structure in connection to an electronic component on a substrate

Electrical Feedthrough Assembly

Power overlay structure and reconstituted semiconductor wafer having wirebonds

Mechanisms for forming post-passivation interconnect structure

Embedding thin chips in polymer

Wafers having a die region and a scribe-line region adjacent to the die region

Mounted substrate, mounted-substrate production method, and mounted-substrate production device

Semiconductor device and method

Method for self-aligned solder reflow bonding and devices obtained thereof

Semiconductor memory device structure

Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof

Semiconductor structure and manufacturing method thereof

Method of manufacturing a layer structure having partially sealed pores

Semiconductor device and method of manufacturing the same

Method and structure for wafer-level packaging

Chip with I/O pads on peripheries and method making the same

Bond structures and the methods of forming the same

Semiconductor device and semiconductor device manufacturing method

Semiconductor devices having through electrodes and methods of manufacturing the same

Semiconductor package

Flip chip package structure and fabrication process thereof

Semiconductor device with a bump contact on a TSV comprising a cavity and method of producing such a semiconductor device

Semiconductor structure

Self-aligned under bump metal

Method of forming metal pads with openings in integrated circuits including forming a polymer extending into a metal pad

Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip

Capacitor formed on heavily doped substrate

Semiconductor devices and methods of manufacture thereof

Semiconductor device

Method to improve CMP scratch resistance for non planar surfaces

Nanowires for pillar interconnects

Adhesive bonding composition and method of use

Methods of forming connector pad structures, interconnect structures, and structures thereof

Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof

Structure for stacked logic performance improvement

Packaged semiconductor device with internal electrical connections to outer contacts

Coupling inductors in an IC device using interconnecting elements with solder caps and resulting devices

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

Conductive paths through dielectric with a high aspect ratio for semiconductor devices

Semiconductor package including a semiconductor die having redistributed pads

Semiconductor devices for integration with light emitting chips and modules thereof

Metal bump joint structure

Semiconductor chip mounted on a packaging substrate

Post-passivation interconnect structure and method of forming same

Semiconductor device package, electronic device and method of manufacturing electronic devices using wafer level chip scale package technology

Chip packages and methods of manufacture thereof

Package with solder regions aligned to recesses

Seal rings structures in semiconductor device interconnect layers and methods of forming the same

Methods and apparatus of guard rings for wafer-level-packaging

IC die, ultrasound probe, ultrasonic diagnostic system and method

Semiconductor packages with an intermetallic layer

Semiconductor device and method of making a semiconductor device

Coating electronic component

Stacked integrated circuit structure and method of forming

Connector formation methods and packaged semiconductor devices

Electronic device, method for manufacturing the electronic device, and electronic apparatus

Power management application of interconnect substrates

ELECTRONIC COMPONENT

Semiconductor device and semiconductor package

STACKED SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Gallium arsenide devices with copper backside for direct die solder attach

Method for bonding substrates

MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCONDUCTIVE CAPPING LAYER

Wafer-level packaging sensing device and method for forming the same

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

Method of forming package structure with dummy pads for bonding

Semiconductor chip with patterned underbump metallization and polymer film

Integrated fan-out (InFO) package structures and methods of forming same

Semiconductor chip device

Surface finishes for interconnection pads in microelectronic structures

Semiconductor device and method

Trap layer substrate stacking technique to improve performance for RF devices

Semiconductor device and manufacturing method thereof

Semiconductor device

Local semiconductor wafer thinning

Integrated circuit package

Semiconductor structure and manufacturing method thereof

Semiconductor chips including redistribution interconnections and related semiconductor packages

Interconnect structures for fine pitch assembly of semiconductor structures and related techniques

Semiconductor device load terminal

Semiconductor device and manufacturing method thereof

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

Semiconductor device and manufacturing method therefor

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and method of manufacture

Wafer level package (WLP) and method for forming the same

Method for bonding a chip to a wafer

Wafer level package (WLP) ball support using cavity structure

Semiconductor device

Semiconductor device, semiconductor chip, and method of manufacturing semiconductor device

Semiconductor device

Collars for under-bump metal structures and associated systems and methods

Fully molded miniaturized semiconductor module

High speed, high density, low power die interconnect system

Apparatus, system and method for collecting a target material

Semiconductor devices and packages and methods of forming semiconductor device packages

Method for direct integration of memory die to logic die without use of thru silicon vias (TSV)

Air trench in packages incorporating hybrid bonding

Semiconductor package and method of forming the same

Anchored interconnect

Radio frequency integrated circuit module

Semiconductor chip package and method of manufacturing the same

Method of making layered structure with metal layers using resist patterns and electrolytic plating

Power package module of multiple power chips and method of manufacturing power chip unit

Methods of forming multi-die package structures including redistribution layers

Semiconductor packaging and manufacturing method thereof

Method of manufacturing fan-out type wafer level package

Conductive barrier direct hybrid bonding

Semiconductor device assemblies including intermetallic compound interconnect structures

Semiconductor device and method of manufacturing the semiconductor device

Semiconductor device having a conductive via structure

Semiconductor device

Method of manufacturing semiconductor device and semiconductor device

Semiconductor device and method of manufacturing thereof

Electrostatic discharge protection apparatus and process

Bonding pads with thermal pathways

Semiconductor apparatus, method for manufacturing the same, electronic device, and moving body

Three dimensional integrated circuit structure and method of manufacturing the same

Electrically conductive barriers for integrated circuits

Electronic apparatus and method for manufacturing electronic apparatus

Semiconductor device structure and method for forming the same

Method of fabricating chip package with laser

Scheme for connector site spacing and resulting structures

Semiconductor device, manufacturing method thereof, and electronic apparatus

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides

Method of assembly semiconductor device with through-package interconnect

Integrated fan-out package structures with recesses in molding compound

Substrate structure with selective surface finishes for flip chip assembly

Bond pads with differently sized openings

BOND PAD STRUCTURE FOR LOW TEMPERATURE FLIP CHIP BONDING

Semiconductor package having a substrate structure with selective surface finishes

Integrated circuits having copper bonding structures with silicon carbon nitride passivation layers thereon and methods for fabricating same

Semiconductor package and method of forming the same

Methods and structures to repair device warpage

Method of packaging semiconductor devices

Capacitor in post-passivation structures and methods of forming the same

Semiconductor device with insulation layers

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds

Photoresist cleaning composition used in photolithography and a method for treating substrate therewith

Multi-chip package having encapsulation body to replace substrate core

Multi-device package and manufacturing method thereof

Semiconductor device and its manufacturing method

Semiconductor device and a method for manufacturing a semiconductor device

Semiconductor devices and methods of forming thereof

Methods of forming connector pad structures, interconnect structures, and structures thereof

Packaging devices and methods of manufacture thereof

Battery protection package and process of making the same

High speed, high density, low power die interconnect system

Semiconductor device and method comprising redistribution layers

Methods for controlling warpage in packaging

Transistors having offset contacts for reduced off capacitance

3D fanout stacking

Process for producing a structure by assembling at least two elements by direct adhesive bonding

Method of forming a semiconductor device with bump stop structure

CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF

Method and structure for wafer level packaging with large contact area

Masking methods for ALD processes for electrode-based devices

Methods of forming reverse side engineered III-nitride devices

METHOD AND PROCESS FOR EMIB CHIP INTERCONNECTIONS

Self-aligned under bump metal

Method for manufacturing semiconductor device, semiconductor manufacturing apparatus, and wafer lift pin-hole cleaning jig

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

Lead-free soldering method and soldered article

Semiconductor devices having metal bumps with flange

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

Semiconductor device processing method for material removal

Semiconductor package device and manufacturing method thereof

Semiconductor package structure and method of the same

Semiconductor structures including carrier wafers and attached device wafers, and methods of forming such semiconductor structures

FABRICATING PROCESS FOR REDISTRIBUTION LAYER

3DIC stacking device and method of manufacture

Chip package having die structures of different heights and method of forming same

Wafer backside interconnect structure connected to TSVs

Packaging device and method of making the same

Semiconductor device and a method of manufacturing the same

Post-passivation interconnect structure and methods thereof

Under bump metallurgy (UBM) and methods of forming same

Semiconductor device and bump formation process

Stacked semiconductor devices and methods of forming same

Method of fabricating a semiconductor device

Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages

Corrosion resistant aluminum bond pad structure

Semiconductor device with metal structure electrically connected to a conductive structure

Display device and method of manufacturing the same

Termination structure for gallium nitride schottky diode

Low profile integrated circuit (IC) package comprising a plurality of dies

Concentric bump design for the alignment in die stacking

Semiconductor device and manufacturing method thereof

Package structure and method therof

Conductive pillar shaped for solder confinement

Electronic device with periphery contact pads surrounding central contact pads

Semiconductor chip with redundant thru-silicon-vias

Grid array connection device and method

Method of manufacturing wafer level packaging including through encapsulation vias

Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices

Semiconductor-on-insulator with back side heat dissipation

Wafer bonding process and structure

Semiconductor device

Semiconductor package and method of manufacturing thereof

Semiconductor structure having a patterned surface structure and semiconductor chips including such structures

Semiconductor device and manufacturing method of semiconductor device

Method for electrical coupling and electric coupling arrangement

Semiconductor device

Packaging devices and methods of manufacture thereof

Solder metallization stack and methods of formation thereof

Semiconductor device and method for producing semiconductor device

Semiconductor structure having thermal backside core

Semiconductor device, fabrication method for a semiconductor device and electronic apparatus

Semiconductor device, fabrication method for a semiconductor device and electronic apparatus

Semiconductor package assembly with facing active surfaces of first and second semiconductor die and method for forming the same

Semiconductor packaging structure and method

Mechanisms of forming connectors for package on package

Conductive pad structure for hybrid bonding and methods of forming same

Conductive paths through dielectric with a high aspect ratio for semiconductor devices

Substrate structure with array of micrometer scale copper pillar based structures and method for manufacturing same

System, apparatus, and method for embedding a device in a faceup workpiece

Wafer stack protection seal

Methods of packaging semiconductor devices and structures thereof

Semiconductor package and fabrication method thereof

Method for manufacturing semiconductor package structure

Semiconductor device

Conductive connections, structures with such connections, and methods of manufacture

Chip packaging structures

Semiconductor device and method for manufacturing the same

Semiconductor device and method for fabricating the same

MOLDED INSULATOR IN PACKAGE ASSEMBLY

AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING

Fingerprint sensor and manufacturing method thereof

A-staged thermoplastic-polyimide (TPI) adhesive compound and method of use

Reliable device assembly

Semiconductor structure with sacrificial anode and method for forming

Semiconductor structure and manufacturing method thereof

Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping

Method of manufacturing semiconductor device by applying molding layer in substrate groove

Semiconductor die assembly and methods of forming thermal paths

Package on package bonding structure and method for forming the same

Semiconductor device including built-in crack-arresting film structure

Semiconductor device and manufacturing method thereof

Method for permanent connection of two metal surfaces

Semiconductor device and manufacturing method thereof

Semiconductor structure with composite barrier layer under redistribution layer and manufacturing method thereof

Integration of backside heat spreader for thermal management

Chip package and manufacturing method thereof

Semiconductor device with advanced pad structure resistant to plasma damage and metnod for forming same

Devices, systems, and methods for ion trapping

Semiconductor device contact structure having stacked nickel, copper, and tin layers

Method of fabricating semiconductor device having voids between top metal layers of metal interconnects

Processing of thick metal pads

Power MOSFET and manufacturing method thereof

Wafer coating system and method of manufacturing chip package

Semiconductor device and manufacturing method therefor

Chip package and method for fabricating the same

Methods and devices for fabricating and assembling printable semiconductor elements

Semiconductor apparatus, solid state imaging device, imaging apparatus and electronic equipment, and manufacturing method thereof

Process for forming package-on-package structures

SYSTEM IN PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Warpage reduction in structures with electrical circuitry

Die-on-interposer assembly with dam structure and method of manufacturing the same

Au-based solder die attachment semiconductor device and method for manufacturing the same