Method of manufacturing semiconductor device

Component having a through-contact

Semiconductor Package

Semiconductor device

Multi-chip package with pillar connection

Semiconductor device

Semiconductor Structure

Cu pillar bump with non-metal sidewall spacer and metal top cap

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INCREASED CONNECTIVITY AND METHOD OF MANUFACTURE THEREOF

Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor chip

Semiconductor device

Sensor module and method for producing sensor modules

Semiconductor device with stress relaxation during wire-bonding

Chip package

Semiconductor light emitting device

Manufacturing method of semiconductor device

Semiconductor wafer with electrically connected contact and test areas

PACKAGING METHOD OF SEMICONDUCTOR DEVICE

3D semiconductor device

Current control using thermally matched resistors

Method for manufacturing an electronic module and an electronic module

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Chip structure

Manufacturing method of semiconductor device, and mounting structure thereof

Semiconductor wafer structure and multi-chip stack structure

Semiconductor wafer structure and multi-chip stack structure

Semiconductor integrated circuit having a multi-chip structure

IC HAVING DIELECTRIC POLYMERIC COATED PROTRUDING FEATURES HAVING WET ETCHED EXPOSED TIPS

Strength of micro-bump joints

Three dimensional stacked package structure

Reliable metal bumps on top of I/O pads after removal of test probe marks

Method for Fabricating a Semiconductor Chip Package and Semiconductor Chip Package

Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe

Semiconductor chip and semiconductor package with stack chip structure

Semiconductor device with substrate-side exposed device-side electrode and method of fabrication

Semiconductor device and method of manufacturing the same

Sintering silver paste material and method for bonding semiconductor chip

Activation treatments in plating processes

Semiconductor test pad structures

Semiconductor integrated circuit device

Electrical connections for multichip modules

Method for producing chip packages, and chip package produced in this way

Substrate interconnections having different sizes

Integrated circuit and method for fabricating the same

Bump structure and fabrication method thereof

Controlling Solder Bump Profiles by Increasing Heights of Solder Resists

Substrate contact opening

Cu pillar bump with L-shaped non-metal sidewall protection structure

Semiconductor apparatus and semiconductor apparatus unit

Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP

Chip-exposed semiconductor device and its packaging method

Semiconductor device having through silicon via (TSV)

Probe pad on a corner stress relief region in a semiconductor chip

Semiconductor device including external connection pads and test pads

Semiconductor chip, and semiconductor package and system each including the semiconductor chip

Fluorine depleted adhesion layer for metal interconnect structure

WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

COPPER-MANGANESE BONDING STRUCTURE FOR ELECTRONIC PACKAGES

Semiconductor device, method for manufacturing the same, and electronic device

Semiconductor Package

Chip structure and process for forming the same

STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTION JOINTS

Chip package and method for forming the same

Semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

Semiconductor substrate structure and semiconductor device

Method of fabricating bump structure

Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die

Probe pad with indentation

Magnetic attachment structure

Forming interconnect structures using pre-ink-printed sheets

Optical imaging apparatus and methods of making the same

Semiconductor Components Having Conductive Vias With Aligned Back Side Conductors

Wafer level package and methods of fabricating the same

Semiconductor device for preventing crack in pad region and fabricating method thereof

Semiconductor structure and manufacturing method thereof

Bump, method for forming the bump, and method for mounting substrate having the bump thereon

SEMICONDUCTOR DEVICE WITH CONNECTION PADS PROVIDED WITH INSERTS

Chip unit and stack package having the same

Die backside standoff structures for semiconductor devices

Apparatus for applying solder to semiconductor chips using decals with aperatures present therein

Hermetic wafer-to-wafer bonding with electrical interconnection

HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION

Gold-tin etch using combination of halogen plasma and wet etch

Method of manufacturing an electronic component

Isolating wire bonding in integrated electrical components

Substrate having laser sintered underplate

Build-up package for integrated circuit devices, and methods of making same

Wire bond interconnection and method of manufacture thereof

TCE compensation for package substrates for reduced die warpage assembly

Layered chip package and method of manufacturing same

Through-substrate vias with improved connections

Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus

Electronic elements and devices with trench under bond pad feature

Stackable power MOSFET, power MOSFET stack, and process of manufacture

Carbon nanotube circuit component structure

Semiconductor device having trench-isolated element formation region

WAFER LEVEL CHIP SCALE PACKAGE WITH ANNULAR REINFORCEMENT STRUCTURE

Semiconductor chip with post-passivation scheme formed over passivation layer

MICROELECTRONIC ASSEMBLIES HAVING COMPLIANCY

Cu pillar bump with non-metal sidewall protection structure

Circuit board with built-in semiconductor chip and method of manufacturing the same

Isolated wire bond in integrated electrical components

Semiconductor device

Probe pad on a corner stress relief region in a semiconductor chip

Semiconductor device

Preventing breakage of long metal signal conductors on semiconductor substrates

Magnetic intermetallic compound interconnect

Method of forming nanoscale three-dimensional patterns in a porous material

Power switch component having improved temperature distribution

Cu pillar bump with electrolytic metal sidewall protection

Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow process

Integrated circuit including bond wire directly bonded to pad

Wafer-bump structure

THROUGH-SUBSTRATE VIA AND FABRICATION METHOD THEREOF

Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods

Method of manufacturing semiconductor apparatus

STACKED WAFER MANUFACTURING METHOD

Integrated Circuit Package Having Under-Bump Metallization

Conductive feature for semiconductor substrate and method of manufacture

Routing layer for mitigating stress in a semiconductor die

Method for fabricating bump structure without UBM undercut

Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape

Ultra high speed signal transmission/reception

Manufacturing method for electronic devices

Method of forming a micro pin hybrid interconnect array

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Thru silicon enabled die stacking scheme

Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device

METHOD AND APPARATUS FOR FABRICATING INTEGRATED CIRCUIT DEVICE USING SELF-ORGANIZING FUNCTION

Method of manufacturing semiconductor device

Dummy pattern in wafer backside routing

Semiconductor device and method of manufacturing the same

Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress

Bow-balanced 3D chip stacking

Chip package and method for forming the same

Structure and method of forming pillar bumps with controllable shape and size

ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE

Semiconductor package and multichip arrangement having a polymer layer and an encapsulant

Semiconductor device

SEMICONDUCTOR DEVICE

Semiconductor device including coupling ball with layers of aluminum and copper alloys

SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE, AND PORTABLE APPARATUS

Dummy metal design for packaging structures

Radiate under-bump metallization structure for semiconductor devices

Integrated circuit devices having selectively strengthened composite interlayer insulation layers and methods of fabricating the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

LED DIE STRUCTURE AND METHOD FOR MANUFACTURING THE BOTTOM TERMINAL THEREOF

PHOTO-EMISSION SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Semiconductor device, method for manufacturing semiconductor device, apparatus for manufacturing semiconductor device, and method for evaluating semiconductor device

Thermo-compression bonded electrical interconnect structure and method

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method of making semiconductor package having redistribution layer

Die level integrated interconnect decal manufacturing method and apparatus

Electronic device wafer level scale packages and fabrication methods thereof

Chipstack package and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Semiconductor structure and manufacturing method of semiconductor structure

Backside dummy plugs for 3D integration

Electronic device package and fabrication method thereof

Through-wafer interconnects for photoimager and memory wafers

Semiconductor chip with coil element over passivation layer

Manufacturing process and structure of through silicon via

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME

Semiconductor device provided with tin diffusion inhibiting layer, and manufacturing method of the same

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

Semiconductor device and method of manufacturing the same

Integrated circuit system with stress redistribution layer and method of manufacture thereof

Wafer level integrated interconnect decal and manufacturing method thereof

Cu pillar bump with non-metal sidewall protection structure

Semiconductor device

Semiconductor device package having a jumper chip and method of fabricating the same

Integrated circuit packages

Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus

Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus

Semiconductor device and a method of manufacturing the same

Integrated circuit having a semiconductor substrate with barrier layer

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor chip having double bump structure and smart card including the same

Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide

Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same

METHOD OF MANUFACTURNING SEMICONDUCTOR DEVICE

CONTACT STRUCTURE HAVING A COMPLIANT BUMP AND A TESTING AREA AND MANUFACTURING METHOD FOR THE SAME

Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same

Optical cover plate with improved solder mask dam on glass for image sensor package and fabrication method thereof

Electronic device having interconnections, openings, and pads having greater width than the openings

Semiconductor package including a stacking element

Enhanced WLP for superior temp cycling, drop test and high current applications

Under-Bump Metallization Structure for Semiconductor Devices

Image sensor package and fabrication method thereof

Power MOS transistor device and switch apparatus comprising the same

Power MOS transistor device

ROOM TEMPERATURE DIRECT METAL-METAL BONDING

Die stacking with an annular via having a recessed socket

Method of sensing magnitude of current through semiconductor power device

Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces

Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device

Integrated circuit package for semiconductior devices with improved electric resistance and inductance

Electronic circuit device

Methods and devices for fabricating and assembling printable semiconductor elements

ELECTRODE PORTION STRUCTURE

CONNECTING PAD PRODUCING METHOD

INKS AND PASTES FOR SOLAR CELL FABRICATON

Semiconductor device

Method for fabricating circuit component

METHOD FOR FORMING A DOUBLE EMBOSSING STRUCTURE

Chip package and method for fabricating the same

Manufacturing method of a bump structure having a reinforcement member

Semiconductor device with copper wirebond sites and methods of making same

CURRENT SENSOR FOR A SEMICONDUCTOR DEVICE AND SYSTEM

Methods of forming a metal pattern and semiconductor device structure

SEMICONDUCTOR DEVICE HAVING BUCKET-SHAPED UNDER-BUMP METALLIZATION AND METHOD OF FORMING SAME

CHIP PACKAGE

Semiconductor device providing a first electrical conductor and a second electrical conductor in one through hole and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Metal interconnect structure with a side wall spacer that protects an ARC layer and a bond pad from corrosion and method of forming the metal interconnect structure

Method of manufacturing semiconductor device

Method for forming pad in wafer with three-dimensional stacking structure

Circuit component with conductive layer structure

IC die including RDL capture pads with notch having bonding connectors or its UBM pad over the notch

Wirebondless wafer level package with plated bumps and interconnects

Chip structure

Device having wire bond and redistribution layer

Semiconductor device and manufacturing method of the same

Semiconductor device and penetrating electrode testing method

Light-emitting device, light-emitting element and method of manufacturing same

Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates

Method of making a semiconductor device having a conductive particle on an electric pad

Semiconductor device and process for fabricating the same

METAL-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME

Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces

MOS transistor device in common source configuration

Method and apparatus providing integrated circuit having redistribution layer with recessed connectors

Solder alloy and semiconductor device

Wafer level chip scale package without an encapsulated via

Method of improving adhesion of bond pad over pad metallization with a neighboring passivation layer by depositing a palladium layer

Semiconductor chip, electrode structure therefor and method for forming same

Method of fabricating a conductive post on an electrode

Light emitting device and light unit having improved electrode and chip structures with concave/convex shapes

Light emitting diode with metal piles and multi-passivation layers and its manufacturing method

III-nitride power device with solderable front metal

Semiconductor chip with a bonding pad having contact and test areas

Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore

FLIP-CHIP ASSEMBLY WITH ORGANIC CHIP CARRIER HAVING MUSHROOM-PLATED SOLDER RESIST OPENING

Chip package and method for forming the same

Conductive pillar structure for semiconductor substrate and method of manufacture

SEMICONDUCTOR DEVICE, CHIP-ON-CHIP MOUNTING STRUCTURE, METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE CHIP-ON-CHIP MOUNTING STRUCTURE

Semiconductor module, method for fabricating the semiconductor module, and mobile apparatus

Pillar structure having a non-planar surface for semiconductor devices

Package structure

Systems and Methods Providing Arrangements of Vias

Image sensor package with trench insulator and fabrication method thereof

SEMICONDUCTOR DEVICE

Electromigration immune through-substrate vias

WIREBONDING PROCESS

Method and apparatus for interconnect layout in an integrated circuit

Method to form solder deposits on substrates

Solder bump interconnect

Package substrate capable of controlling the degree of warpage

Semiconductor Device and Bump Formation Process

Stress buffer structures in a mounting structure of a semiconductor device

T-shaped post for semiconductor devices

STACK PACKAGE

GAAS INTEGRATED CIRCUIT DEVICE AND METHOD OF ATTACHING SAME

Semiconductor device and method of manufacturing the same

Integrated semiconductor substrate structure using incompatible processes

Semiconductor device structures and electronic devices including same hybrid conductive vias

Method of manufacturing layered chip package

Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip

Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation

Nickel tin bonding system with barrier layer for semiconductor wafers and devices

Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMP

PACKAGING BOARD AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR, AND PORTABLE DEVICE

Stable Gold Bump Solder Connections

Method for manufacturing semiconductor device

Chip packaging with metal frame pin grid array

Semiconductor device and manufacturing method thereof

Semiconductor device

Post passivation interconnection schemes on top of the IC chips

Stacked semiconductor components having conductive interconnects

SEMICONDUCTOR PACKAGE

Semiconductor device having conductive pads and a method of manufacturing the same

3D chip stack having encapsulated chip-in-chip

METHOD OF FORMING AN EM PROTECTED SEMICONDUCTOR DIE

Method of teaching eyepoints for wire bonding and related semiconductor processing operations

Method of manufacturing an interconnect structure for a semiconductor device

CHIP PACKAGE AND FABRICATION METHOD THEREOF

Circuit substrate and display device

Dual Interconnection in Stacked Memory and Controller Module

Method for providing and connecting two contact areas of a semiconductor component or a substrate, and a substrate having two such connected contact areas

Through-silicon via formed with a post passivation interconnect structure

Grid array connection device and method

SEMICONDUCTOR DEVICE

Semiconductor device

Chip package and fabrication method thereof

Solder Pillars in Flip Chip Assembly