Stacked semiconductor device and method

Through-silicon via structures including conductive protective layers

Semiconductor integrated circuit device, mounting structure of semiconductor integrated circuit device, and method for manufacturing semiconductor integrated circuit device

Semiconductor device

INTEGRATED CIRCUIT STRUCTURES AND FABRICATING METHODS THAT USE VOIDS IN THROUGH HOLES AS JOINING INTERFACES

Bond pad for wafer and package for CMOS imager

Method of packaging and interconnection of integrated circuits

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera module

Aluminum bump bonding for fine aluminum wire

Methods of making compliant semiconductor chip packages

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Bond pad structure and method for producing same

Through silicon via layout

Semiconductor device with an improved solder joint

Enhanced reliability for semiconductor devices using dielectric encasement

Combination via and pad structure for improved solder bump electromigration characteristics

Method for forming bumps in substrates with through vias

Semiconductor device with multilayer wiring structure formed within and method of manufacturing the same

Semiconductor chip and semiconductor device

Structures and methods for improving solder bump connections in semiconductor devices

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Through wafer vias and method of making same

Through wafer vias and method of making same

Wafer level semiconductor module and method for manufacturing the same

Capacitor contact formed concurrently with bond pad metallization

Assembling of Electronic Members on IC Chip

Through silicon via and method of fabricating same

Maskless Process for Solder Bump Production

Method and apparatus for forming I/O clusters in integrated circuits

Semiconductor device, through hole having expansion portion and thin insulating film

Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process

SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

Semiconductor device

Solid-state imaging device and method for manufacturing same

Semiconductor device and fabrication method thereof

CIRCUIT CONNECTION STRUCTURE

Copper bonding method

Method of forming support structures for semiconductor devices

METHOD OF FORMING ON-CHIP PASSIVE ELEMENT

Method of manufacturing a stacked semiconductor apparatus

Stacked memory module and system

STRUCTURED SEMICONDUCTOR ELEMENT FOR REDUCING CHARGING EFFECTS

Method of manufacturing a wafer including providing electrical conductors isolated from circuitry

Method and apparatus for improvements in chip manufacture and design

SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP, MANUFACTURING METHODS THEREOF, AND STACK PACKAGE

Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus

Method of forming wiring on a plurality of semiconductor devices from a single metal plate, and a semiconductor construction assembly formed by the method

Semiconductor device and method of manufacturing a semiconductor device

Semiconductor device capable of suppressing warping in a wafer state and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Under bump metallization for on-die capacitor

IC HAVING FLIP CHIP PASSIVE ELEMENT AND DESIGN STRUCTURE

Semiconductor device, manufacturing method and apparatus for the same

Packaging conductive structure and method for forming the same

CONTACT SURROUNDED BY PASSIVATION AND POLYMIDE AND METHOD THEREFOR

Bonding metallurgy for three-dimensional interconnect

FINE PITCH BOND PAD STRUCTURE

Method and system for forming conductive bumping with copper interconnection

Chip mounting

SEMICONDUCTOR DEVICE PACKAGE WITH INSULATOR RING

Adhesive for connection of circuit member and semiconductor device using the same

Semiconductor device

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor package

Method for housing an electronic component in a device package and an electronic component housed in the device package

Light emitting element and method of making the same

Semiconductor light emitting device and semiconductor light emitting device mounted board

Light emitting diode and method of the same

SEMICONDUCTOR CHIP AND SEMICONDUCTOR CHIP STACKED PACKAGE

Manufacturing method of semiconductor device and semiconductor manufacturing apparatus therefor

Programmable capacitor associated with an input/output pad

Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device

Integrated connection arrangements

Semiconductor device and a method of manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electrical device with protruding contact elements and overhang regions over a cavity

Semiconductor package and method for packaging a semiconductor package

Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package

Semiconductor device

Wafer and semiconductor package

Semiconductor device

Integrated conformal shielding method and process using redistributed chip packaging

Semiconductor device

Circuit board and semiconductor device

METHOD OF MANUFACTURING AN INLET MEMBER FOR AN ELECTRONIC TAG

Bond pad structure

Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates

Semiconductor device and method of manufacturing semiconductor device

SOLDER CONTACT

Semiconductor chip passivation structures and methods of making the same

SEMICONDUCTOR DEVICE HAVING AN ANTI-PAD PEELING-OFF STRUCTURE

Electronic device having contact elements with a specified cross section and manufacturing thereof

Apparatuses and methods to enhance passivation and ILD reliability

Method of fabricating stacked wire bonded semiconductor package with low profile bond line

SEMICONDUCTOR WITH TOP-SIDE WRAP-AROUND FLANGE CONTACT

Surface depressions for die-to-die interconnects and associated systems and methods

Standing chip scale package

Mounting structure and mounting method

Semiconductor package using through-electrodes having voids

Chip pad resistant to antenna effect and method

Semiconductor Device and Method of Forming Lateral Power MOSFET with Integrated Schottky Diode on Monolithic Substrate

DEVICE MOUNTING BOARD, SEMICONDUCTOR MODULE, MOBILE DEVICE, AND MANUFACTURING METHOD OF DEVICE MOUNTING BOARD

Method for manufacturing semiconductor device, and method and structure for implementing semiconductor device

Wafer level edge stacking

Semiconductor device

Multi-layer thick metallization structure for a microelectronic device, intergrated circuit containing same, and method of manufacturing an integrated circuit containing same

SEMICONDUCTOR DEVICE HAVING SOLDER BUMPS PROTRUDING BEYOND INSULATING FILMS

Semiconductor package with joint reliability, entangled wires including insulating material

Electrode structure and semiconductor device

High voltage device with constant current source and manufacturing method thereof

Return loss techniques in wirebond packages for high-speed data communications

Method and apparatus for wafer level integration using tapered vias

Circuitry component and method for forming the same

Semiconductor device having copper interconnect for bonding

Injection molded solder ball method

Semiconductor device and method of manufacturing the same

FLIP-CHIP INTERCONNECTION WITH A SMALL PASSIVATION LAYER OPENING

Wafer level package and manufacturing method thereof

Substrate including alignment columnar member and plural protection columnar members, and method of making the same

Semiconductor device and manufacturing method therefor

Semiconductor device and method for manufacturing thereof

IC having voltage regulated integrated Faraday shield

Semiconductor device and method of shielding semiconductor die from inter-device interference

Semiconductor device and method of manufacturing the same

Semiconductor integrated circuit

Semiconductor device and method of manufacturing the same

CONDUCTIVE BUMP, METHOD FOR FORMING THE SAME, AND ELECTRONIC COMPONENT MOUNTING STRUCTURE USING THE SAME

Maskless Process for Solder Bumps Production

METHOD OF FABRICATING SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR WAFER, AND METHOD OF SAWING THE SEMICONDUCTOR WAFER

Structure and Method for Reliable Solder Joints

Bond pad structure located over active circuit structure

FLIP-CHIP INTERCONNECTION WITH FORMED COUPLINGS

Semiconductor device and method for manufacturing the same

Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side ends

High frequency interconnect pad structure

SEMICONDUCTOR DEVICE

MOLDED SEMICONDUCTOR DEVICE

Semiconductor device and manufacturing method therefor

Methods and devices for fabricating and assembling printable semiconductor elements

Transponder and method of producing a transponder

Semiconductor chip and method for fabricating the same

Semiconductor device and a semiconductor device manufacturing method

Low loading pad design for STT MRAM or other short pulse signal transmission

Semiconductor device

Semiconductor device and a method for manufacturing the same

Low Inductance Ball Grid Array Device Having Chip Bumps on Substrate Vias

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME

Wirebondless wafer level package with plated bumps and interconnects

Electronic device package and fabrication method thereof

Electronics device package and fabrication method thereof

Packaging structure and method for fabricating the same

Power semiconductor device

Semiconductor chip package structure

Backend interconnect scheme with middle dielectric layer having improved strength

Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device

CONDUCTIVE STRUCTURE OF A CHIP

Bump with multiple vias for semiconductor package and fabrication method thereof, and semiconductor package utilizing the same

OPTICAL SEMICONDUCTOR DEVICE

Semiconductor chip package assembly with deflection- resistant leadfingers

Semiconductor device and manufacturing method thereof

Image sensor structure and integrated lens module thereof

Anti-reflection structures for CMOS image sensors

Method and apparatus for 3D interconnect

Formation of a through-electrode by inkjet deposition of resin pastes

Method and apparatus for facilitating proximity communication and power delivery

Proximity optical memory module having an electrical-to-optical and optical-to-electrical converter

METHOD OF ATTACHING AN INTEGRATED CIRCUIT CHIP TO A MODULE

Semiconductor chip bump connection apparatus and method

RELIABILITY WCSP LAYOUTS

Pad structure for 3D integrated circuit

IC device having low resistance TSV comprising ground connection

Semiconductor storage device, semiconductor storage device manufacturing method and package resin forming method

Semiconductor component with improved contact pad and method for forming the same

Planar packageless semiconductor structure with via and coplanar contacts

Methods and designs for localized wafer thinning

Pad cushion structure and method of fabrication for Pb-free C4 integrated circuit chip joining

Display device and manufacturing method of the same

Electronic packages

Semiconductor device including offset bonding pad and inspection method therefor

Wire bonding to connect electrodes

Chip-based thermo-stack

Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices

Intermetallic diffusion block device and method of manufacture

Semiconductor device

Semiconductor chip having TSV (through silicon via) and stacked assembly including the chips

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Externally configurable integrated circuits

Thinned image sensor with trench-insulated contact terminals

Method of fabricating isolation structures for CMOS image sensor chip scale packages

Semiconductor laser device and method of fabricating the same

Integrated circuit and method of fabricating the same

Low fabrication cost, fine pitch and high reliability solder bump

Semiconductor device

Wafer level integration package

Die stacking with an annular via having a recessed socket

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor device fabrication method

Semiconductor processing methods

COMPACT PACKAGING FOR POWER AMPLIFIER MODULE

Camera module, method of manufacturing the same, and electronic system having the same

Final via structures for bond pad-solder ball interconnections

Resin composition for sealing light-emitting device and lamp

Flip Chip Interconnection Structure Having Void-Free Fine Pitch and Method Thereof

Integrated circuit system having different-size solder bumps and different-size bonding pads

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Semiconductor device

Curing low-k dielectrics for improving mechanical strength

Light emitting devices having roughened/reflective contacts and methods of fabricating same

SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENTS AND ITS METHOD OF MANUFACTURE

Semiconductor device and manufacturing method of the same

Approach to high temperature wafer processing

Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protective layer

Underbump metallurgy for enhanced electromigration resistance

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method of semiconductor device

Mock bump system for flip chip integrated circuits

Mock bump system for flip chip integrated circuits

System and method of forming a wafer scale package

Flip chip interconnection structure with bump on partial pad and method thereof

Structure for reduction of soft error rates in integrated circuits

Pulse-laser bonding method for through-silicon-via based stacking of electronic components

Method of manufacturing semiconductor device and semiconductor device

Light emitting device

GaN based semiconductor light-emitting device and method for producing same

Acceleration sensor package

Method of forming an interconnect on a semiconductor substrate

Flip chip interconnection system having solder position control mechanism

Wire bonding over active circuits

CONDUCTIVE STRUCTURE OF A CHIP AND METHOD FOR MANUFACTURING THE SAME

Window ball grid array package

IC PACKAGE WITH WIREBOND AND FLIPCHIP INTERCONNECTS ON THE SAME DIE WITH THROUGH WAFER VIA

Wire bond and redistribution layer process

Semiconductor Device Having High-Density Interconnect Array with Core Pillars Formed With OSP Coating

Dual flat non-leaded semiconductor package

Wafer level IC assembly method

Semiconductor device and manufacturing method thereof

Semiconductor device

Flip chip package

Semiconductor package and multi-chip package using the same

Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof

Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrate

SOLDER BUMP, ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT

Semiconductor device

Integrated circuit package system with stacked devices

Semiconductor device and semiconductor device manufacturing method

Semiconductor device having a gate contact on one surface electrically connected to a gate bus on an opposing surface

Method of forming a metal bump on a semiconductor device

Packaging an integrated circuit die using compression molding

Semiconductor integrated circuit device

SEMICONDUCTOR DEVICE INCLUDING A PADDING UNIT

Flip chip semiconductor assembly with variable volume solder bumps

OPTIMIZED PASSIVATION SLOPE FOR SOLDER CONNECTIONS

Autoclave capable chip-scale package

CHIP PACKAGE AND PROCESS THEREOF

SEMICONDUCTOR DEVICE

Semiconductor module

Device comprising electrode pad

High power and high temperature semiconductor power devices protected by non-uniform ballasted sources

METHOD OF PRODUCING ELECTRONIC COMPONENT

Semiconductor device and method for manufacturing the same

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device manufacturing method

Semiconductor interconnect structure with stacked vias separated by signal line and method therefor

Fluorine depleted adhesion layer for metal interconnect structure

Semiconductor device and method of supporting a wafer during backgrinding and reflow of solder bumps

RE-DISTRIBUTION CONDUCTIVE LINE STRUCTURE AND THE METHOD OF FORMING THE SAME

Solder structures including barrier layers with nickel and/or copper

Semiconductor device and manufacturing method thereof

Semiconductor device and a method of manufacturing the same

JOINT RELIABILITY OF SOLDER JOINT BETWEEN Sn-yAg SOLDER AND Ni-P UNDER BUMP METALLIC LAYER BY COBALT ADDITION

Infinitely stackable interconnect device and method

Semiconductor device and method of manufacturing the same

Package system for shielding semiconductor dies from electromagnetic interference

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD AND MOUNTING METHOD THEREOF

Ultrathin integrated circuit and method of manufacturing an ultrathin integrated circuit

SEMICONDUCTOR DEVICE

Semiconductor device and a method of manufacturing the same

Pressure sense die pad layout and method for direct wire bonding to programmable compensation integrated circuit die

SUBSTRATE MODULE, METHOD FOR MANUFACTURING SUBSTRATE MODULE, AND ELECTRONIC DEVICE

Chipstack package and manufacturing method thereof

Semiconductor device and a method of manufacturing the same

Wirebond over post passivation thick metal

FABRICATING LOW COST SOLDER BUMPS ON INTEGRATED CIRCUIT WAFERS

Solder interconnect pads with current spreading layers

Conductive structure for a semiconductor integrated circuit

Electronic parts packaging structure and method of manufacturing the same

SEMICONDUCTOR DEVICE

Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same

Integrated circuit and method

Package structure of compound semiconductor device and fabricating method thereof

GaN based semiconductor light-emitting device and method for producing same

Method of mounting electronic components

Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body

Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method

Semiconductor apparatus having a through-hole interconnection

Semiconductor package and method of making the same

Image sensor having through via

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS