Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing

SOLDER BUMP ON A SEMICONDUCTOR SUBSTRATE

SEMICONDUCTOR CHIP WITH SOLDER BUMP AND METHOD OF FABRICATING THE SAME

Conductor bump method and apparatus

PACKAGING WITH A CONNECTION STRUCTURE

INTEGRATED CIRCUIT WITH INTERCONNECTED FRONTSIDE CONTACT AND BACKSIDE CONTACT

Manufacturing method for interconnection having stress-absorbing layer between the semiconductor substrate and the external connection terminal

Semiconductor device

Method of manufacturing an electronic part mounting structure

Electrical connections for multichip modules

Bond pad stacks for ESD under pad and active under pad bonding

Integrated circuit having a semiconductor substrate with a barrier layer

Crosstalk-free WLCSP structure for high frequency application

Method for fabricating semiconductor device having backside redistribution layers

Method and apparatus for fabricating integrated circuit device using self-organizing function

Under bump metal film comprising a stress relaxation layer and a diffusion-resistant layer

SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR SHIELDING A BOND PAD FROM ELECTRICAL NOISE

Weldable contact and method for the production thereof

Method of manufacturing a semiconductor device having an intermetallic terminal pad and solder junction structure

Test structures for electrically detecting back end of the line failures and methods of making and using the same

Flip-chip package structure, and the substrate and the chip thereof

Three-dimensional die-stacking package structure

Semiconductor device

Bonding pad for preventing pad peeling and method for fabricating the same

Semiconductor device

SEMICONDUCTOR CHIP AND PACKAGE PROCESS FOR THE SAME

SEMICONDUCTOR DEVICE PACKAGE WITH BUMP OVERLYING A POLYMER LAYER

Manufacturing process and structure of through silicon via

Method for connecting an electronic chip to a radiofrequency identification device

Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching

Layout of dummy patterns

Semiconductor device and method for fabricating the same

Semiconductor device suitable for a stacked structure

COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT

Semiconductor device having through electrode and method of fabricating the same

Semiconductor device with pads of enhanced moisture blocking ability

Integrated circuit package system with flex bump

SEMICONDUCTOR PACKAGE

Semiconductor device and manufacturing method therefor

STACK PACKAGE THAT PREVENTS WARPING AND CRACKING OF A WAFER AND SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and method of manufacturing the same

IC chip with finger-like bumps

Build-up-package for integrated circuit devices, and methods of making same

CHIP STACKED STRUCTURE AND METHOD OF FABRICATING THE SAME

Semiconductor package and multi-chip semiconductor package using the same

Semiconductor device and method for manufacturing the same

Semiconductor device including fuse elements and bonding pad

Packaged device and method of manufacturing the same

METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND INTERCONNECT COMPONENT RECOVERY PROCESS

Device and method for fabricating double-sided SOI wafer scale package with optical through via connections

Method of constructing a stacked-die semiconductor structure

LOW-TEMPERATURE RECOVERABLE ELECTRONIC COMPONENT

ELECTRODE STRUCTURE BODY AND METHOD OF FORMING THE SAME, ELECTRONIC COMPONENT, AND MOUNTING SUBSTRATE

Semiconductor device including a stress buffer

Self-aligned wafer or chip structure, and self-aligned stacked structure

Electrical shielding in stacked dies by using conductive die attach adhesive

Metal pad formation method and metal pad structure using the same

THREE-DIMENSIONAL CIRCUITRY FORMED ON INTEGRATED CIRCUIT DEVICE USING TWO-DIMENSIONAL FABRICATION

Method of making a wafer level integration package

ELECTROLYTIC NI PLATING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Power composite integrated semiconductor device and manufacturing method thereof

FACE-TO-FACE BONDED I/O CIRCUIT DIE AND FUNCTIONAL LOGIC CIRCUIT DIE SYSTEM

Under bump metallurgy structure and wafer structure using the same and method of manufacturing wafer structure

Solder bump interconnect for improved mechanical and thermo-mechanical performance

SEMICONDUCTOR PACKAGE STRUCTURES

Electronic structures including barrier layers defining lips

Photoelectric conversion element having a semiconductor and semiconductor device using the same

PROCESS FOR PREPARING A BONDING TYPE SEMICONDUCTOR SUBSTRATE

Thin flash or video recording light using low profile side emitting LED

Semiconductor device

Ubm Pad, Solder Contact and Methods for Creating a Solder Joint

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

BONDING PAD STRUCTURE

Semiconductor device and method of manufacturing semiconductor device

STRUCTURE FOR PREVENTING PAD PEELING

Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same

Circuit arrangement and integrated circuit

Through silicon via dies and packages

Through-silicon via interconnection formed with a cap layer

Contact pad and method of forming a contact pad for an integrated circuit

Structure, method and system for assessing bonding of electrodes in FCB packaging

Electronic system with vertical intermetallic compound

Chip-in-slot interconnect for 3D chip stacks

Integrated circuit package and method for operating and fabricating thereof

Optical device and method for fabricating the same, camera module using optical device, and electronic equipment mounting camera module

Device configuration and method to manufacture trench MOSFET with solderable front metal

Method of fabricating a wafer structure having a pad and a first protection layer and a second protection layer

Front-end processing of nickel plated bond pads

MEMORY DEVICES INCLUDING SEPARATING INSULATING STRUCTURES ON WIRES AND METHODS OF FORMING

SEMICONDUCTOR DEVICE

Method of Manufacturing Electrical Conductors for a Semiconductor Device

Semicondutor device

Enhanced copper posts for wafer level chip scale packaging

Multi-die wafer level packaging

Semiconductor device

Cylindrical bonding structure and method of manufacture

Protection and Connection of Devices Underneath Bondpads

Semiconductor device

Metal interconnect System and Method for Direct Die Attachment

Solid-state element and solid-state element device

Semiconductor chip mounting board with multiple ports

Method of bonding aluminum electrodes of two semiconductor substrates

Post passivation interconnection process and structures

SEMICONDUCTOR DEVICE WITH BONDING PAD SUPPORT STRUCTURE

Semiconductor device and fabrication method thereof

Leadframe with extended pad segments between leads and die pad, and leadframe package using the same

Bonding pad structure disposed in semiconductor device and related method

Image sensing devices and methods for fabricating the same

Solderable top metal for silicon carbide semiconductor devices

METHOD FOR FABRICATING METAL PAD

Downhill Wire Bonding for QFN L - Lead

Semiconductor device and fabrication methods thereof

Semiconductor device packaged into chip size and manufacturing method thereof

Method for adhering semiconductor devices

Monitoring cool-down stress in a flip chip process using monitor solder bump structures

Alignment mark, semiconductor chip including the same, semiconductor package including the chip and methods of fabricating the same

Semiconductor device and method of manufacturing same

Semiconductor device with multilayered metal pattern

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING BOAC/COA

Reliable metal bumps on top of I/O pads after removal of test probe marks

Semiconductor package with under bump metallization aligned with open vias

Chip assembly with interconnection by metal bump

Semiconductor module manufacturing method, semiconductor module, and mobile device

Dimple free gold bump for drive IC

Methods of assembling integrated circuit packages

System-in-package type semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor devices and assemblies including back side redistribution layers in association with through wafer interconnects

Semiconductor device and a method of manufacturing the same

Semiconductor device and manufacturing method thereof

Package structure for integrated circuit device

Methods of packaging a semiconductor die and package formed by the methods

Semiconductor device, semiconductor wafer structure and method for manufacturing the semiconductor wafer structure

Semiconductor device for high frequency

Methods of forming a semiconductor device including a diffusion barrier film

Structure and method for enhancing resistance to fracture of bonding pads

COPPER-METALLIZED INTEGRATED CIRCUITS HAVING ELECTROLESS THICK COPPER BOND PADS

Surface acoustic wave device

Package-in-package using through-hole via die on saw streets

Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor

Semiconductor device and method for manufacturing semiconductor device

Package substrate and its solder pad

Semiconductor Device

SYSTEM FOR IMPLEMENTING HARD-METAL WIRE BONDS

Semiconductor packaging device comprising a semiconductor chip including a MOSFET

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

Adapting short-wavelength LED's for polychromatic, broadband, or “white” emission

Test structures for stacking dies having through-silicon vias

Extended redistribution layers bumped wafer

Adapting short-wavelength LED's for polychromatic, broadband, or “white” emission

LED epiwafer pad manufacturing process & new construction thereof

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Phase change cooled electrical connections for power electronic devices

Semiconductor device and method of manufacturing the same

Semiconductor device and process for fabricating the same

VIA AND SOLDER BALL SHAPES TO MAXIMIZE CHIP OR SILICON CARRIER STRENGTH RELATIVE TO THERMAL OR BENDING LOAD ZERO POINT

Semiconductor device

Semiconductor chip with post-passivation scheme formed over passivation layer

Highly reliable low cost structure for wafer-level ball grid array packaging

WAFER LEVEL PACKAGE AND FABRICATING METHOD THEREOF

Semiconductor device and method for manufacturing the same

Semiconductor device

Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips

Semiconductor device having vertical MOSFET

Light emitting diode

METHOD FOR FORMING BUMPS ON UNDER BUMP METALLURGY

Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus

Semiconductor device and manufacturing method thereof

On chip transformer isolator

Method for fabricating a probing pad of an integrated circuit chip

Integration type semiconductor device and method for manufacturing the same

Semiconductor Device and Method for Fabricating the Same

Low fabrication cost, fine pitch and high reliability solder bump

Semiconductor device and manufacturing method of the same

Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Method of making solder pad

Semiconductor device with improved pads

Semiconductor device and method for manufacturing the same

Light-emitting diode apparatus

Interconnection designs and materials having improved strength and fatigue life

Semiconductor device and process for manufacturing the same

Manufacturing method of a tray, a socket for inspection, and a semiconductor device

Chip package

Electromigration-Resistant Flip-Chip Solder Joints

TOP LAYERS OF METAL FOR INTEGRATED CIRCUITS

UBM structure for strengthening solder bumps

Semiconductor device

Semiconductor Device with Improved Contact Pad and Method for Fabrication Thereof

Electrical interconnect structure and method

Method to create a metal pattern using a damascene-like process

Solder connector structure and method

Interconnect for chip level power distribution

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE WITH BONDING PAD

METHOD FOR FABRICATING CONTACT PADS

Chips having rear contacts connected by through vias to front contacts

Semiconductor device including redistribution line structure and method of fabricating the same

LIGHT EMITTING APPARATUS AND METHOD FOR MANUFACTURING SAME

Semiconductor light-emitting device

Heat cycle-able connection

Method of creating contour structures to highlight inspection region

METHOD OF MAKING SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND

Wafer-level-chip-scale package and method of fabrication

Semiconductor device with electrode pad having probe mark

Semiconductor device having semiconductor structure bodies on upper and lower surfaces thereof, and method of manufacturing the same

Semiconductor device

Semiconductor device

SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND

RECESSED SOLDER SOCKET IN A SEMICONDUCTOR SUBSTRATE

Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof

Semiconductor device

Semiconductor device

SEMICONDUCTOR DEVICE WITH STRENGTHENED PADS

Semiconductor device including an insulating film and insulating pillars and manufacturing method of the semiconductor device

Semiconductor Package and Method for Fabricating the Same

METHOD FOR FORMING CONTACT PADS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor device

Method and apparatus providing integrated circuit having redistribution layer with recessed connectors

Semiconductor device and method of manufacturing the same

THROUGH-ELECTRODE AND SEMICONDUCTOR DEVICE

Composite semiconductor device

Sensor-type semiconductor device and manufacturing method thereof

Semiconductor device comprising circuit substrate with inspection connection pads and manufacturing method thereof

Method of joining electronic package capable of prevention for brittle fracture

Method for producing electrically conductive bushings through non-conductive or semiconductive substrates

Method of wire bonding over active area of a semiconductor circuit

Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD)

Design of BEOL patterns to reduce the stresses on structures below chip bondpads

Integrated circuit device with embedded passive component by flip-chip connection and method for manufacturing the same

SOLDER-BUMPING STRUCTURES PRODUCED BY A SOLDER BUMPING METHOD

Wire-bonded semiconductor component with reinforced inner connection metallization

SEMICONDUCTOR PACKAGE USING WIRES CONSISTING OF Ag OR Ag ALLOY

Stackable semiconductor device and fabrication method thereof

Integrated circuit and method for producing the same

Semiconductor device with Al pad

Flip chip semiconductor device including an unconnected neutralizing electrode

Method of forming solder bump on high topography plated Cu

Semiconductor device and manufacturing method thereof

Copper die bumps with electromigration cap and plated solder

Chip and wafer integration process using vertical connections

SEMICONDUCTOR PACKAGE HAVING WIRE REDISTRIBUTION LAYER AND METHOD OF FABRICATING THE SAME

Integrated cirucit package and method for fabrication thereof

Method for manufacturing electric connections in wafer

Electronic part, method for fabricating electronic part, acceleration sensor, and method for fabricating acceleration sensor

System for fabricating semiconductor components with conductive interconnects

Method of making an interconnect structure

Wirebond structure and method to connect to a microelectronic die

Wire bonding method and related device for high-frequency applications

Method of making reliable wafer level chip scale package semiconductor devices

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Microelectronic substrate including bumping sites with nanostructures

Chip structure with bumps and testing pads

Silicon chip having inclined contact pads and electronic module comprising such a chip

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor package and fabricating method thereof

Semiconductor module with semiconductor chips and method for producing it

Apparatus comprising a device and method for producing it

Power module having stacked flip-chip and method of fabricating the power module

CHIP PACKAGE STRUCTURE

Semiconductor Device and Method of Manufacturing Same, Wiring Board and Method of Manufacturing Same, Semiconductor Package, and Electronic Device

Semiconductor device and method of manufacturing the same

Image sensor module having build-in package cavity and the method of the same

Electronic device, resonator, oscillator and method for manufacturing electronic device

Semiconductor device and manufacturing method of the same

Soldering structure and method using Zn

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns

Semiconductor device with grounding structure

Semiconductor device manufacturing method and semiconductor device

Metallic electrode forming method and semiconductor device having metallic electrode

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Light emitting devices having a roughened reflective bond pad and methods of fabricating light emitting devices having roughened reflective bond pads

Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structures

Conductive ball mounting apparatus and conductive ball mounting method

Designs and methods for conductive bumps

Compression connection for vertical IC packages

Carbon nanotube bond pad structure and method therefor

Semiconductor apparatus and mobile apparatus

Semiconductor device and manufacturing method of the semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device having conductive bumps, metallic layers, covering layers and fabrication method thereof

Planar multi semiconductor chip package and method of manufacturing the same

Nickel tin bonding system with barrier layer for semiconductor wafers and devices

Semiconductor wafer, semiconductor device, and semiconductor device manufacturing method

Method and apparatus for ultra thin wafer backside processing

Methods for fabricating semiconductor components with conductive interconnects

Method for manufacturing semiconductor device, and method and structure for implementing semiconductor device

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Layer sequence and method of manufacturing a layer sequence

Semiconductor memory device and defect remedying method thereof

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POWER CONVERSION APPARATUS INCORPORATING THIS SEMICONDUCTOR DEVICE

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Circuit device, a method for manufacturing a circuit device, and a semiconductor module

Semiconductor integrated circuit device and fabrication method for the same

Semiconductor device including a coupling region which includes layers of aluminum and copper alloys

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION THEREOF