High bandwidth cache-to-processing unit communication in a multiple processor/cache system

Bond pad structure

Method for manufacturing a wafer level package

Wafer level chip scale package and process of manufacture

Semiconductor chip package and method for manufacturing thereof

Semiconductor package and method for making the same

Light emitting diode and method for manufacturing the same

METHOD OF DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, DESIGNING APPARATUS, AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Method for automatically controlling a stationary gas engine

Semiconductor device, method of manufacturing thereof, signal transmission/reception method using such semiconductor device, and tester apparatus

Integrated Circuit, Semiconductor Module and Method for Manufacturing a Semiconductor Module

Semiconductor chip with chip selection structure and stacked semiconductor package having the same

Method for fabricating package structures for optoelectronic devices

Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Post bump and method of forming the same

WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFFICIENCY WITH AN EMF SHIELD AND A METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

High performance system-on-chip inductor using post passivation process

Process for producing semiconductor device and apparatus therefor

Method of forming bonding pad opening

Alignment verification for C4NP solder transfer

Method for processing a base that includes connecting a first base to a second base with an insulating film

Stack package and method for manufacturing the same

Image sensing devices and methods for fabricating the same

Semiconductor structure with solder bumps

Solder contacts and methods of forming same

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Semiconductor component and method for producing the same

Encapsulated imager packaging

Micropad formation for a semiconductor

Method of forming a bump structure using an etching composition for an under bump metallurgy layer

Method for processing a base that includes connecting a first base to a second base

Bonding pad structure and semiconductor device including the bonding pad structure

Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packaging

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor device including electrically conductive bump and method of manufacturing the same

I/O PAD STRUCTURE FOR ENHANCING SOLDER JOINT RELIABILITY IN INTEGRATED CIRCUIT DEVICES

Semiconductor device, circuit board, and electronic instrument

Semiconductor Device

Module with Flat Construction and Method for Placing Components

ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

ESD protection semiconductor device having an insulated-gate field-effect transistor

Method of manufacturing semiconductor device

Forming a 3-D semiconductor die structure with an intermetallic formation

Pad in semicondcutor device and fabricating method thereof

ELECTRICAL BONDING PAD

Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead

Semiconductor device and method of manufacturing the same

WIRE BONDING OF ALUMINUM-FREE METALLIZATION LAYERS BY SURFACE CONDITIONING

Semiconductor device and method of manufacturing the same

Semiconductor chip having conductive member for reducing localized voltage drop

Pass-through 3D interconnect for microelectronic dies and associated systems and methods

Positive photosensitive resin composition, and semiconductor device and display therewith

Semiconductor device and manufacturing method thereof

Semiconductor device and its manufacture

Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device

Semiconductor chip

Forming robust solder interconnect structures by reducing effects of seed layer underetching

Semiconductor device

METHOD OF MANUFACTURING A SEMICONDUCOTOR DEVICE

UNDER BUMP METALLURGY STRUCTURE OF SEMICONDUCTOR DEVICE PACKAGE

Semiconductor chip, method of fabricating the same and semiconductor chip stack package

Semiconductor device employing wafer level chip size package technology

SEMICONDUCTOR MODULE MOUNTING STRUCTURE

METHOD AND LEADFRAME FOR PACKAGING INTEGRATED CIRCUITS

Forming solder balls on substrates

Terminal pad structures and methods of fabricating same

Multi-die wafer level packaging

Sensor module and method for manufacturing a sensor module

CHIP STRUCTURE AND FABRICATION PROCESS THEREOF AND FLIP CHIP PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF

Semiconductor package

Semiconductor device

Bonding pad for anti-peeling property and method for fabricating the same

Thick metal interconnect with metal pad caps at selective sites and process for making the same

Semiconductor package having redistribution layer

Semiconductor die with die pad pattern

Controller chip mounted on a memory chip with re-wiring lines

Semiconductor device and manufacturing method of the same

Method of opening pad in semiconductor device

Electronic device including an inductor

Semiconductor device

Semiconductor component

Thick metal interconnect with metal pad caps at selective sites and process for making the same

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE

Method of forming a crack stop laser fuse with fixed passivation layer coverage

Method of manufacturing flexible semiconductor assemblies

Interconnection element with plated posts formed on mandrel

Wire bonding personalization and discrete component attachment on wirebond pads

SEMICONDUCTOR DEVICE

Flip-chip assembly with organic chip carrier having mushroom-plated solder resist opening

Semiconductor device

Post passivation interconnection schemes on top of the IC chips

SEMICONDUCTOR PACKAGE AND METHOD THEREOF

Semiconductor wafer level interconnect package utilizing conductive ring and pad for separate voltage supplies and method of making the same

SYSTEM IN PACKAGE AND FABRICATION METHOD THEREOF

Semiconductor device

Method of fabricating an interconnection element having conductive posts

LCD Driver IC and Method for Manufacturing the Same

Touch screen system with light reflection

METHOD OF MANUFACTURING A CHIP AND A CHIP STACK

Chip package

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM ALLOY

Substrate for semiconductor package with improved bumping of chip bumps and contact pads and semiconductor package having the same

Soft error rate mitigation by interconnect structure

Warpage resistant semiconductor package and method for manufacturing the same

Dielectric isolation type semiconductor device and manufacturing method therefor

Semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding

Isolating chip-to-chip contact

Manufacturing method for electronic devices

STRUCTURE OF THREE-DIMENSIONAL STACKED DICE WITH VERTICAL ELECTRICAL SELF-INTERCONNECTIONS AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device and semiconductor device

Device and method including a soldering process

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM COPPER ALLOY

INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE, METHOD OF MANFACTURING SAME, AND MICROELECTRONIC STRUCTURE CONTAINING SAME

Protected solder ball joints in wafer level chip-scale packaging

Manufacturing method of redistribution circuit structure

Method for forming an electrical structure comprising multiple photosensitive materials

Undercut-free BLM process for Pb-free and Pb-reduced C4

Semiconductor device

Copper pillar tin bump on semiconductor chip and method of forming the same

Method and System for Providing a Low-Profile Semiconductor Assembly

Semiconductor apparatus including a radiator for diffusing the heat generated therein

Multi-chambered metal electrodeposition system for semiconductor substrates

Method of manufacturing semiconductor device with through hole

Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillar

Semiconductor device with bonding pad

Semiconductor device having through electrode and method of fabricating the same

Flip-chip packaging method for light emitting diode with eutectic layer not overlapping insulating layer

Semiconductor device and a method of manufacturing the same

Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting region

Test structure

Electrostatic discharge (ESD) protection structure

Method of forming an inductor on a semiconductor wafer

Method for micro component self-assembly

Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Back end integrated WLCSP structure without aluminum pads

C4 joint reliability

Mounting structure of electronic component

Electronic component

Integrated circuit package

Electronic component

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Methods for forming connective elements on integrated circuits for packaging applications

Method for manufacturing a semiconductor device

Wafer-level chip scale package and method for fabricating and using the same

Method of manufacturing chip-on-chip semiconductor device

Wafer of circuit board and joining structure of wafer or circuit board

JUNCTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Chip stack package

Stacked semiconductor package and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Chip structure

METAL PAD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING A FINE PITCH BONDPAD

Electrode structure for semiconductor chip with crack suppressing dummy metal patterns

Flip-Chip Interconnect Structure

SELF-ASSEMBLED STRESS RELIEF INTERFACE

Manufacturing Method of an Antistatic Flip Chip Substrate Connected to Several Chips

Design structure incorporating semiconductor device structures that shield a bond pad from electrical noise

Semiconductor chip with coil element over passivation layer

BONDING PAD FOR ANTI-PEELING PROPERTY AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

Patterned Leads For WLCSP And Method For Fabricating The Same

Semiconductor package

Flip chip package structure and carrier thereof

Semiconductor device and method of fabricating semiconductor device

Semiconductor package, module, system having solder ball coupled to chip pad and manufacturing method thereof

Through-silicon vias and methods for forming the same

Inductor formed in an integrated circuit

Method of forming metallic bump and seal for semiconductor device

Integrated circuit package including wire bonds

Layout schemes and apparatus for high performance DC-DC output stage

SEMICONDUCTOR DEVICE AND CIRCUIT DEVICE HAVING THE SAME MOUNTED THEREON

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF THE SAME

Thermally enhanced wafer level package

Solid state imaging device and method for manufacturing same, and solid state imaging module

Wafer structure with a buffer layer

Bond pad design for fine pitch wire bonding

SEMICONDUCTOR DEVICE AND METHOD OF BUMP FORMATION

Stable gold bump solder connections

I/O pad structures for integrated circuit devices

Semiconductor package having a crack-propagation preventing unit

Semiconductor devices

Heat-resistant resin paste and method for producing same

Forming method of electrode and manufacturing method of semiconductor device

Wafer packaging method

Flip chip package with advanced electrical and thermal properties for high current designs

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF

Flash memory device and fabricating method thereof

Semiconductor component comprising copper metallizations

Semiconductor device with copper wirebond sites and methods of making same

Semiconductor device

Methods and Apparatus for Assembling Integrated Circuit Device Utilizing a Thin Si Interposer

Semiconductor device and methods of manufacturing semiconductor devices

Wafer-level image sensor module, method of manufacturing the same, and camera module

Chemical removal of oxide layer from chip pads

Semiconductor device and method of laser-marking wafers with tape applied to its active surface

Comb-shaped power bus bar assembly structure having integrated capacitors

Stackable self-aligning insulative guide tray for holding semiconductor substrates

Local defect memories on semiconductor substrates in a stack computer

Solder bump with inner core pillar in semiconductor package

Stacked dual-die packages, methods of making, and systems incorporating said packages

Preventing breakage of long metal signal conductors on semiconductor substrates

BONDING PAD STRUCTURE ALLOWING WIRE BONDING OVER AN ACTIVE AREA IN A SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING SAME

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Semiconductor package with passivation island for reducing stress on solder bumps

Semiconductor device and method of forming interconnect structure in non-active area of wafer

Method for stacking semiconductor chips

Semiconductor device including electronic component coupled to a backside of a chip

Integrated semiconductor substrate structure using incompatible processes

Semiconductor substrate elastomeric stack

Semiconductor package and method of reducing electromagnetic interference between devices

Semiconductor device

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

Thermo-compression bonded electrical interconnect structure and method

Semiconductor chip package and printed circuit board

Semiconductor device, and manufacturing method of semiconductor device

Bonding method of semiconductor and laminated structure fabricated thereby

Thermo-compression bonded electrical interconnect structure and method

Semiconductor device and method of manufacturing same

Semiconductor mounting bonding wire

Integrated circuit, circuit system, and method of manufacturing

Redistribution layer for wafer-level chip scale package and method therefor

Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes

Structure and method for fabricating flip chip devices

Structurally-enhanced integrated circuit package and method of manufacture

Electronic assemblies providing active side heat pumping

Semiconductor device, electronic component module, and method for manufacturing semiconductor device

PROCESS FOR PRODUCING LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE

Methods for removing contaminants from aluminum-comprising bond pads and integrated circuits therefrom

Semiconductor connection component

Semiconductor device for preventing inflow of high current from an input/output pad and a circuit for preventing inflow of high current thereof

Semiconductor device and method of manufacturing the same

Semiconductor device and methods of manufacturing semiconductor devices

SEMICONDUCTOR PACKAGE WITH REDUCED VOLUME AND SIGNAL TRANSFER PATH

Semiconductor device and producing method of the same

SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING THE SAME

Method for forming bumps on under bump metallurgy

Semiconductor device and manufacturing method of the same

OPTICAL DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor chip with stratified underfill

Flip chip for electrical function test and manufacturing method thereof

MULTIPLE CHIP SEMICONDUCTOR DEVICE

UNDER BUMP METALLIZATION STRUCTURE HAVING A SEED LAYER FOR ELECTROLESS NICKEL DEPOSITION

Semiconductor device and method of manufacturing the same

Nail-shaped pillar for wafer-level chip-scale packaging

Post passivation structure for a semiconductor device and packaging process for same

Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures

Semiconductor apparatus including semiconductor chip with stress material selectively provided in region of wiring layer

Electrode structure in semiconductor device and related technology

Semiconductor device and plural semiconductor elements with suppressed bending

Wafer level packaging of semiconductor chips

Semiconductor device comprising internal and external wiring

Semiconductor device including thermally dissipating dummy pads

Packaging substrate structure with electronic component embedded therein and method for manufacture of the same

CO-PACKAGED HIGH-SIDE AND LOW-SIDE NMOSFETS FOR EFFICIENT DC-DC POWER CONVERSION

Redistribution structures for microfeature workpieces

APPARATUS TO SAW WAFER AND HAVING NOZZLE TO REMOVE BURRS IN SCRIBE LANES, METHOD OF SAWING WAFER, AND SEMICONDUCTOR PACKAGE FABRICATED BY THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Wirebond pad for semiconductor chip or wafer

Semiconductor device and method for manufacturing the same

Flip-chip type semiconductor device

Electronic device and electronic apparatus

Electronic device wafer level scale packages and fabrication methods thereof

Electronic device wafer level scale packges and fabrication methods thereof

Semiconductor device

Semiconductor device

Light emitting device

Method for manufacturing a device having a high aspect ratio via

Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device

Integrated circuit including parylene material layer

Semiconductor chip scale package incorporating through-vias electrically connected to a substrate and other vias that are isolated from the substrate, and method of forming the package

Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producing

SEMICONDUCTOR PACKAGE STRUCTURE AND LEADFRAME THEREOF

Semiconductor chip, method of fabricating the same and stacked package having the same

Method of manufacturing an integrated circuit module

Cascode current sensor for discrete power semiconductor devices

Power semiconductor component with metal contact layer and production method therefor

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body

Image sensor package with trench insulator and fabrication method thereof

Embedded bonding pad for image sensors

INTERCONNECT ASSEMBLIES AND METHODS

Method of manufacturing semiconductor device

Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same

Semiconductor device and method of providing common voltage bus and wire bondable redistribution

STACKING OF INTEGRATED CIRCUITS USING GLASSY METAL BONDING

Semiconductor devices including a through-substrate conductive member with an exposed end and methods of manufacturing such semiconductor devices

Bridge type pad structure of a semiconductor device

Small area, robust silicon via structure and process