207826 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
Method for manufacturing semiconductor device including step of simultaneous formation of plurality of contact openings
#3302Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devices
#3303Packages with metal line crack prevention design
#3304Semiconductor package including a package substrate including staggered bond fingers
#3305Semiconductor package
#3306Semiconductor package including semiconductor chip and capacitor
#3307Field effect transistor and semiconductor device
#3308Power semiconductor device and method of manufacturing the same, and power conversion device
#3309THROUGH-SUBSTRATE CONDUCTOR SUPPORT
#3310Radio frequency modules
#3311Electronics assemblies employing copper in multiple locations
#3312Distributed inductance integrated field effect transistor structure
#3313Semiconductor device
#3314Method for manufacturing electronic device
#3315Half-bridge module for an inverter of an electric drive of an electric vehicle or a hybrid vehicle and an inverter for an electric drive of an electric vehicle or a hybrid vehicle
#3316Multi level radio frequency (RF) integrated circuit components including passive devices
#3317Semiconductor device
#3318Power module
#3319Method for manufacturing leadless semiconductor package with wettable flanks
#3320Multi-chip package with reinforced isolation
#3321Semiconductor device
#3322Semiconductor device and corresponding method of manufacture
#3323Semiconductor device
#3324Power semiconductor module with adhesive filled tapered portion
#3325Methods for producing a 3D semiconductor memory device and structure
#3326Semiconductor apparatus
#3327Semiconductor device and inspection device
#3328Wiring board and semiconductor device
#3329High voltage semiconductor device lead frame and method of fabrication
#3330Adhesive composition, film-like adhesive and production method thereof, and semiconductor package using film-like adhesive and production method thereof
#3331RF circuit module and manufacturing method therefor
#3332Semiconductor device
#3333Semiconductor device and wire bonding method
#3334Wiring structure and semiconductor module
#3335Wire bond damage detector including a detection bond pad over a first and a second connected structures
#3336RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE
#3337Semiconductor module
#3338Semiconductor module
#3339Semiconductor apparatus
#3340Palladium-coated copper bonding wire and method for manufacturing same
#3341Semiconductor package structure with heat sink and method preparing the same
#3342Semiconductor module
#3343Semiconductor module
#3344Semiconductor device
#3345Semiconductor package
#3346Module
#3347Semiconductor storage device
#3348Multiple pixel package structure with buried chip and electronic device using the same
#3349Package structure, package-on-package structure and method of fabricating the same
#3350Semiconductor devices with flexible connector array
#3351Power module with active elements and intermediate electrode that connects conductors
#3352Fluidic flow channel over active surface of a die
#3353SEMICONDCTOR DEVICE PACKAGE THERMAL CONDUIT
#3354Ribbon wire bond
#3355Semiconductor device
#3356Power module package and method of manufacturing the same
#3357Light-emitting element package and light source module
#3358Semiconductor package
#3359Semiconductor packaging method and semiconductor package device
#3360Semiconductor device and manufacturing method thereof
#3361Semiconductor device, receiver and transmitter
#3362Semiconductor package including semiconductor chip having point symmetric chip pads
#3363Semiconductor module
#3364SEMICONDUCTOR DEVICE
#3365Methods for producing a 3D semiconductor memory device and structure
#3366LED package with multiple element light source and encapsulant having curved and/or planar surfaces
#3367Packaged die and RDL with bonding structures therebetween
#3368Optical coupling device and high frequency device
#3369Semiconductor device and method of manufacturing semiconductor device
#3370Memory scaling semiconductor device
#3371Semiconductor package
#3372Low pressure sintering powder
#3373Trench insulated gate bipolar transistor packaging structure and method for manufacturing the trench insulated gate bipolar transistor
#3374Semiconductor device and amplifier having bonding wire and conductive member
#3375Package-on-package (PoP) semiconductor package and electronic system including the same
#3376Semiconductor structure and method for making thereof
#3377Portable light with curved chip-on-board assembly
#3378Power semiconductor module
#3379SEMICONDUCTOR PACKAGES
#3380Integrated circuit and electronic device comprising a plurality of integrated circuits electrically coupled through a synchronization signal
#3381Nickel alloy for semiconductor packaging
#3382Semiconductor package and manufacturing method thereof
#3383Package substrate having power trace pattern and ground trace pattern, and semiconductor package including the same
#3384Electronics unit with integrated metallic pattern
#3385Land structure for semiconductor package and method therefor
#3386Semiconductor device with frame having arms
#33873D semiconductor device and structure with multiple isolation layers
#3388Biometric sensor and device including the same
#3389Support structure for MEMS device with particle filter
#3390Packaged die and assembling method
#3391Semiconductor light emitting device
#3392Semiconductor chip
#3393Semiconductor device
#3394Package with different types of semiconductor dies attached to a flange
#3395Hybrid integrated circuit architecture
#3396Semiconductor device and method of manufacturing the same
#3397Method of manufacturing package-on-package device and bonding apparatus used therein
#3398Redistribution layer (RDL) structure, semiconductor device and manufacturing method thereof
#3399RF amplifiers with series-coupled output bondwire arrays and shunt capacitor bondwire array
#3400Semiconductor package structure
#3401LEAD FRAME AND ASSEMBLY STRUCTURE
#3402Semiconductor device
#3403Semiconductor packages with pass-through clock traces and associated systems and methods
#3404Semiconductor device and manufacturing method of the same
#3405Chip on Package Structure and Method
#3406Semiconductor package and manufacturing method thereof
#3407Power module and method of manufacturing the same, and power conversion apparatus
#3408Semiconductor module
#3409Semiconductor module
#3410Leadframe with delamination resistant feature
#3411Packaging mechanisms for dies with different sizes of connectors
#3412SEMICONDUCTOR DEVICE HAVING STACKED CHIPS
#3413Method for processing an ultra-high density space interconnect lead under light source guidance
#3414Semiconductor packages and manufacturing methods for the same
#3415Semiconductor device and wire bonding method
#3416Electronic package and method for manufacturing the same
#3417Power semiconductor module
#3418INTEGRATED CIRCUIT, AND MOTOR DEVICE INCLUDING THE SAME
#3419Electronic element mounting substrate, electronic device, and electronic module
#3420Semiconductor module
#3421Power supply system and semiconductor package assembly
#3422Semiconductor package
#3423Face-to-face semiconductor device with fan-out porch
#3424Microelectronic packages having a die stack and a device within the footprint of the die stack
#3425HIGH POWER MODULE
#3426Transistor die with output bondpad at the input side of the die, and power amplifiers including such dies
#3427Semiconductor package structure and method for manufacturing the same
#3428Top hat structure for isolation capacitors
#3429Semiconductor assembly
#3430METHOD FOR PRODUCING A HEAT-SPREADING PLATE, HEAT-SPREADING PLATE, METHOD FOR PRODUCING A SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE
#3431Semiconductor device including surface pressure absorbing member for fastening heat sink
#3432Wideband RF power splitters and amplifiers including wideband RF power splitters
#3433Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
#3434High dielectric constant material at locations of high fields
#3435Semiconductor device
#3436High-performance integrated circuit packaging platform compatible with surface mount assembly
#3437Electronic device packaging with galvanic isolation
#3438Packaging of a semiconductor device with dual sealing materials
#3439Semiconductor devices and methods of manufacturing semiconductor devices
#34403D SEMICONDUCTOR DEVICE AND STRUCTURE
#3441Imaging element, method for manufacturing imaging element, and electronic device
#3442Semiconductor devices, semiconductor device packages, electronic systems including same, and related methods
#3443Interposer design in package structures for wire bonding applications
#3444Semiconductor package having chip stack
#3445Power module and method of manufacturing same
#3446Integrated circuit packages to minimize stress on a semiconductor die
#3447Semiconductor device and method for manufacturing the same
#3448Method of manufacturing a semiconductor device having a bond wire or clip bonded to a bonding pad
#3449Package structures and method of forming the same
#3450Centralized placement of command and address swapping in memory devices
#3451Semiconductor devices with package-level configurability
#3452Photorelay
#3453Semiconductor package and method of fabricating the same
#3454Method for fabricating an encapsulated electronic package using a supporting plate
#3455Ground connection for semiconductor device assembly
#3456SECURE SEMICONDUCTOR INTEGRATION
#3457Semiconductor device
#3458Semiconductor device and method for manufacturing semiconductor device
#3459Switch device having a pulldown transistor and a voltage clamp
#3460Semiconductor memory device
#3461CHIP ARRANGEMENTS
#3462Semiconductor module
#3463Semiconductor module
#3464Light emitting device
#3465Radio frequency transmission line with finish plating on conductive layer
#3466Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect
#3467Semiconductor device
#3468Through electrode substrate and semiconductor device
#3469Die carrier package and method of forming same
#3470Method for forming hermetic package for a power semiconductor
#3471Method for processing a 3D integrated circuit and structure
#3472Base member for light emitting device
#3473Semiconductor device and a method of manufacturing thereof
#3474Flat no-leads package, packaged electronic component, printed circuit board and measurement device
#3475Semiconductor module
#3476Electronic device, device package, and method of fabrication
#3477Selectively shielded radio frequency modules
#3478Semiconductor device
#3479Device and Method for UBM/RDL Routing
#3480Semiconductor device having conductive wire with increased attachment angle and method
#3481POWER MODULE AND METHOD FOR MANUFACTURING POWER MODULE
#3482System in a package modifications
#3483Control of under-fill using a film during fabrication for a dual-sided ball grid array package
#3484Method for fabricating electronic package
#3485Integrated ultrasonic transducers
#3486Semiconductor device
#3487Semiconductor device
#3488Multi-chip package and method of providing die-to-die interconnects in same
#3489Semiconductor device having a bonding pad area of a first wiring layer overlaps a bonding pad electrode of a second wiring layer
#3490Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold
#3491ELECTRONIC COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE
#3492Power semiconductor device including press-fit connection terminal
#3493Methods for producing a 3D semiconductor memory device and structure
#34943D semiconductor device and structure with memory
#34953D semiconductor device and structure with memory
#34963D semiconductor device and structure with NAND logic
#34973D semiconductor memory device and structure
#3498Methods for manufacturing a semiconductor device
#3499SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
#3500Semiconductor device and power amplifier module
#3501Stacked-die bulk acoustic wave oscillator package
#3502Packaging photon building blocks with top side connections and interconnect structure
#3503Embedded copper structure for microelectronics package
#3504Semiconductor module and power conversion apparatus
#3505Semiconductor package
#3506Silicon nitride sintered body, silicon nitride substrate, and silicon nitride circuit board
#3507Semiconductor die, semiconductor device and IGBT module
#3508Semiconductor package
#3509CHIP-PACKAGE DEVICE
#3510Semiconductor package
#3511Semiconductor device and power conversion device
#3512Package substrate and method of manufacturing the package substrate, and semiconductor package including the package substrate and method of manufacturing the semiconductor package
#3513Non-insulated power module
#3514SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A HEAT-SINK LEAD FRAME
#3515Discrete decoupling capacitor and integrated circuit chip package including same
#3516Imaging apparatus and camera for reducing of influence of vibration on an image signal subject to photoelectronic conversion
#3517Wire bond capillary design
#3518Semiconductor package and manufacturing method thereof
#3519Power flat no-lead package
#3520SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MODULE INCLUDING THE SAME
#3521Semiconductor package device and method of manufacturing the same
#3522Memory scaling semiconductor device
#3523Memory scaling semiconductor device
#3524Memory scaling semiconductor device
#3525Electronic package and method for fabricating the same
#3526MULTI-ACCESS MEMORY SYSTEM AND A METHOD TO MANUFACTURE THE SYSTEM
#3527Semiconductor device using wires and stacked semiconductor package
#3528ELECTROSTATIC DISCHARGE PROTECTION FOR STACKED-DIE SYSTEM
#3529Semiconductor light emitting device
#3530Semiconductor device having reduced capacitance between source and drain pads
#3531Manufacturing method for semiconductor device
#3532Printed circuit board structure having pads and conductive wire
#3533Semiconductor device
#3534Nanoparticle matrix for backside heat spreading
#3535Power electronics module
#3536INTEGRATED SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME
#3537Semiconductor assemblies using edge stacking and methods of manufacturing the same
#3538Floating die package
#3539Semiconductor package including sheilding cover that covers molded body
#3540Semiconductor package and method of manufacturing the same
#3541Electronic module
#3542Package structure and method of fabricating the same
#3543Semiconductor package with solder standoff
#3544Packaging of a semiconductor device with a plurality of leads
#3545Power module
#3546Electronic package for integrated circuits and related methods
#3547Embedded packaging concepts for integration of ASICs and optical components
#35483D printed semiconductor package
#3549Semiconductor component and method for producing same
#3550Semiconductor Device and Method for Producing a Carrier Element Suitable for a Semiconductor Device
#3551Common source land grid array package
#3552Semiconductor device
#3553Chip package, method of forming a chip package and method of forming an electrical contact
#3554SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#3555Circuit board and semiconductor apparatus
#3556Power semiconductor package having integrated inductor, resistor and capacitor
#3557ELECTRICAL DEVICE WITH TERMINAL NOTCHES AND METHOD FOR MANUFACTURING THE SAME
#3558Signal isolator having enhanced creepage characteristics
#3559Semiconductor device
#3560Power semiconductor module and power conversion apparatus
#3561Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
#3562Electronic device packages and methods for maximizing electrical current to dies and minimizing bond finger size
#3563SEMICONDUCTOR PACKAGE
#3564Semiconductor device
#3565Multi-chip package
#3566Semiconductor device with sealed semiconductor chip
#3567Rod-based substrate with ringed interconnect layers
#3568Reflector markers and systems and methods for identifying and locating them
#3569UV fixing glue for assembly
#3570Transformer-based driver for power switches
#3571Semiconductor device and method of manufacturing semiconductor device
#3572Electronic device having a curved portion between a plurality of conductive portions on a substrate
#3573Stray inductance reduction in packaged semiconductor devices
#3574Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatuses
#3575High-frequency module
#3576Semiconductor apparatus
#3577Semiconductor device
#3578Semiconductor module
#3579Semiconductor device package assemblies and methods of manufacture
#3580Semiconductor device and method of manufacturing semiconductor device
#3581Protection from metal migration on IC packages
#3582Multi-chip package with reduced calibration time and ZQ calibration method thereof
#3583Thermosetting silicone resin composition and die attach material for optical semiconductor device
#3584Imaging device and electronic equipment
#3585Single-package wireless communication device
#3586Light emitting diode package structure
#3587Semiconductor device
#3588LOCKABLE SEMICONDUCTOR DIE, AN ELECTRONIC DEVICE INCLUDING LOCKABLE SEMICONDUCTOR DIES AND METHOD OF PRODUCTION
#3589Semiconductor package including stacked semiconductor chips and method for fabricating the same
#3590Pad design for reliability enhancement in packages
#3591Semiconductor device including a plurality of bonding pads
#3592Interconnect structure fabricated using lithographic and deposition processes
#3593DYNAMIC ASSIGNMENT OF ADDRESSES TO DRIVERS IN A DISPLAY DEVICE
#3594Power line communication in a display device with distributed driver circuits
#3595Display device with single package light emitting diode and driver circuit
#3596LED assembly with omnidirectional light field
#3597Camera device and mobile terminal having same
#3598Power amplifier systems with control interface and bias circuit
#3599INTEGRATED FILTER OPTICAL PACKAGE
#3600Radiation resistant circuit device, pressure transmission device, and nuclear power plant measurement system