207826 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
Semiconductor package
#3602Package-on-package assembly with wire bonds to encapsulation surface
#3603Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the same
#3604Package with integrated multi-tap impedance structure
#3605Semiconductor package and a method for manufacturing the same
#3606Connection structure and method of forming the same
#3607Semiconductor Device
#3608Memory device comprising programmable command-and-address and/or data interfaces
#3609Semiconductor device and power converter
#3610Support structure for MEMS device with particle filter
#3611Methods related to metallization of ceramic substrates for shielding applications
#3612Semiconductor module arrangement
#3613Semiconductor device
#3614Semiconductor package and method of fabricating the same
#3615Package structure and method for fabricating the same
#3616Memory device including circuitry under bond pads
#3617Semiconductor module arrangement with fast switching, reduced losses, and low voltage overshoot and method for operating the same
#3618Semiconductor device and method of manufacturing semiconductor device
#3619Stacking integrated circuits containing serializer and deserializer blocks using through
#3620Package-on-package assembly with wire bond vias
#3621Bond wire array for packaged semiconductor device
#3622Integrated circuit backside metallization
#3623Semiconductor device
#3624Packaging techniques for backside mesh connectivity
#3625SEMICONDUCTOR PACKAGE
#3626PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#3627Semiconductor device
#3628Switching device and electronic circuit
#3629Light-emitting apparatus
#3630Semiconductor device package and method for manufacturing the same
#3631Package with selective corrosion protection of electric connection structure
#3632Semiconductor device
#3633Semiconductor module arrangement
#3634Power inverter module with reduced inductance
#3635Integrated circuit package and method
#3636Leadframe leads having fully plated end faces
#3637Electronic component package
#3638Leads for semiconductor package
#3639O-ring seals for fluid sensing
#3640Electronic apparatus and method of manufacturing electronic apparatus
#3641Method of manufacturing semiconductor integrated circuit
#3642Method of manufacturing semiconductor devices, corresponding device and circuit
#3643MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD FRAME
#3644Micro LED display having multi-color pixel array and method of fabricating the same based on integration with driving circuit thereof
#3645Semiconductor package and method
#3646Lead frames including lead posts in different planes
#3647Lid structure and semiconductor device package including the same
#3648Super-fast transient response (STR) AC/DC converter for high power density charging application
#3649Semiconductor device including contact fingers on opposed surfaces
#3650Stacking structure, package structure and method of fabricating the same
#3651Semiconductor device having an electrical connection between semiconductor chips established by wire bonding, and method for manufacturing the same
#3652Power die package
#3653Semiconductor package including low side field-effect transistors and high side field-effect transistors and method of making the same
#3654Semiconductor device assemblies
#3655Three-dimensional functional integration
#3656Semiconductor package with a cavity in a die pad for reducing voids in the solder
#3657Semiconductor devices and related methods
#3658Integrated multiple-path power amplifier
#3659Method for testing a high voltage transistor with a field plate
#3660Bonded die assembly using a face-to-back oxide bonding and methods for making the same
#3661DISPLAY DEVICE
#3662Systems and methods for powering an integrated circuit having multiple interconnected die
#3663Semiconductor device assemblies including multiple stacks of different semiconductor dies
#3664Packaged transistor devices with input-output isolation and methods of forming packaged transistor devices with input-output isolation
#3665Semiconductor device for improving heat dissipation and mounting structure thereof
#3666SEMICONDUCTOR PACKAGES HAVING HEAT SPREADER
#3667Grounding lids in integrated circuit devices
#3668Electronic device mounting board, electronic package, and electronic module
#3669X-ray system, semiconductor package, and tray having X-ray absorption filter
#3670ELECTRONIC DEVICE
#3671Chip package structure, electronic device and method for preparing a chip package structure
#3672Semiconductor device
#3673Semiconductor device
#3674IC package with multiple dies
#3675Wedge tool, bonding device, and bonding inspection method
#3676Wire bonding structure
#3677Wiring member and semiconductor module including same
#3678Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
#3679Pad design for reliability enhancement in packages
#3680Semiconductor device
#3681Semiconductor device including a switching element in a first element region and a diode element in a second element region
#3682Method and device for controlling operation using temperature deviation in multi-chip package
#3683Chip packages and methods for forming the same
#3684Heat transfer for power modules
#3685Semiconductor module and method for manufacturing same
#3686Laminate and electronic device
#3687Method for manufacturing a semiconductor device having a semiconductor element mounted on a lead frame
#3688Radiofrequency transmission/reception device
#3689Apparatus and method for multi-die interconnection
#3690Semiconductor package with layer structures, antenna layer and electronic component
#3691Semiconductor package structure and a method of manufacturing the same
#3692Semiconductor module
#3693HIGH VOLTAGE DEVICES WITH MULTIPLE POLYIMIDE LAYERS
#3694Semiconductor device
#3695Packaged semiconductor devices for high voltage with die edge protection
#3696Stack package and methods of manufacturing the same
#3697Substrate evaluation chip and substrate evaluation device
#3698Image sensor package
#3699Light-emitting package
#3700Semiconductor package
#3701Reduced-length bond pads for broadband power amplifiers
#3702Leadframe package using selectively pre-plated leadframe
#3703Lead frame and method of fabricating the same
#3704Semiconductor device
#3705Bonding wire for semiconductor device
#3706Modularized power amplifier devices and architectures
#3707Cascode semiconductor device and method of manufacture
#3708Multi-chip modules including stacked semiconductor dice
#3709Batch manufacture of packages by sheet separated into carriers after mounting of electronic components
#3710Semiconductor module and method of manufacturing semiconductor module
#3711Apparatuses and methods for coupling a waveguide structure to an integrated circuit package
#3712Grounding techniques for backside-biased semiconductor dice and related devices, systems and methods
#3713Semiconductor device
#3714Semiconductor device
#3715LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS OF MAKING
#3716Package with lead frame with improved lead design for discrete electrical components and manufacturing the same
#3717Electrically testable integrated circuit packaging
#37183D SEMICONDUCTOR DEVICE AND STRUCTURE
#3719Biometric sensor and device including the same
#3720Electrical coupling assemblies and methods for optoelectronic modules
#3721Image pickup device and electronic apparatus
#3722Semiconductor device
#3723Bond pad structure for bonding improvement
#3724Method of manufacturing semiconductor device
#3725Multi-chip package and method of providing die-to-die interconnects in same
#3726Through-hole electrode substrate
#3727Packaging for lateral high voltage GaN power devices
#3728Power semiconductor device and method of manufacturing the same
#3729Composite media protection for pressure sensor
#3730Power semiconductor module arrangement
#3731Power semiconductor module arrangement and method for producing the same
#3732Semiconductor device structure with magnetic element
#3733Image sensor package including reflector
#3734Electronic power module
#3735Semiconductor package
#3736Gold-coated silver bonding wire and manufacturing method thereof, and semiconductor device and manufacturing method thereof
#3737Package-on-package structure
#3738Semiconductor apparatus and equipment
#3739Die over mold stacked semiconductor package
#3740Switch module
#3741Wiring structure and method for manufacturing the same
#3742Semiconductor device and fabrication method of the semiconductor device
#3743Semiconductor device and method of manufacturing the same
#3744Semiconductor device with bond pad extensions formed on molded appendage
#3745Semiconductor package and fabrication method thereof
#3746Lead frames for semiconductor packages
#3747Porous barrier layer for improving reliability of through-substrate via structures and methods of forming the same
#3748POWER CONVERSION DEVICE
#3749Chip on film package and display apparatus having ihe same
#3750Magnetic-field sensor package with integrated passive component
#3751Camera module optical system
#3752Display device and manufacturing method thereof
#3753Photosensitive module
#3754Multi-chip packaging structure for an image sensor
#3755Photosensitive module
#3756Bonded die assembly using a face-to-back oxide bonding and methods for making the same
#3757Semiconductor device
#3758Chip packages and methods for forming the same
#3759Device isolators
#37603D SEMICONDUCTOR DEVICE AND STRUCTURE
#3761Method of adjusting optical system
#3762Optical member driving mechanism
#3763Optical system
#3764Power amplifier packages and systems incorporating design-flexible package platforms
#3765Receiver optical module and process of assembling the same
#3766Semiconductor device and method for manufacturing semiconductor device
#3767Wafer-level bonding of obstructive elements
#3768Protective elements for bonded structures
#3769Semiconductor package
#3770Semiconductor device and method of manufacturing the same
#3771Quad package with conductive clips connected to terminals at upper surface of semiconductor die
#3772Optical fingerprint identification apparatus and electronic device
#3773MAGNETIC SENSOR MODULE
#3774LS grid core LED connector system and manufacturing method
#3775Semiconductor substrate with integrated inductive component
#3776Memory devices with controllers under memory packages and associated systems and methods
#3777Semiconductor device, power conversion apparatus, and method for manufacturing semiconductor device
#3778Nanowire interfaces
#3779Nanowires plated on nanoparticles
#3780Semiconductor chip
#3781Dual-sided radio-frequency package with overmold structure
#3782Cavity wall structure for semiconductor packaging
#3783Semiconductor package structure on a PCB and semiconductor module including the same
#3784Power semiconductor module arrangement having a base plate and a contact element
#3785Semiconductor light emitting device
#3786Method for manufacturing semiconductor device
#3787Device for mounting semiconductor element, lead frame, and substrate for mounting semiconductor element
#3788Substrate for mounting semiconductor element
#3789Semiconductor devices and methods of making the same
#3790Semiconductor device with metal die attach to substrate with multi-size cavity
#3791Centralized placement of command and address swapping in memory devices
#3792Electronic device and corresponding manufacturing method
#3793Light-emitting device packages
#3794LIGHT-EMITTING DEVICE PACKAGE AND LIGHTING MODULE
#3795Semiconductor package and method of fabricating the same
#3796Method of manufacturing package unit, package unit, electronic module, and equipment
#3797Contoured package-on-package joint
#3798Package structure
#3799Semiconductor device
#3800Semiconductor Device and Method of Manufacturing Semiconductor Device
#3801Substrate for mounting semiconductor element
#3802Lead frame
#3803Lead frame
#3804Multi-chip package with high thermal conductivity die attach
#3805Discrete power transistor package having solderless DBC to leadframe attach
#3806Non-vertical through-via in package
#3807Semiconductor assembly and deterioration detection method
#3808Housing via for semiconductor current sensor
#3809LED light bulb
#3810Integrated Circuit Package Including Miniature Antenna
#3811Fully symmetrical laterally coupled transformer for signal and power isolation
#3812Semiconductor device and manufacturing method, and electronic appliance
#3813Semiconductor device
#3814Package-on-package (PoP) semiconductor package and electronic system including the same
#3815Package structure and method of manufacturing the same
#3816Semiconductor device and method for manufacturing semiconductor device
#3817Method for the manufacture of integrated devices including a die fixed to a leadframe
#3818Method and apparatus for heat sinking high frequency IC with absorbing material
#3819Chip package and manufacturing method thereof
#3820Semiconductor device
#3821Semiconductor device
#3822Lead Frame Stabilizer for Improved Lead Planarity
#3823PACKAGE STRUCTURE AND COMMUNICATIONS DEVICE
#3824Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units
#3825Sensor package and manufacturing method thereof
#3826Light emitting device
#3827Lighting device with high flexibility in connecting electrical components
#3828Three-dimensional device with bonded structures including a support die and methods of making the same
#3829Power semiconductor module and power conversion device
#3830Stack packages including a hybrid wire bonding structure
#3831Systems and methods for powering an integrated circuit having multiple interconnected die
#3832Formation of bonding wire vertical interconnects
#3833SEMICONDUCTOR DEVICE WITH ELECTROPLATED COPPER STRUCTURES
#3834Semiconductor device
#3835ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY
#3836Semiconductor arrangement having a circuit board with a patterned metallization layer
#3837Integrated circuit package with pre-wetted contact sidewall surfaces
#3838Semiconductor device
#3839Illumination device
#3840Semiconductor packages and methods of forming the same
#3841Stacked semiconductor die assemblies with die support members and associated systems and methods
#3842Radio frequency modules
#3843Field effect transistor and semiconductor device
#3844Electrical device terminal finishing
#3845High-frequency amplifier
#3846Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
#3847OPTOELECTRONIC MODULE AND DISPLAY ELEMENT
#3848Embedded semiconductive chips in reconstituted wafers, and systems containing same
#3849Switching power supply module and packaging method thereof
#3850Display device
#3851Microphone package structure
#3852Bonded assembly containing multiple memory dies sharing peripheral circuitry on a support die and methods for making the same
#3853Die stack assembly using an edge separation structure for connectivity through a die of the stack
#3854Semiconductor package including plurality of semiconductor chips on common connection structure
#3855Method for fabricating an electronic module via compression molding
#3856Hermetic package for power semiconductor
#3857Multi-die package with bridge layer
#3858Isolator integrated circuits with package structure cavity and fabrication methods
#3859Stacked integrated circuits with redistribution lines
#3860Semiconductor device and manufacturing method of semiconductor device
#3861Power conversion device for reducing an inductance difference between control signal wires of a power semiconductor and suppressing a current unbalancing of the control signals
#3862Method for fabricating an electronic device comprising forming an infused adhesive and a periperal ring
#3863Method for manufacturing semiconductor package structure
#3864Methods related to shielded module having compression overmold
#3865Semiconductor package having a filled conductive cavity
#3866Conductive trace design for smart card
#3867Semiconductor with integrated electrically conductive cooling channels
#3868Semiconductor package having routable encapsulated conductive substrate and method
#3869Data acquisition system-in-package
#3870Antenna device and communication device
#3871Manufacturing method of sensor chip package structure
#3872COMPOUND SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR COMPOUND SEMICONDUCTOR DEVICE, AND AMPLIFIER
#3873OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES
#3874Package structure and manufacturing method thereof
#3875Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
#3876Integrated circuit packaging
#3877Preformed lead frame and lead frame package made from the same
#3878Power module and motor drive circuit
#3879Semiconductor device with semiconductor element and electrodes on different surfaces
#3880Package and semiconductor device
#3881Raised via for terminal connections on different planes
#3882Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#3883Semiconductor package with EMI shield and fabricating method thereof
#3884PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUCH ASSEMBLIES
#3885Electronic module
#3886Semiconductor device package and a method of manufacturing the same
#3887Anisotropic conductive film (ACF) for use in testing semiconductor packages
#3888Package-on-package structure
#3889Bonding process with rotating bonding stage
#3890Semiconductor device
#3891Semiconductor device
#3892Semiconductor device having an oscillator and an associated integrated circuit
#3893Leadframe in packages of integrated circuits
#3894Semiconductor package device and method of manufacturing the same
#3895Semiconductor chip package having optical interface
#3896Current sensor device with a routable molded lead frame
#3897Apparatus related to conformal coating implemented with surface mount devices
#3898Method of fabricating a plurality of linear arrays with submicron y-axis alignment
#3899System in package with interconnected modules
#3900Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device