207826 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
FOWBCSP CHIP MODULE WITH PACKAGING STRUCTURE AND MANUFACTURING METHOD OF THE SAME
#3902Microelectronic device having protected connections and manufacturing process thereof
#3903FOWBCSP CHIP MODULE WITH PACKAGING STRUCTURE AND MANUFACTURING METHOD OF THE SAME
#3904Semiconductor device and a method of manufacturing thereof
#3905Semiconductor device, high-frequency power amplifier, and method of manufacturing semiconductor device
#3906Current flow between a plurality of semiconductor chips
#3907Semiconductor package substrate and method for manufacturing same
#3908Substrates for semiconductor packages
#3909Packages with through-vias having tapered ends
#3910Lighting device for frequency-modulated emission
#3911WIRELESS IMPLANTABLE SENSING DEVICES
#3912Semiconductor package
#3913MEMORY DEVICE PACKAGE WITH NOISE SHIELDING
#3914Electronic device, connection body, and manufacturing method for electronic device
#3915Methods of forming power electronic assemblies using metal inverse opals and cap structures
#3916Semiconductor package
#3917Power module and method for fabricating the same, and power conversion device
#3918Inductively-coupled MEMS resonators
#3919Method for fabricating electronic package
#3920Semiconductor packages with pass-through clock traces and associated systems and methods
#3921Semiconductor Package
#3922Radio-frequency module and communication device
#3923Packaged semiconductor device with electroplated pillars
#3924Semiconductor structure and manufacturing method thereof
#3925Transformer guard trace
#3926High voltage semiconductor device lead frame and method of fabrication
#3927Packaged electronic device with suspended magnetic subassembly
#3928Surface-mount integrated circuit package with coated surfaces for improved solder connection
#3929Surface-mount integrated circuit package with coated surfaces for improved solder connection
#3930Leadframe die pad with partially-etched groove between through-hole slots
#3931Internally-shielded microelectronic packages and methods for the fabrication thereof
#3932METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER INSULATING FILMS HAVING DIFFERENT YOUNG'S MODULUS
#3933Semiconductor package with liquid metal conductors
#39343D printed semiconductor package
#3935Data acquisition system-in-package
#3936High power radio frequency amplifiers and methods of manufacture thereof
#3937High power radio frequency amplifiers and methods of manufacture thereof
#3938Abstracted NAND logic in stacks
#3939SEMICONDUCTOR MODULE
#3940Integrated circuit backside metallization
#3941Amplifiers and amplifier modules with ground plane height variation structures
#3942Package structure and manufacturing method thereof
#3943LOW COST RELIABLE FAN-OUT CHIP SCALE PACKAGES
#3944Semiconductor with external electrode
#3945Multi-die module with substrate cavity assembly
#3946Multirow gull-wing package for microelectronic devices
#3947BIOMETRIC SENSOR AND DEVICE INCLUDING THE SAME
#3948Pressure-sensor assembly having a carrier substrate
#3949Tableted epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the same
#3950Semiconductor device and power conversion device
#3951Method of manufacturing a semiconductor package
#3952High voltage semiconductor devices having improved electric field suppression
#3953Semiconductor package
#3954Power semiconductor module for improved heat dissipation and power density, and method for manufacturing the same
#3955Package and terminal arrangement for semiconductor module
#3956Compact leadframe package
#3957Semiconductor package having a semiconductor die on a plated conductive layer
#3958Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure
#3959Power semiconductor device with first and second sealing resins of different coefficient of thermal expansion
#3960Semiconductor package with elastic coupler and related methods
#3961Integrally-formed multiple-path power amplifier with on-die combining node structure
#3962Power amplifier with integrated bias circuit having multi-point input
#3963Light emitting device
#3964Semiconductor module and power conversion device
#3965Semiconductor device and method of manufacturing thereof
#3966Integrated device packages with passive device assemblies
#3967Package on antenna package
#3968Sensor
#3969Packaged semiconductor system having unidirectional connections to discrete components
#3970Connection structure and method of forming the same
#3971Semiconductor device manufacturing method and semiconductor device
#3972Semiconductor package having sealant bridge
#3973Stacked die cavity package
#3974Semiconductor device and manufacturing method for semiconductor device
#3975Semiconductor device and power amplifier module
#3976Semiconductor arrangement
#3977Three-dimensional package structure
#3978SEMICONDUCTOR APPARATUS
#3979Method and device for controlling operation using temperature deviation in multi-chip package
#3980STACKED EMBEDDED PASSIVE SUBSTRATE STRUCTURE
#3981Package comprising chip contact element of two different electrically conductive materials
#3982Packaged transistor devices with input-output isolation and methods of forming packaged transistor devices with input-output isolation
#3983Isolation cavities in semiconductor devices
#3984Waver-level packaging based module and method for producing the same
#3985INTEGRATED CIRCUIT PACKAGE WITH LEAD LOCK
#3986Printed circuit board and semiconductor package
#3987Radiation-hardened package for an electronic device
#3988Printed components on substrate posts
#3989Stack frame for electrical connections and the method to fabricate thereof
#3990OPTICAL COMPONENT AND OPTICAL MODULE USING THE SAME
#3991Reflector markers and systems and methods for identifying and locating them
#3992Terahertz element and semiconductor device
#3993Package-on-package assembly with wire bonds to encapsulation surface
#3994RF power amplifier pallet
#3995Radio-frequency isolation using backside cavities
#3996SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
#3997Semiconductor device and electronic device
#3998Integrated circuit and electronic circuit comprising the same
#3999MULTI-CHIP MODULE INCLUDING STANDALONE CAPACITORS
#4000INTEGRATED CIRCUIT CHIP PACKAGING
#4001INTEGRATED CIRCUIT CHIP PACKAGING
#4002Semiconductor devices and methods of forming same
#4003Ribbon bond solution for reducing thermal stress on an intermittently operable chipset controlling RF application for cooking
#4004Antenna package and method of manufacturing the same
#4005LED filament and LED light bulb
#4006Photocoupler
#4007Trench capacitor with warpage reduction
#4008Image capturing assembly and packaging method thereof, lens module, and electronic device
#4009Method and device for establishing a wire connection as well as a component arrangement having a wire connection
#4010DEVICES RELATED TO SHIELDED RADIO-FREQUENCY MODULES HAVING REDUCED AREA
#4011Methods and modules related to shielded lead frame packages
#4012Package module
#4013SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#4014Parallel electrode combination, power module and power module group
#4015Packaged semiconductor device with multilayer stress buffer
#4016Semiconductor package device and method of manufacturing the same
#4017Stacked-die bulk acoustic wave oscillator package
#4018Semiconductor devices with package-level configurability
#4019Semiconductor device and manufacturing method of the same
#4020Method thereof of package structure
#4021Apparatus and method for multi-die interconnection
#4022ELECTRONIC DEVICE INCLUDING AN ELECTRONIC CHIP AND AN ANTENNA
#4023Through-hole electrode substrate
#4024Semiconductor package including organic interposer
#4025Semiconductor device and method for producing the semiconductor device
#4026Thin-film type package
#4027Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereof
#4028Package-integrated vertical capacitors and methods of assembling same
#4029IMAGING APPARATUS AND METHOD OF MANUFACTURING IMAGING APPARATUS
#4030Semiconductor device
#4031SEMICONDUCTOR PACKAGE
#4032Integrated circuit package assembly
#4033Semiconductor device having stacked chips
#4034Semiconductor device
#4035Dummy structure of stacked and bonded semiconductor device
#4036Semiconductor structure and manufacturing method thereof
#4037Power semiconductor module with dimples in metallization layer below foot of terminal
#4038Scalable semiconductor interposer integration
#4039Method for fabricating carrier-free semiconductor package
#4040OPTICAL TRNSCEIVER HAVING HEAT DISSIPATION
#4041Method of manufacturing semiconductor module and semiconductor module
#4042Semiconductor device
#4043Bonding pad layer system, gas sensor and method for manufacturing a gas sensor
#4044Encapsulating a bonded wire with low profile encapsulation
#4045Oscillator, electronic apparatus and vehicle
#4046Optical device
#4047Semiconductor package and method of manufacturing semiconductor package
#4048Integrated Circuit Chip Carrier with In-Plane Thermal Conductance Layer
#4049Three-layer package-on-package structure and method forming same
#4050Semiconductor device and method of manufacturing the same
#4051Power electronic assemblies with high purity aluminum plated substrates
#4052IC PACKAGE
#4053DIE ISOLATION ON A SUBSTRATE
#4054Leadframe and leadframe package
#4055Semiconductor package having die pad with cooling fins
#4056Semiconductor device
#4057Circuit board and packaged chip
#4058Die carrier package and method of forming same
#4059Additive deposition low temperature curable magnetic interconnecting layer for power components integration
#4060Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
#4061Semiconductor device having case to which circuit board is bonded by bonding material and method of manafacturing thereof
#4062Electronic assemblies having a mesh bond material and methods of forming thereof
#4063Manufacturing process for separating logic and memory array
#4064FAN-OUT SEMICONDUCTOR PACKAGE
#4065Manufacturing method of package structure
#4066Circuit board, molded photosensitive assembly and manufacturing method therefor, photographing module, and electronic device
#4067Semiconductor device including stack structures having gate pads with different thicknesses
#4068SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
#4069Stacking integrated circuits containing serializer and deserializer blocks using through via
#4070Dual head capillary design for vertical wire bond
#4071Package structure and method of forming the same
#4072Amplifier
#4073Wire bond wires for interference shielding
#4074Semiconductor package design for solder joint reliability
#4075Fan-out package structure and method of manufacturing the same
#4076Manufacturing method of semiconductor device and semiconductor device
#4077Method for stress reduction in semiconductor package via carrier
#4078Single-package wireless communication device
#4079Electronic device and image capture method
#4080Semiconductor device
#4081Semiconductor device, semiconductor component and method of fabricating a semiconductor device
#4082SEMICONDUCTOR DEVICE
#4083Wiring board
#4084Sensor package substrate and sensor module having the same
#4085Stacked semiconductor die assemblies with support members and associated systems and methods
#4086Semiconductor device and method for manufacturing semiconductor device
#4087Mechanisms for forming bonding structures
#4088Methods of forming connector pad structures, interconnect structures, and structures thereof
#4089Semiconductor package
#4090Semiconductor device with die-skipping wire bonds
#4091Semiconductor assembly with package on package structure and electronic device including the same
#4092Method of manufacturing semiconductor device
#4093Semiconductor device having a conductor plate and semiconductor elements
#4094Lead frame and method of manufacturing lead frame
#4095Electronic component-incorporating substrate
#4096Optical image capturing module
#4097Measurement device comprising a suspended semiconductor wire
#4098Optical transmission device, method for manufacturing same, and optical transmission module
#4099Semiconductor device
#4100Light-emitting package
#4101Alignment mark design for packages
#4102Pad structure design in fan-out package
#4103Semiconductor device and method of manufacturing the same
#4104Semiconductor device
#4105SEMICONDUCTOR PACKAGE USING HIGH POWER AND HIGH FREQUENCY AND METHOD OF MANUFACTURING SAME
#4106Semiconductor device and method of manufacturing semiconductor device
#4107Method and apparatus for bond wire testing in an integrated circuit
#4108Semiconductor device and method for manufacturing the same
#4109Method of Manufacturing a Multi-Chip Semiconductor Power Device
#4110Semiconductor memory and manufacturing method thereof
#4111Impedance controlled electrical interconnection employing meta-materials
#4112Electronic device comprising heat pipe contacting a cover structure for heat dissipation
#4113Package substrate and manufacturing method having a mesh gas-permeable structure disposed in the through hole
#4114FLEXIBLE PACKAGE
#4115Device with out-plane inductors
#4116High frequency amplifier
#4117Structure and formation method of semiconductor device with magnetic element
#4118Semiconductor package assembly and method for forming the same
#4119INTERCONNECTS FOR A MULTI-DIE PACKAGE
#4120Semiconductor device
#4121WELDING APPARATUS AND METHOD OF MANUFACTURING WELDED BODY
#4122Electronic device mounting board, electronic package, and electronic module
#4123Multi-chip package and method of providing die-to-die interconnects in same
#4124Sensor device and method of manufacture
#4125Internally-shielded microelectronic packages and methods for the fabrication thereof
#4126Structure and formation method of semiconductor device with magnetic element covered by polymer material
#4127Packaged semiconductor devices for high voltage with die edge protection
#4128Unit with wiring board, module, and equipment
#4129Under-fill deflash for a dual-sided ball grid array package
#4130Power semiconductor device and power conversion device
#4131Semiconductor package having an isolation wall to reduce electromagnetic coupling
#4132Amplifier with integrated directional coupler
#4133System in a package connectors
#4134Half-bridge module with coaxial arrangement of the DC terminals
#4135SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#4136Integrated circuit chip carrier with in-plane thermal conductance layer
#4137Conformal dummy die
#4138Plurality of lead frames electrically connected to inductor chip
#4139Carbon nanotube-based thermal interface materials and methods of making and using thereof
#4140Resin encapsulated power semiconductor module with exposed terminal areas
#4141Semiconductor integrated circuit device
#4142AMPLIFIERS WITH BROADBAND IMPEDANCE MATCHING AND METHODS OF MANUFACTURE THEREOF
#4143Multi-chip packaging structure for an image sensor
#4144Package structure, package-on-package structure and method of fabricating the same
#4145Electrical device terminal finishing
#4146Light-emitting device with light-emitting element mounted on supporting member and display apparatus
#4147Light source device
#4148Power Semiconductor Circuit and Method for Determining a Temperature of a Power Semiconductor Component
#4149Light source device
#4150Terminal assembly structure of MEMS microphone
#4151Exposure method, electronic device and master-slave system
#4152Level shifting in a GaN half bridge circuit
#4153Apparatus for communication across a capacitively coupled channel
#4154Semiconductor device including sense insulated-gate bipolar transistor
#4155Module, method for manufacturing module, and electronic device
#4156Manufacturing method of semiconductor package
#4157Multi-chip detector appratus
#4158Semiconductor vertical wire bonding structure and method
#4159Semiconductor device and method of manufacturing the same
#4160Base material, mold package, base material manufacturing method, and mold package manufacturing method
#4161Lead frame for a die
#4162Thermal and stress isolation for precision circuit
#4163Ceramic package opening, heat sink, vias coupled to conductive pad
#4164Packaging of a semiconductor device with dual sealing materials
#4165Semiconductor dies supporting multiple packaging configurations and associated methods
#4166Electronic device and fingerprint sensing method
#4167Solid state light emitter die having a heat spreader between a plurality lead frame
#4168Packaging photon building blocks with top side connections and interconnect structure
#4169Method for manufacturing semiconductor device
#4170Power module including multiple signal wiring patterns disposed on an insulating substrate
#4171Micro module with a support structure
#4172PACKAGED INTEGRATED CIRCUIT
#4173Electronic component package
#4174Image data transmission system and image data transmission method
#4175Integrated circuit package including miniature antenna
#4176Multi-die fine grain integrated voltage regulation
#4177Dynamic random access memory (DRAM) mounts
#4178Semiconductor package
#4179Connecting techniques for stacked substrates
#4180Connection structure for stacked substrates
#4181Wire bonding between isolation capacitors for multichip modules
#4182Semiconductor chip, method for mounting semiconductor chip, and module in which semiconductor chip is packaged
#4183Methods and apparatus for package with interposers
#4184Method for producing power semiconductor module arrangement
#4185Memory package including buffer, expansion memory module, and multi-module memory system
#4186Semiconductor device and semiconductor device fabrication method
#4187Heterojunction semiconductor device for reducing parasitic capacitance
#4188Semiconductor package including stress-equalizing chip
#4189Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
#4190Package structure and method for fabricating the same
#4191Multi-branch terminal for integrated circuit (IC) package
#4192Bottom package exposed die MEMS pressure sensor integrated circuit package design
#4193Stacked semiconductor die assemblies with high efficiency thermal paths and molded underfill
#4194OPTICAL APPARATUS
#4195Dipole antenna via flexible circuitry
#4196Flex lead on cell container for electromagnetic shielding
#4197Cell-mounted monolithic integrated circuit for measuring, processing, and communicating cell parameters
#4198Semiconductor device and method of manufacturing a semiconductor device
#4199Semiconductor package
#4200Semiconductor chip and semiconductor package including the same