207826 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer
#4202BONDING WIRE FOR SEMICONDUCTOR DEVICE
#4203Semiconductor device structure and method for forming the same
#4204Positional relationship among components of semiconductor device
#4205Semiconductor power device including wire or ribbon bonds over device active region
#4206Circuit board and circuit module
#4207Inverted leads for packaged isolation devices
#4208Package-integrated vertical capacitors and methods of assembling same
#4209Method of manufacturing a semiconductor device
#4210Semiconductor device packages, packaging methods, and packaged semiconductor devices
#4211Package structure and manufacturing method thereof
#4212Structure and method of forming a joint assembly
#4213Manufacturing process for separating logic and memory array
#4214Implementing transient electronic circuits for security applications
#4215Electric magnetic shielding structure in packages
#4216DC and AC magnetic field protection for MRAM device using magnetic-field-shielding structure
#4217Thermal interface material layer and package-on-package device including the same
#4218Multi-layer solution based deposition of dielectrics for advanced substrate architectures
#4219Module having a sealing resin layer with radiating member filled depressions
#4220Semiconductor device packages and methods of manufacturing the same
#4221Semiconductor element, recording element substrate, and liquid discharge head
#4222Device and method for UBM/RDL routing
#4223Semiconductor device
#4224Discrete electronic component comprising a transistor
#4225Fabrication method of semiconductor package including shielding wall and cover
#4226Package and light emitting device
#4227Fabrication method of packaging structure
#4228Current sensor package with continuous insulation
#4229Semiconductor device having reduced capacitance between source and drain pads
#4230Four-in-one mini-LED module, display screen and manufacturing method
#4231Package on package thermal transfer systems and methods
#4232COAXIAL WIRE
#4233Semiconductor chip package array
#4234Semiconductor chip package method and semiconductor chip package device
#4235Semiconductor device with island and associated leads
#4236DAM LAMINATE ISOLATION SUBSTRATE
#4237Gas sensor module and method of manufacturing gas sensor module
#4238Through-substrate conductor support
#4239Wireless communication with dielectric medium
#4240Semiconductor package with connection substrate and method of manufacturing the same
#4241Integrated circuit formed from a stack of two series-connected chips
#4242Defect-tolerant layout and packaging for GaN power devices
#4243Ball bond attachment for a semiconductor die
#4244Semiconductor device
#4245QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same
#4246Electronic device and connection body
#4247Method of manufacturing semiconductor devices and corresponding semiconductor device
#4248Wiring substrate, electronic device, and electronic module
#4249Memories and memory components with interconnected and redundant data interfaces
#4250Power supply circuit and related methods for generating a power supply voltage in a semiconductor package
#4251MEMS device stress-reducing structure
#4252Light emitting device
#4253Semiconductor device having a carrier trapping region including crystal defects
#4254Hybrid bonding with uniform pattern density
#4255Light emitting device and method of manufacturing the light emitting device
#4256Interposer design in package structures for wire bonding applications
#4257INTEGRATED CIRCUIT DIE STACKS
#4258Shielded electronic component package
#4259Integrated module with electromagnetic shielding
#4260ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#4261Power module and fabrication method of the power module
#4262Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#4263Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation
#4264Overmolded lead frame assembly for pressure sensing applications
#4265Semiconductor module and power conversion apparatus
#4266MULTILAYER SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#4267Package-on-package semiconductor assemblies and methods of manufacturing the same
#4268Electronic component with shield plate and shield plate of electronic component
#4269Power semiconductor module
#42703D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
#4271Broadband power transistor devices and amplifiers with input-side harmonic termination circuits and methods of manufacture
#4272Package-on-package structures and methods for forming the same
#4273Power gate circuits for semiconductor devices
#4274Protection of integrated circuits
#4275Semiconductor package
#4276Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
#4277TWO SIDED BONDABLE LEAD FRAME
#4278SEMICONDUCTOR PACKAGE WITH CONTINUOUS LEAD FRAME
#4279Power semiconductor module with short circuit failure mode
#4280Integrated circuit structure
#4281Crosstalk mitigation for PCB to die transition in superconducting devices
#4282Low power heartbeat for low power mode
#4283Semiconductor package
#4284Molded semiconductor package having a package-in-package structure and methods of manufacturing thereof
#4285Semiconductor module comprising a first and second connecting element for connecting a semiconductor chip, and also production method
#4286SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
#4287Electronic device
#4288Impedance compensation of flip chip connection for RF communications
#4289Implementing transient electronic circuits for security applications
#4290Semiconductor device and corresponding method
#4291Terminal structure and semiconductor module
#4292Semiconductor device with lead terminals having portions thereof extending obliquely
#4293Patterned die pad for packaged vertical semiconductor devices
#4294Method of manufacturing semiconductor device
#4295QFN pin routing thru lead frame etching
#4296CRYSTAL PACKAGING WITH CONDUCTIVE PILLARS
#4297Communicating across galvanic isolation
#4298Stacked-die bulk acoustic wave oscillator package
#4299Methods for selectively shielding radio frequency modules
#4300Integrated circuit package and methods of forming same
#4301Bifurcated memory die module semiconductor device
#4302Semiconductor assemblies using edge stacking and methods of manufacturing the same
#4303Semiconductor device including dummy pull-down wire bonds
#4304Module assembly
#4305Semiconductor device and manufacturing method thereof
#4306Substrate for power module, circuit board for power module, and power module
#4307Packaging mechanisms for dies with different sizes of connectors
#4308Light emitting device and method of manufacturing the light emitting device
#4309Semiconductor package and method of manufacturing the semiconductor package
#4310Stacked semiconductor package
#4311Semiconductor module
#4312Contact hole structure and fabricating method of contact hole and fuse hole
#4313Amplifiers and amplifier modules with ground plane height variation structures
#4314Power electric switching device
#4315Semiconductor device packaging assembly, lead frame strip and unit lead frame with trenches or grooves for guiding liquefied molding material
#4316LED filament and led light bulb
#4317Electrical assembly substrates for downhole use
#4318Semiconductor relay
#4319Integrated circuit multichip stacked packaging structure and method
#4320SEMICONDUCTOR DEVICE AND DRIVE CIRCUIT
#4321Bond wire support systems and methods
#4322Impedance matching circuit for RF devices and method therefor
#4323SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
#4324Protection from ESD during the manufacturing process of semiconductor chips
#4325Hybrid power amplifier circuit or system with combination low-pass and high-pass interstage circuitry and method of operating same
#4326Electronic device comprising electronic chips
#4327Integrated high voltage capacitor
#4328Stacked semiconductor packages
#4329Molding compound and semiconductor package with a molding compound
#4330Electronic device and connector
#4331Charger
#4332Semiconductor device
#4333Method of making an integrated circuit for a single-molecule nucleic-acid assay platform
#4334Decoupling capacitor mounted on an integrated circuit die, and method of manufacturing the same
#4335High performance multi-component electronics power module
#4336Semiconductor device and method for manufacturing the same
#4337CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORATING THE SAME
#4338Light emitting device
#4339Semiconductor device including stack structures having R-type pad and P-type pad of different thickness
#4340Apparatuses comprising semiconductor dies in face-to-face arrangements
#4341Plate-shaped workpiece processing method
#4342Cover for an electronic device and method of fabrication
#4343Through electrode substrate and semiconductor device
#4344Ball interconnect structures for surface mount components
#4345Semiconductor device having lead with back and end surfaces provided with plating layers
#4346Packaging for integrated circuits
#4347Power converter
#4348Semiconductor device and power amplifier module
#4349Method for manufacturing lead frame including electrode and hanger lead, method for manufacturing package having lead frame, and method for manufacturing light-emitting device having package
#4350Semiconductor devices having upper and lower solder portions and methods of fabricating the same
#4351Semiconductor chip and semiconductor package including the same
#4352Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#4353Semiconductor packages
#4354Semiconductor device and method of manufacturing the same
#4355Leadframe package using selectively pre-plated leadframe
#4356Semiconductor device and method for manufacturing the same
#4357Semiconductor device with sealed semiconductor chip
#4358Semiconductor package
#4359Chip package structure, terminal device, and method
#4360SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
#4361Integrated circuit package and method of manufacturing the same
#4362Semiconductor package manufacturing method
#4363Vertical electrode decoupling/bypass capacitor
#4364Fault tolerant memory systems and components with interconnected and redundant data interfaces
#4365RIBBON WIRE BOND
#4366Integrated ultrasonic transducers
#4367Power conversion device
#4368Magnetically coupled galvanically isolated communication using lead frame
#4369Microelectronic devices designed with foldable flexible substrates for high frequency communication modules
#4370Semiconductor packages
#4371Signal routing in complex quantum systems
#4372Semiconductor device package with radiation shield
#4373Lead frame with bendable leads
#4374Integrated chip scale packages
#4375Intra-cardiac echocardiography interposer
#4376Semiconductor device and manufacturing method of the same
#4377Microelectronic die stack having at least one rotated microelectronic die
#4378Power semiconductor module
#4379Semiconductor device including bonding pad and bond wire or clip
#4380Electronic device
#4381Processing method for package substrate
#4382Current sensor isolation
#4383High-frequency module
#4384Light emitting device and method of manufacturing the light emitting device
#4385Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
#4386Method of manufacturing package-on-package device and bonding apparatus used therein
#4387JOINING FILM AND TAPE FOR WAFER PROCESSING
#4388Wiring board, electronic device, and electronic module
#4389Semiconductor package
#4390Raised via for terminal connections on different planes
#4391Oscillator, electronic apparatus, and vehicle
#4392Oscillator, electronic apparatus, and vehicle
#4393Thin film light emitting diode
#4394BACK-TO-BACK STACKED DIES
#4395Semiconductor device
#4396Semiconductor package and methods of manufacturing a semiconductor package
#4397METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC UNITS
#4398Semiconductor module, electronic component and method of manufacturing a semiconductor module
#4399Power semiconductor device
#4400Leadless semiconductor package with wettable flanks
#4401Semiconductor component and method of manufacture
#4402Semiconductor package structure
#4403Semiconductor package including multiple semiconductor chips and method of manufacturing the semiconductor package
#4404Semiconductor package
#4405Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
#4406Pad design for reliability enhancement in packages
#4407Nickel alloy for semiconductor packaging
#4408Package comprising carrier with chip and component mounted via opening
#4409Semiconductor device
#4410Illumination device
#4411Semiconductor device
#4412Load sensing devices, packages, and systems
#4413Electronic device, method of manufacturing electronic device, and electronic apparatus
#4414Stacked integrated circuits with redistribution lines
#4415Semiconductor device and method for manufacturing same
#4416Semiconductor device and semiconductor package including the same
#4417Methods of manufacturing an integrated circuit having stress tuning layer
#4418Printed circuit board and semiconductor package including the same
#4419Cascode semiconductor package and related methods
#4420Semiconductor device
#4421Power device having a substrate with metal layers exposed at surfaces of an insulation layer and manufacturing method thereof
#4422Power module and power convertor
#4423Packaged semiconductor components having substantially rigid support members
#4424Semiconductor package with elastic coupler and related methods
#4425IMAGING DEVICES, CAMERA MODULES, AND FABRICATION METHODS THEREOF
#4426Electronic system having increased coupling by using horizontal and vertical communication channels
#4427Semiconductor package
#4428Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
#4429Semiconductor packages
#4430Semiconductor Devices and Methods of Manufacture Thereof
#4431Methods of forming connector pad structures, interconnect structures, and structures thereof
#4432Method of manufacturing a semiconductor device
#4433Semiconductor device and method of inspecting the same
#4434Packaged semiconductor devices and methods of packaging thereof
#4435Integrated circuit, and motor device including the same
#4436Semiconductor device with side wall protection film for bond pad and wiring
#4437Fingerprint sensor device and method
#4438Semiconductor device having multiple gate pads
#4439Power semiconductor module and power semiconductor device
#4440Silicon carbide power module
#4441Semiconductor package having chip stack
#4442Semiconductor packages
#4443Semiconductor package with packaging substrate
#4444Integrated circuit (IC) package with a solder receiving area and associated methods
#4445Pressure sensor, in particular a microphone with improved layout
#4446Surface mount device stacking for reduced form factor
#4447Trench capacitor with warpage reduction
#4448Semiconductor device
#4449Packaged RF power amplifier having a high power density
#4450Memory packages and related semiconductor packages
#4451Compensating for memory input capacitance
#4452LEAD FRAME WITH PLATED LEAD TIPS
#4453Semiconductor device and method for manufacturing semiconductor device
#4454Housing for an electronic component, in particular a semiconductor chip
#4455Semiconductor device and method of manufacturing the same
#4456Semiconductor device
#4457MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#4458Semiconductor device
#4459Stacking integrated circuits containing serializer and deserializer blocks using through silicon via
#4460Wire ball bonding in semiconductor devices
#4461Bond pad structure for bonding improvement
#4462Semiconductor package having a circuit pattern
#4463Substrate-with-support
#4464Semiconductor device and method for manufacturing the same
#4465Module installation on printed circuit boards with embedded trace technology
#4466Distributed Pattern Processor Package
#4467Light emitting device
#4468Capacitively coupled level shifter
#4469Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronics
#4470Magnetic coupling package structure for magnetically coupled isolator with duo leadframes and method for manufacturing the same
#4471Semiconductor device with protection layer surrounding a bonding pad
#4472Electronic package
#4473Low loss substrate for high data rate applications
#4474Semiconductor device and method for manufacturing the same
#4475FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUNDS INCLUDING THE SAME FOR PREPARING SEMICONDUCTOR PACKAGES
#4476Gas sensor package and sensing apparatus including the same
#4477Method for stress reduction in semiconductor package via carrier
#4478Microphone and pressure sensor package and method of producing the microphone and pressure sensor package
#4479High voltage isolation structure and method
#4480Magnetic shielding package structure for MRAM device and method for producing the same
#4481Semiconductor package
#4482Semiconductor device assemblies including multiple stacks of different semiconductor dies
#4483Integrated circuit packaging
#4484Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system
#4485Wire bonding between isolation capacitors for multichip modules
#4486Power semiconductor device
#4487Electronic devices with bond pads formed on a molybdenum layer
#4488Multi-die integrated circuit packages and methods of manufacturing the same
#4489INTEGRATED CIRCUIT PACKAGE WITH LEAD LOCK
#4490Wire bond clamp design and lead frame capable of engaging with same
#4491Integrated circuit packages with wettable flanks and methods of manufacturing the same
#4492Semiconductor device
#4493Semiconducter device with filler to suppress generation of air bubbles and electric power converter
#4494Electronic substrates having embedded dielectric magnetic material to form inductors
#4495DRAM memory chips quick optical erasure
#4496Memory device comprising programmable command-and-address and/or data interfaces
#4497Transmission line optimization for multi-die systems
#4498Gas sensor package
#4499Selectively shielding radio frequency module with multi-layer antenna
#4500Detector architecture using photodetector arrays on thinned substrates