207826 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
Solid-state imaging device, manufacturing method thereof, and electronic apparatus
#4502Infra-red device
#4503Method of manufacturing a semiconductor device
#4504Laser ablation for wire bonding on organic solderability preservative surface
#4505Radio-frequency isolation cavities and cavity formation
#4506Topside radio-frequency isolation cavity configuration
#4507Methods of embedding magnetic structures in substrates
#4508Electronic assembly with a direct bonded copper substrate
#4509Dam laminate isolation substrate
#4510Wafer level flat no-lead semiconductor packages and methods of manufacture
#4511Wafer level flat no-lead semiconductor packages and methods of manufacture
#4512Wafer level flat no-lead semiconductor packages and methods of manufacture
#4513Method of manufacturing a package having a power semiconductor chip
#4514Apparatus and method of transmitting and receiving data, and semiconductor package including the same
#4515Solder material
#4516Wiring board and method for manufacturing same
#4517RF power transistors with impedance matching circuits, and methods of manufacture thereof
#4518Semiconductor device and measurement device
#4519Light emitting element including adhesive member containing particles
#4520Fan-out semiconductor package
#4521Semiconductor chip and method for forming a chip pad
#4522Low stress integrated circuit package
#4523Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier
#4524Semiconductor device
#4525Package structure and manufacturing method thereof
#4526Structure of printed circuit board and carrier and method of making semiconductor package
#4527Mainboard assembly including a package overlying a die directly attached to the mainboard
#4528Packaged RF power amplifier
#4529Chip package structure
#4530Compact wirebonding in stacked-chip system in package, and methods of making same
#4531Power module substrate, power module, and method for manufacturing power module substrate
#4532ACCIDENTAL FUSE PROGRAMMING PROTECTION CIRCUITS
#4533Switching device and electronic circuit
#4534Method of forming package structure
#4535Package-in-package structure for semiconductor devices and methods of manufacture
#4536Power semiconductor device that includes a copper layer disposed on an electrode and located away from a polyimide layer and method for manufacturing the power semiconductor device
#4537Chip packages and methods for forming the same
#4538Integrated passive device for RF power amplifier package
#4539Multi terminal capacitor within input output path of semiconductor package interconnect
#4540PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE AND METHOD
#4541Through-hole electrode substrate
#4542Method of making a wire support leadframe for a semiconductor device
#4543Recessed lead leadframe packages
#4544Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold
#4545Semiconductor package with a wire bond mesh
#4546Integrated chip scale packages
#4547Semiconductor device including sensor and driving terminals spaced away from the semiconductor device case wall
#4548Radio frequency isolation structure
#4549Semiconductor chip package having optical interface
#4550Low-voltage differential signal driver and receiver module with radiation hardness to 300 kilorad
#4551Light emitting device
#4552Jointing material, fabrication method for semiconductor device using the jointing material, and semiconductor device
#4553Semiconductor device and method of manufacturing the same
#4554Semiconductor apparatus and equipment
#4555Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device
#4556Semiconductor device
#4557Electronic package and method for fabricating the same
#4558System and method for routing signals in complex quantum systems
#4559Semiconductor device having a protection trench, semiconductor wafer including the same, and semiconductor package
#4560Package structure including at least one connecting module and manufacturing method thereof
#4561Integrated circuit package substrate
#4562Semiconductor package structure and semiconductor module including the same
#4563Electronic package and method for fabricating the same
#4564Semiconductor device package and method for manufacturing the same
#4565Semiconductor apparatus and electric power conversion apparatus
#4566Semiconductor device and power conversion device
#4567METHODS TO PRODUCE A 3D SEMICONDUCTOR MEMORY DEVICE AND SYSTEM
#4568Electronic package for integrated circuits and related methods
#4569Method for dicing integrated fan-out packages without seal rings
#4570Semiconductor chip module and semiconductor package including the same
#4571LED light bulb with two sets of filaments
#4572Power amplifier modules including transistor with grading and semiconductor resistor
#4573Integrated circuit connection arrangement for minimizing crosstalk
#4574Semiconductor chip and power module, and manufacturing method of the same
#4575Apparatus and method for multi-die interconnection
#4576SEMICONDUCTOR DEVICES HAVING WIRE BONDING STRUCTURES AND METHODS OF FABRICATING THE SAME
#4577Electronic device and mounting structure of the same
#4578Systems and methods for electromagnetic interference shielding
#4579Chip package and manufacturing method thereof
#4580Semiconductor device package
#4581Semiconductor device and method for manufacturing semiconductor device
#4582Semiconductor device
#4583Semiconductor packages having dual encapsulation material
#4584Integrated circuit package mold assembly
#4585Semiconductor device and manufacturing method, and electronic appliance
#4586Method of manufacturing a semiconductor device
#4587Semiconductor devices with package-level configurability
#4588Semiconductor devices with package-level configurability
#4589Optical module
#4590Semiconductor package including processor chip and memory chip
#4591Multiple plated via arrays of different wire heights on same substrate
#4592Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
#4593Reinforcement for electrical connectors
#4594Power semiconductor chip, method for producing a power semiconductor chip, and power semiconductor device
#4595Amplifier
#4596SEMICONDUCTOR BACKMETAL AND OVER PAD METALLIZATION STRUCTURES AND RELATED METHODS
#4597Semiconductor package and method
#4598Electronic component mounting substrate, electronic device, and electronic module
#4599Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
#4600Leadframe having a conductive layer protruding through a lead recess
#4601Semiconductor device, semiconductor chip, and test method for semiconductor chip
#4602METHOD FOR PRODUCING A 3D MEMORY DEVICE
#4603Component and method of manufacturing a component using an ultrathin carrier
#4604Resin encapsulating mold and method of manufacturing semiconductor device
#4605Package-on-package (PoP) semiconductor package and electronic system including the same
#4606SEMICONDUCTOR PACKAGE
#4607Microelectronic device stacks having interior window wirebonding
#4608Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
#4609Detection of foreign particles during wire bonding
#4610Corrosion resistant aluminum bond pad structure
#4611Wireless module with antenna package and cap package
#4612Semiconductor device manufacturing method comprising bonding an electrode terminal to a conductive pattern on an insulating substrate using ultrasonic bonding
#4613Semiconductor packages having semiconductor chips disposed in opening in shielding core plate
#4614SECURITY DEVICE SUCH THAT A SMART CARD
#4615Semiconductor arrangement with reliably switching controllable semiconductor elements
#4616Packaging structure with recessed outer and inner lead surfaces
#4617Semiconductor package including organic interposer
#4618Semiconductor memory device
#46193D SEMICONDUCTOR DEVICE AND SYSTEM
#4620Semiconductor package device and method of manufacturing the same
#4621Gas sensor packages
#4622Galvanic signal path isolation in an encapsulated package using a photonic structure
#4623Receiver optical module and process of assembling the same
#4624Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
#4625Package structure and manufacturing method thereof
#4626Semiconductor package assembly
#4627Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devices
#4628Connection member with bulk body and electrically and thermally conductive coating
#4629Integrated circuit (IC) die attached between an offset lead frame die-attach pad and a discrete die-attach pad
#4630Heterojunction semiconductor device for reducing parasitic capacitance
#4631Semiconductor module, method for manufacturing the same and electric power conversion device
#4632Semiconductor device
#4633QUAD FLAT NO-LEAD PACKAGE
#4634Semiconductor package device and method of manufacturing the same
#4635Power semiconductor module
#4636Acoustic management in integrated circuit using phononic bandgap structure
#4637Method of manufacturing power semiconductor module including a power semiconductor chip and a control chip formed according to different process rules, and power semiconductor module
#4638Integrated circuit package assembly
#4639Integrally formed bias and signal lead for a packaged transistor device
#4640Semiconductor device and manufacturing method thereof
#4641Printed circuit boards with anti-warping molding portions and related semiconductor packages and methods of fabricating
#4642Leadless semiconductor packages, leadframes therefor, and methods of making
#4643Method for fabricating semiconductor device and lead frame
#4644Magnetoresistive sensor package with encapsulated initialization coil
#4645JOINT STRUCTURE, ELECTRONIC COMPONENT MODULE, ELECTRONIC COMPONENT UNIT, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT UNIT
#4646Light emitting device and method of producing the same
#4647Semiconductor device having first and second electrode layers electrically disconnected from each other by a slit
#4648Semiconductor device
#4649Circuit mounting structure and lead frame for system in package (SIP) devices
#4650Semiconductor packages and methods of forming the same
#4651Package structure and method of forming the same
#4652Conductive vias in semiconductor packages and methods of forming same
#4653High speed semiconductor device with noise reduction wiring pattern
#4654Semiconductor package with terminal pattern for increased channel density
#4655Chip package structure and method for manufacturing the same
#4656LEAD FRAME ASSEMBLY
#4657Method of manufacturing semiconductor devices, corresponding device and circuit
#4658Lead frame including connecting portions and coupling portions
#4659Inverted leads for packaged isolation devices
#4660Power MOSFET device and manufacturing process thereof
#4661Semiconductor device and a method of manufacturing thereof
#4662Electronic device having cobalt coated aluminum contact pads
#4663Transistor outline housing with high return loss
#4664Method and apparatus for heat sinking high frequency IC with absorbing material
#4665Package substrate processing method and protective tape
#4666Semiconductor apparatus
#4667Inductively coupled microelectromechanical system resonator
#4668Integrated circuit package having a raised lead edge
#4669Semiconductor chip and semiconductor device
#4670Molded air cavity packages and methods for the production thereof
#46713D SEMICONDUCTOR DEVICE AND SYSTEM
#4672Pressure sensor
#4673Semiconductor component and method for producing same
#4674Double-sided module with electromagnetic shielding
#4675Manufacturing method of semiconductor package
#4676Method of manufacturing multi-chip package
#4677Methods of forming joint structures for surface mount packages
#4678Method for fabricating an electronic device and a stacked electronic device
#4679Semiconductor apparatus
#4680Semiconductor device having press-fit terminals disposed in recesses in a case frame
#46813D CHIP STACK WITH INTEGRATED VOLTAGE REGULATION
#4682DETECTION DEVICE AND ELECTRONIC APPARATUS
#4683Light-emitting device
#4684HIGH RELIABILITY HOUSING FOR A SEMICONDUCTOR PACKAGE
#4685Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
#4686Semiconductor device having stacked chips
#4687Semiconductor device and method for manufacturing same
#4688Semiconductor package and method of manufacturing the same
#4689Package with lead frame with improved lead design for discrete electrical components and manufacturing the same
#4690Electrically testable integrated circuit packaging
#4691Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
#4692Camera module
#4693Camera module and photosensitive assembly thereof
#4694Camera module having support member with extension structure
#4695Manufacturing method of semiconductor device and semiconductor device
#4696Wire bonding tool including a wedge tool
#4697Microelectronic device having protected connections and manufacturing process thereof
#4698Multichip modules and methods of fabrication
#4699Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks
#4700Substrate with multi-layer resin structure and semiconductor device including the substrate
#4701Semiconductor device
#4702Semiconductor device with copper corrosion inhibitors
#4703SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#4704Stack package and methods of manufacturing the same
#4705Light emitting device package having a black epoxy molding compound (EMC) body and lighting apparatus including the same
#4706High-voltage MOSFET structures
#4707Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#4708Chip packaging structure and method, and electronic device
#4709Semiconductor device having electromagnetic wave attenuation layer
#4710Lead frame having redistribution layer
#4711Semiconductor device
#4712Light emitting diodes, components and related methods
#4713Method of fabricating semiconductor package
#4714Sensor package structure
#4715Electronic component
#4716Configurable substrate and systems
#4717Apparatus and method for multi-die interconnection
#4718Interposer substrate and method for manufacturing the same
#4719Transistor package with three-terminal clip
#4720Lead frame and method of manufacturing lead frame
#47213D SEMICONDUCTOR DEVICE AND SYSTEM
#4722Power supply circuit and related methods for generating a power supply voltage in a semiconductor package
#4723Semiconductor device
#4724Semiconductor device and mounting structure of semiconductor device
#4725Optical device
#4726SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#4727Electronic unit
#4728Integrated semiconductor assemblies and methods of manufacturing the same
#4729CIRCUIT BOARD AND CHIP PACKAGE
#4730Semiconductor device
#4731VOID REDUCTION IN SOLDER JOINTS USING OFF-EUTECTIC SOLDER
#4732Molded intelligent power module and method of making the same
#4733Electronic device packaging with galvanic isolation
#4734Power module with multi-layer substrate
#4735Non-vertical through-via in package
#47363D SEMICONDUCTOR DEVICE AND SYSTEM
#4737Multi-blade and processing method of workpiece
#4738Semiconductor dies supporting multiple packaging configurations and associated methods
#4739Package structure of fingerprint identification chip
#4740Sensor package structure
#4741Apparatus and method for multi-die interconnection
#4742Semiconductor package substrate and method for manufacturing same
#4743Power semiconductor apparatus and manufacturing method therefor
#4744Power module and power conversion apparatus including case and elastic member
#4745MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#47463D SEMICONDUCTOR DEVICE AND SYSTEM
#4747Wireless communication link using near field coupling
#4748Radio frequency shielding within a semiconductor package
#4749Thin optoelectronic modules with apertures and their manufacture
#4750Semiconductor device and manufacturing method thereof
#4751Semiconductor module with temperature detecting element
#4752Semiconductor device
#4753Wire bond connection with intermediate contact structure
#4754Semiconductor device having conductive wire with increased attachment angle and method
#4755Multilayer frame packages for integrated circuits having a magnetic shield integrated therein, and methods therefor
#4756Semiconductor packages
#4757Semiconductor package
#4758Semiconductor module for a power conversion circuit for reliably reducing a voltage surge
#4759Semiconductor package having a circuit pattern
#4760Semiconductor chip and semiconductor device provided with same
#4761Semiconductor package with a heat spreader and method of manufacturing thereof
#4762Substrate-free system in package design
#4763Chip Package Structure, Terminal Device, and Method
#4764Molded air cavity packages and methods for the production thereof
#4765CERAMIC PLATE, PRODUCING METHOD THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE
#4766Image pickup device and electronic apparatus
#4767Semiconductor package assembly and method for forming the same
#4768Semiconductor module and method for manufacturing the same
#4769Semiconductor device with first and second transistors and support part
#4770Negative fillet for mounting an integrated device die to a carrier
#4771Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect
#4772Interchip backside connection
#4773PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
#4774Method for fabricating electronic package
#4775Cavity wall structure for semiconductor packaging
#4776Semiconductor device and method for manufacturing the same
#4777Integrated circuit package with electro-optical interconnect circuitry
#4778Production of a multi-chip component
#4779Semiconductor device and semiconductor element with improved yield
#4780WIREBOND INTERCONNECT STRUCTURES FOR STACKED DIE PACKAGES
#4781Measuring device
#4782Semiconductor device
#4783Semiconductor device
#4784Semiconductor package
#4785Selective metallization of integrated circuit packages
#4786Circuit board and packaged chip
#4787Semiconductor package with supported stacked die
#4788Ag underlayer-attached metallic member, Ag underlayer-attached insulating circuit substrate,semiconductor device, heat sink-attached insulating circuit substrate, and method for manufacturing Ag underlayer-attached metallic member
#4789Electronic component and method for producing an electronic component
#4790Semiconductor structure and semiconductor package device using the same
#4791Die crack detector and method therefor
#4792Semiconductor package having an isolation wall to reduce electromagnetic coupling
#4793Light emitting apparatus
#4794Apparatus and method for multi-die interconnection
#4795On-bonder automatic overhang die optimization tool for wire bonding and related methods
#4796Method for fabricating glass substrate package
#4797Semiconductor package and method of forming the same
#4798Wire bond wires for interference shielding
#4799Wire support for a leadframe
#4800Semiconductor device