207826 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
Chip packaging structure, chip module and electronic terminal
#4802A 3D SEMICONDUCTOR DEVICE AND SYSTEM
#4803Semiconductor device
#4804Package structure of fingerprint identification chip
#4805Optical non-destructive inspection method and optical non-destructive inspection apparatus
#4806Sensor package structure
#4807Semiconductor device and fabrication method of the semiconductor device
#4808Fingerprint chip package and method for processing same
#4809Electrically conductive adhesive film and dicing-die bonding film using the same
#4810Electrically conductive adhesive film and dicing-die bonding film using the same
#4811Apparatuses comprising semiconductor dies in face-to-face arrangements
#4812METHODS FOR WIRE BONDING AND TESTING AND FLASH MEMORIES FABRICATED BY THE SAME
#4813Wire bonding systems and related methods
#4814Semiconductor package device and method of manufacturing the same
#4815PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#4816Resonator device, electronic apparatus, and vehicle
#4817Semiconductor device and semiconductor module
#4818Heterojunction semiconductor device for reducing parasitic capacitance
#4819THREE-DIMENSIONAL INTEGRATED FAN-OUT WAFER LEVEL PACKAGE
#4820Isolator integrated circuits with package structure cavity and fabrication methods
#4821Method and device for controlling operation using temperature deviation in multi-chip package
#4822Semiconductor device with over pad metal electrode and method for manufacturing the same
#4823High-power amplifier package
#4824Guard bond wires in an integrated circuit package
#4825Semiconductor device having bonding regions exposed through protective films provided on circuit patterns onto which components are soldered
#4826Molded intelligent power module for motors
#4827Manufacturing method for semiconductor device and semiconductor device
#4828Solid top terminal for discrete power devices
#4829Protection from ESD during the manufacturing process of semiconductor chips
#4830Molded package with chip carrier comprising brazed electrically conductive layers
#4831Method of packaging power semiconductor module including power transistors
#48323D SEMICONDUCTOR DEVICE AND SYSTEM
#48333D semiconductor device and structure
#4834Manufacturing method of semiconductor package
#4835Semiconductor product and corresponding method
#4836Semiconductor device
#4837IMAGE SENSOR MOUNTING BOARD AND IMAGING DEVICE
#4838Magneto-resistive chip package including shielding structure
#4839Light emitting device and lead frame with resin
#4840Packaged die and RDL with bonding structures therebetween
#4841Flip-chip like integrated passive prepackage for SIP device
#4842Conductive wire through-mold connection apparatus and method
#4843Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same
#4844Chip on package structure and method
#4845Vertical wire connections for integrated circuit package
#4846Bonding wire for semiconductor devices
#4847Semiconductor device including a pad and a wiring line arranged for bringing a probe into contact with the pad and method of manufacturing the same
#4848Package for an electronic component, electronic component and electronic arrangement
#4849Semiconductor device
#4850Interstage matching network
#4851Electronic device
#4852Arc mitigation in electrical power distribution system
#4853Opto-reflector
#4854Multi-die fine grain integrated voltage regulation
#4855Dynamic random access memory (DRAM) mounts
#4856Method for Producing an Electronic Circuit Device and Electronic Circuit Device
#4857Semiconductor device having upper and lower redistribution layers
#4858Power semiconductor device load terminal
#4859Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device
#4860Power gate circuits for semiconductor devices
#4861Semiconductor device and method for manufacturing semiconductor device
#4862Semiconductor device
#4863Power module based on multi-layer circuit board
#4864Semiconductor device
#4865Integrated circuit package with pre-wetted contact sidewall surfaces
#4866Methods of determining racetrack layout for radio frequency isolation structure
#4867Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic device
#4868Optical device
#4869Optoelectronic component and method of producing same
#4870Stacked microfeature devices and associated methods
#4871Shielded magnetoresistive random access memory devices and methods for fabricating the same
#4872Semiconductor device
#4873Multi-phase power converter with common connections
#4874Memory devices with controllers under memory packages and associated systems and methods
#4875Package-on-package assembly with wire bonds to encapsulation surface
#4876Semiconductor package with integrated harmonic termination feature
#4877Semiconductor package device and method of manufacturing the same
#4878Rectangular semiconductor package and a method of manufacturing the same
#4879Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#4880Integrated circuit device with plating on lead interconnection point and method of forming the device
#4881Power semiconductor chip module
#48823D SEMICONDUCTOR DEVICE AND SYSTEM
#48833D SEMICONDUCTOR DEVICE AND SYSTEM
#48843D SEMICONDUCTOR DEVICE AND SYSTEM
#48853D SEMICONDUCTOR DEVICE AND SYSTEM
#4886Method of manufacturing a semiconductor device including through silicon plugs
#4887Semiconductor device package with a conductive post
#4888Semiconductor structure and a method of making thereof
#4889Semiconductor packages including stacked chips
#4890Microelectronic devices and methods for filling vias in microelectronic devices
#4891Method of manufacturing semiconductor devices and corresponding product
#4892Semiconductor component and method of manufacture
#4893Semiconductor device and method for manufacturing the same
#4894Method of manufacturing semiconductor devices
#4895Semiconductor device including conductive bump interconnections
#4896Electronic device
#4897Semiconductor device with magnetic layer and nonmagnetic layer
#4898Ultra small molded module integrated with die by module-on-wafer assembly
#4899Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
#4900Semiconductor device with coils in different wiring layers
#4901Interconnection substrates for interconnection between circuit modules, and methods of manufacture
#4902Reverse mounted gull wing electronic package
#4903Power electronic arrangement and electric vehicle with such an arrangement
#4904Resin composition for encapsulation, and semiconductor device
#4905NITRIDE SEMICONDUCTOR ELEMENT AND NITRIDE SEMICONDUCTOR PACKAGE
#4906FINGERPRINT SENSING UNIT
#4907Light emitting package and vehicle lighting device comprising same
#4908Solid-state image pickup device and electronic apparatus to increase yield
#4909Integrated circuit package including miniature antenna
#4910Semiconductor integrated circuit
#4911Light emitting device and method of manufacturing the light emitting device
#4912Power converter monolithically integrating transistors, carrier, and components
#4913Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
#4914Method of fabricating a semiconductor package
#4915Electronic component package
#4916Electrical interconnections for semiconductor devices and methods for forming the same
#4917Semiconductor device with first and second semiconductor chips connected to insulating element
#4918Lead frame
#4919Semiconductor device
#4920Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units
#4921Sensor semiconductor device and method of producing a sensor semiconductor device
#4922Semiconductor chip, semiconductor device, and electronic device
#4923ELECTRONIC DEVICE
#4924Packages with through-vias having tapered ends
#4925Package structures and method of forming the same
#4926Power semiconductor module arrangement and method for producing the same
#4927Chip on film package and display apparatus having the same
#4928Bonding apparatus with rotating bonding stage
#4929Semiconductor die with back-side integrated inductive component
#4930Semiconductor apparatus and semiconductor system including the same
#4931Fabrication and use of through silicon vias on double sided interconnect device
#4932Connection pads for low cross-talk vertical wirebonds
#4933ELIMINATING DIE SHADOW EFFECTS BY DUMMY DIE BEAMS FOR SOLDER JOINT RELIABILITY IMPROVEMENT
#4934Semiconductor package and manufacturing method thereof
#4935Manufacturing method of semiconductor device
#4936Electric conductor track, method, and use
#4937Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system
#4938Semiconductor package having routable encapsulated conductive substrate and method
#4939Electronic device and method for manufacturing the same
#4940Power module
#4941Chip capacitor, circuit assembly, and electronic device
#4942Secure smart node and data concentrator for distributed engine control
#4943Power measurement via bond wire coupling
#4944Enhancement-mode III-nitride devices
#4945INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
#4946Backside metalization with through-wafer-via processing to allow use of high q bondwire inductances
#4947Shielded module having compression overmold
#4948Methods and modules related to shielded lead frame packages
#4949Semiconductor device and semiconductor package including plural solder ball sets each corresponding to a pair of differential input and differential output signals
#4950Semiconductor device
#4951Package-on-package semiconductor assemblies and methods of manufacturing the same
#4952Positional relationship among components of semiconductor device
#4953Semiconductor device and method of manufacturing the same
#4954Semiconductor device
#4955Resin molded body
#4956Packaged semiconductor device
#4957Semiconductor device and power amplifier module
#4958Semiconductor device and method of manufacturing the same
#4959SEMICONDUCTOR DEVICE
#4960Multi-layered composite bonding materials and power electronics assemblies incorporating the same
#4961Semiconductor device
#4962SEMICONDUCTOR DEVICE
#4963Device having substrate with conductive pillars
#4964Electronic component mounting board, electronic device, and electronic module
#4965Systems and methods for improved delamination characteristics in a semiconductor package
#4966Magnetic detection device, current detection device, method for manufacturing magnetic detection device, and method for manufacturing current detection device
#4967Illumination device
#4968Power semiconductor device and power conversion device
#4969Using MEMS fabrication incorporating into LED device mounting and assembly
#4970Semiconductor package
#4971Multiple bond via arrays of different wire heights on a same substrate
#4972Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
#4973Backside substrate openings in transistor devices
#4974Semiconductor device and method of manufacturing the semiconductor device
#4975SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#4976Heat resistant and shock resistant integrated circuit
#49773D semiconductor device and system
#4978Current transducer with integrated primary conductor
#4979Board level shields with virtual grounding capability
#4980Semiconductor chip having multiple pads and semiconductor module including the same
#4981Semiconductor device and ball bonder
#4982Semiconductor package structure
#4983Package structure
#4984Stacked semiconductor die assemblies with high efficiency thermal paths and molded underfill
#4985Apparatus and method for RF isolation in a packaged integrated circuit
#4986Semiconductor device packages, packaging methods, and packaged semiconductor devices
#4987Method of manufacturing electronic component module
#4988Power apparatus
#4989Semiconductor device and method of manufacturing semiconductor device
#4990Semiconductor module
#4991BOARD FOR ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT PACKAGE, AND METHOD OF MANUFACTURING BOARD FOR ELECTRONIC COMPONENT PACKAGE
#4992MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND INSPECTION APPARATUS FOR SEMICONDUCTOR DEVICE
#4993Parallel plate waveguide for power semiconductor package
#4994COB DIE BONDING AND WIRE BONDING SYSTEM AND METHOD
#4995Electronic package and method for fabricating the same
#4996Reflector markers and systems and methods for identifying and locating them
#4997Electronic assembly with phase-change cooling of a semiconductor device
#4998Semiconductor device
#4999Switched mode power converter configured to control at least one phase of a polyphase electrical receiver with at least three phases
#5000Wireless communications with dielectric medium
#5001Semiconductor device and method of manufacturing the same
#5002SEMICONDUCTOR PACKAGE
#5003SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#5004Semiconductor device
#5005Semiconductor device
#5006Method of manufacturing semiconductor device
#5007Thermal bonding sheet and thermal bonding sheet with dicing tape
#5008Power electronics assemblies and vehicles incorporating the same
#5009Semiconductor device and method for manufacturing the same
#5010Integrated package assembly for switching regulator
#5011Semiconductor device and lead frame
#5012Manufacturing method of semiconductor device, inspection device of semiconductor device, and semiconductor device
#5013Power semiconductor package having a parallel plate waveguide
#5014Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader
#5015METHOD FOR MANUFACTURING MULTILAYER CERAMIC SUBSTRATE
#5016Semiconductor optical element and method for manufacturing the same
#5017Semiconductor device
#5018Adjustable losses on bond wire arrangement
#5019Vibrator device, oscillator, electronic device, and vehicle
#5020Oscillator, electronic apparatus, and vehicle
#5021Semiconductor device and method for manufacturing the same
#5022Thermal bonding sheet and thermal bonding sheet with dicing tape
#5023Manufacturing method of semiconductor device and semiconductor device
#5024Method of manufacturing semiconductor package
#5025Semiconductor packages having wire bond wall to reduce coupling
#5026Semiconductor device
#5027Electronic device
#5028SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
#5029Sensor package and manufacturing method thereof
#5030Thermal bonding sheet and thermal bonding sheet with dicing tape
#5031Method of producing an optoelectronic semiconductor component, optoelectronic semiconductor component, and temporary carrier
#5032Semiconductor module and power conversion device
#5033Contoured package-on-package joint
#5034Semiconductor device and method for manufacturing semiconductor device
#5035Stackable microelectronic package structures
#5036Window Clamp
#5037Window Clamp
#5038Radio frequency modules
#5039Pad structure and integrated circuit die using the same
#5040Method for fabricating electronic package having a protruding barrier frame
#5041Semiconductor package with lead frame and recessed solder terminals
#5042Semiconductor device and method of manufacturing the same
#5043Semiconductor module comprising an encapsulating compound that covers at least one semiconductor component
#5044Surface mount device stacking for reduced form factor
#5045Light emitting apparatus
#5046Method of manufacturing a semiconductor device
#5047Package with different types of semiconductor dies attached to a flange
#5048Electronic component mounting board and electronic device
#5049Carbon nanotube-based thermal interface materials and methods of making and using thereof
#5050Millimeter wave semiconductor apparatus including a microstrip to fin line interface to a waveguide member
#5051Semiconductor power module and power conversion apparatus
#5052Electronic component, electronic equipment, and method for manufacturing electronic component
#5053Semiconductor module
#5054Printed circuit board having insulating metal oxide layer covering connection pad
#5055Semiconductor device and manufacturing method thereof
#50563-D STACKING OF ACTIVE DEVICES OVER PASSIVE DEVICES
#5057Integrated circuit connection arrangement for minimizing crosstalk
#5058Connection arrangements for integrated lateral diffusion field effect transistors
#5059Stacked semiconductor die assemblies with die support members and associated systems and methods
#5060Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
#5061Electronic device by laser-induced forming and transfer of shaped metallic interconnects
#5062Semiconductor device having an electrical connection between semiconductor chips established by wire bonding, and method for manufacturing the same
#5063Integrated module with electromagnetic shielding
#5064Fiducial mark for chip bonding
#5065Electronic component mounting board, electronic device, and electronic module
#5066Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer
#5067Leadframe and integrated circuit connection arrangement
#5068Lead frame
#5069Semiconductor device
#5070Semiconductor package having double-sided heat dissipation structure
#5071Semiconductor chip, method for mounting semiconductor chip, and module in which semiconductor chip is packaged
#5072Methods and apparatus for package with interposers
#5073Switch device
#5074Dual-Chip Package Structure
#5075High voltage device with multi-electrode control
#5076SEMICONDUCTOR MODULE
#5077Grounding techniques for backside-biased semiconductor dice and related devices, systems and methods
#5078RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE
#5079SEMICONDUCTOR DEVICE
#5080Semiconductor package device
#5081Semiconductor package with a wire bond mesh
#5082Semiconductor package, assembly and module arrangements for measuring gate-to-emitter/source voltage
#5083Stack frame for electrical connections and the method to fabricate thereof
#5084Semiconductor storage device
#5085Molding compound including a carbon nano-tube dispersion
#5086Magnetically coupled galvanically isolated communication using lead frame
#5087Electronic device
#5088Light-emitting element package
#5089Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#5090Three-layer package-on-package structure and method forming same
#5091Semiconductor package and method of fabricating the same
#5092Fan-out semiconductor package and method of manufacturing the same
#5093Integrated circuit (IC) package with a solder receiving area and associated methods
#5094Semiconductor device and electric power conversion device having relay terminal directly fixed to an insulating film of base plate
#5095THERMOELECTRIC BONDING FOR INTEGRATED CIRCUITS
#5096Semiconductor package
#5097Vehicle control device
#5098Method for manufacturing semiconductor device
#5099Control of under-fill using an encapsulant for a dual-sided ball grid array package
#5100Control of under-fill using a dam on a packaging substrate for a dual-sided ball grid array package