Control of under-fill using under-fill deflash for a dual-sided ball grid array package

CONTROL OF UNDER-FILL USING A FILM DURING FABRICATION FOR A DUAL-SIDED BALL GRID ARRAY PACKAGE

Light-emitting device having surface-modified luminophores

Method for manufacturing light-emitting device

Semiconductor device and method of manufacturing the same

Wiring board and electronic package

Power semiconductor module

Air-cavity package with enhanced package integration level and thermal performance

3D semiconductor device, fabrication method and system

Control of under-fill with a packaging substrate having an integrated trench for a dual-sided ball grid array package

Integrated DRAM with low-voltage swing I/O

Package substrate comprising side pads on edge, chip stack, semiconductor package, and memory module comprising same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Methods of forming connector pad structures, interconnect structures, and structures thereof

Electronic package and method for fabricating the same

Semiconductor module comprising transistor chips, diode chips and driver chips arranged in a common plane

Raised via for terminal connections on different planes

Package substrate, method for fabricating the same, and package device including the package substrate

Packaged semiconductor device having multi-level leadframes configured as modules

PRE-MOLDED INTEGRATED CIRCUIT PACKAGES

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Electrically testable microwave integrated circuit packaging

THERMAL CONDUCTIVE RESIN COMPOSITION, THERMAL CONDUCTIVE SHEET, AND SEMICONDUCTOR DEVICE

SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern

Optoelectronic modules including overmold supporting an optical assembly

Structures and methods for shielding magnetically sensitive components

Advanced node cost reduction by ESD interposer

Package structure and manufacturing method thereof

Substrates, assembles, and techniques to enable multi-chip flip chip packages

MANUFACTURING METHOD FOR PACKAGE DEVICE

Lead frame and method for manufacturing the same

Die with metallized sidewall and method of manufacturing

Semiconductor device with sealing portion to suppress connection corrosion

Package-on-package structures and methods for forming the same

Integrated circuit package having wirebonded multi-die stack

Packages with metal line crack prevention design

Power semiconductor device

Semiconductor device with frame having arms and related methods

Semiconductor device, chip module, and semiconductor module

Air-cavity package with dual signal-transition sides

Semiconductor device and its manufacturing method

Insulated gate semiconductor device and method for manufacturing insulated gate semiconductor device

Light emitting device and light emitting module

SEMICONDUCTOR CHIP PACKAGE WITH CAVITY

Electronic device with integrated galvanic isolation, and manufacturing method of the same

Power semiconductor module

Isolator integrated circuits with package structure cavity and fabrication methods

Package structure and method of manufacturing the same

Semiconductor device including dual pad wire bond interconnection

Antenna apparatus having bond wires

Contact hole structure and fabricating method of contact hole and fuse hole

High-frequency module

Bent-bridge semiconductive apparatus

Chip package structure and manufacturing method thereof

Ceramic metal circuit board and semiconductor device using the same

Semiconductor device, corresponding apparatus and method

Semiconductor device package and a method of manufacturing the same

Integrated circuit package mold assembly

Electro-optic device, electro-optic unit, and electronic apparatus

Through-substrate conductor support

SEMICONDUCTOR APPARATUS AND INVERTER SYSTEM

Physical topology for a power converter

Image sensor with processor package

Semiconductor module

Semiconductor device including plural semiconductor chips

Thermal management of molded packages

Systems and methods for bonding semiconductor elements

Method of manufacturing semiconductor device

Electronic device and mounting structure of the same

Semiconductor device and method of making semiconductor device

Semiconductor device

Semiconductor package manufacturing method

Packaging structure and fabrication method thereof

POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD

QFN pin routing thru lead frame etching

Rectifier package module for vehicle and connection status detection method for temperature sensor thereof

Optoelectronic component and method for producing an optoelectronic component

Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same

Light emitting device and method of producing the same

Light emitting device and method of producing the same

Semiconductor device having a protruding interposer edge face

Camera module and electronic apparatus to lower risk of breakage of camera module

Semiconductor device including die bond pads at a die edge

Wire bonded wide I/O semiconductor device

Corrosion resistant aluminum bond pad structure

Semiconductor package and method of fabricating the same

Method of making a wire support leadframe for a semiconductor device

Power semiconductor packages having a substrate with two or more metal layers and one or more polymer-based insulating layers for separating the metal layers

Power module of square flat pin-free packaging structure

Semiconductor package and method for fabricating a semiconductor package

SEMICONDUCTOR MANUFACTURING DEVICE, SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

Wafer level flat no-lead semiconductor packages and methods of manufacture

Manufacturing method for semiconductor device

Parallel LC resonator and method therefor

Light emitting element

Light source comprising a number of semi-conductor components

Common-source packaging structure

Common-source packaging structure

ELECTRICALLY CONDUCTIVE BOND BETWEEN AT LEAST TWO ELECTRICAL COMPONENTS AT A CARRIER MOUNTED WITH ELECTRONIC AND/OR ELECTRICAL DEVICES, SAID BOND BEING FORMED BY A BOND WIRE

Semiconductor module

Power module assembly with dual substrates and reduced inductance

Methods, circuits and systems for a package structure having wireless lateral connections

Semiconductor device, electronic component and method

METHOD OF MAKING WIRING BOARD WITH INTERPOSER AND ELECTRONIC COMPONENT INCORPORATED WITH BASE BOARD

Package structures and method of forming the same

Optical proximity sensor and manufacturing method thereof

Microscale sensor structure with backside contacts and packaging of the same

Light emitting device and solder bond structure

Integrated circuit package for assembling various dice in a single IC package

Semiconductor device, and method of manufacturing the same

Semiconductor device having semiconductor chip with large and small irregularities on upper and lower side surface portions thereof

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly

SEMICONDUCTOR DEVICE

Semiconductor device and power conversion device including a bent control side frame

Resin molding and sensor device

Nitride semiconductor element and nitride semiconductor package

Method of making LED light bulb with thermal radiation filaments

Method for manufacturing semiconductor device

Package-on-package with cavity in interposer

Package structure and method of forming thereof

Semiconductor device structure and method for forming the same

Pad design for reliability enhancement in packages

Wiring board, electronic device, and electronic module

Semiconductor device including a bidirectional switch

Semiconductor device and manufacturing method of the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package thermal conduit

Accidental fuse programming protection circuits

Semiconductor module

Paste material, wiring member formed from the paste material, and electronic device including the wiring member

Methods related to implementing surface mount devices with ground paths

IGBT die structure with auxiliary P well terminal

Fingerprint sensing chip packaging method and fingerprint sensing chip package

Semiconductor package

Terminal structure of a power semiconductor device

Semiconductor package structure and fabrication method thereof

Multi-chip package and method of providing die-to-die interconnects in same

HIGH DENSITY SECOND LEVEL INTERCONNECTION FOR BUMPLESS BUILD UP LAYER (BBUL) PACKAGING TECHNOLOGY

Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks

Power module and fabrication method of the same, graphite plate, and power supply equipment

Thermal interface material layer and package-on-package device including the same

Manufacturing method of semiconductor device

Devices and methods related to radio-frequency switches having improved on-resistance performance

Method of producing a connection support, connection support and optoelectronic semiconductor component comprising a connection support

Semiconductor device including sense insulated-gate bipolar transistor

Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules

FABRICATION METHOD OF PACKAGE ON PACKAGE STRUCTURE

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor packages with leadframes and related methods

Wire bonding methods and systems incorporating metal nanoparticles

Protective film for semiconductors, semiconductor device, and composite sheet

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Packaged integrated circuit device with cantilever structure

Semiconductor devices and methods of making the same

Semiconductor device with island and associated leads

Bonding wire for semiconductor device

Electronic system having increased coupling by using horizontal and vertical communication channels

Stacked semiconductor package

Semiconductor package and method of manufacturing the semiconductor package

Package substrate having a plurality of chips electrically connected by conductive vias and wiring bonding

Method for making semiconductor device with sidewall recess and related devices

Bonding wire for semiconductor device

IC package

Cascode semiconductor package and related methods

Semiconductor device

SEMICONDUCTOR DEVICE PACKAGES AND METHOD OF MANUFACTURING THE SAME

Light emitting device and method for manufacturing light emitting device

Semiconductor light emitting apparatus, stem part

Semiconductor package

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

Integrated circuit module and method of forming same

Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device

Electronic device

Ring structures in device die

Module assembly

PLATED DITCH PRE-MOLD LEAD FRAME, SEMICONDUCTOR PACKAGE, AND METHOD OF MAKING SAME

HIGH POWER AND HIGH FREQUENCY PLASTIC PRE-MOLDED CAVITY PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SAME

Semiconductor device

Package with vertically spaced partially encapsulated contact structures

Manufacturing method of semiconductor device

Flip-chip beamforming integrated circuit with integral thermal mass

Beamforming integrated circuit with RF grounded material ring

Chip package structure and manufacturing method thereof

Ink printed wire bonding

Multi-chip package and method of manufacturing the same

Semiconductor package

Semiconductor package and method of fabricating semiconductor package

Electronic component module having a protective film comprising a protective layer and a low reflectivity layer having a rough outer surface and manufacturing method thereof

Semiconductor package device and method of manufacturing the same

Multi-layer leadless semiconductor package and method of manufacturing the same

Electronic device package using a substrate side coaxial interface

Chip package structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

Method and apparatus for detecting and removing defective integrated circuit packages

Manufacturing method of package-on-package structure

Semiconductor device and manufacturing method of the same

Connecting techniques for stacked CMOS devices

Semiconductor device and method of manufacturing the same

Cavity formation in backside interface layer for radio-frequency isolation

Device having substrate with conductive pillars

Semiconductor device and wiring board design method

Fan-out ball grid array package structure and process for manufacturing the same

Thermally conductive semiconductor device and manufacturing method thereof

Semiconductor device and method of forming interposer with opening to contain semiconductor die

Electrical interface for package and die

Cryogenic electronic packages and assemblies

Cryogenic electronic packages and methods for fabricating cryogenic electronic packages

Electronic system having increased coupling by using horizontal and vertical communication channels

Multi-phase power converter with common connections

Optoelectronic component with a first potting material covering parts of a first optoelectronic semiconductor chip and a second potting material covering the first potting material

Data storage device having multi-stack chip package and operating method thereof

Semiconductor package including stacked semiconductor chips electrically connected to redistribution layers

Power semiconductor module and method for manufacturing the same

Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet

Method of manufacturing a semiconductor power package

Semiconductor chip package having optical interface

Method of producing an interposer-chip-arrangement for dense packaging of chips

Method for forming ball in bonding wire

Semiconductor device

Molded lead frame device

CIRCUITS AND METHODS RELATED TO RADIO-FREQUENCY DEVICES WITH OVERMOLD STRUCTURE

Dual-sided radio-frequency package with overmold structure

Method of manufacturing semiconductor package

Semiconductor device

Semiconductor package

Lead and lead frame for power package

Semiconductor device

Semiconductor package and method for forming the same

Semiconductor device and manufacturing method thereof

Compound semiconductor substrate and fabrication method therefor, compound semiconductor device and fabrication method therefor, power supply apparatus and high-output amplifier

SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE

Semiconductor device

SEMICONDUCTOR PACKAGE AND METHOD FOR PREPARING SAME

Package substrate and semiconductor package including the same

Semiconductor device

Method for manufacturing semiconductor device

Method of manufacturing semiconductor device and semiconductor device

Semiconductor device

Method of manufacturing semiconductor device

Semiconductor package

Land structure for semiconductor package and method therefor

Package with roughened encapsulated surface for promoting adhesion

Semiconductor device, measurement device, and correction method

Radio-frequency isolation using cavity formed in interface layer

LIGHT EMITTING DIODES AND METHODS

Cavity formation using sacrificial material

Non-volatile memory with stacked semiconductor chips

Semiconductor device having stacked chips

Semiconductor device including two or more chips mounted over wiring substrate

METALLIC RIBBON FOR POWER MODULE PACKAGING

Pad design for reliability enhancement in packages

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Double-sided semiconductor package and dual-mold method of making same

Semiconductor package

Semiconductor device

Semiconductor module having supporting portion for fastening portion inside a through hole in a resin case

Semiconductor device and method of manufacturing the same

Semiconductor apparatus and semiconductor system including the same

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Multi terminal capacitor within input output path of semiconductor package interconnect

Scalable semiconductor interposer integration

Semiconductor device and method of forming a PoP device with embedded vertical interconnect units

Leadframe package with stable extended leads

Integrated circuit die and manufacture method thereof

Power module

Board for electronic component package, electronic component package, and method of manufacturing board for electronic component package

Method of manufacturing semiconductor device and semiconductor device

Intraoral dental radiological imaging sensor

Air-cavity package with two heat dissipation interfaces

Electronic package and method for fabricating the same

Wire bond wires for interference shielding

Electronic component mounting substrate, electronic device, and electronic module

Semiconductor chip package having a repeating footprint pattern

Method of fabricating a chip module with stiffening frame and orthogonal heat spreader

Chip module with stiffening frame and orthogonal heat spreader

ELECTRONIC CHIP DEVICE WITH IMPROVED THERMAL RESISTANCE AND ASSOCIATED MANUFACTURING PROCESS

Air cavity package

Air-cavity package with dual signal-transition sides

Method for remapping a packaged extracted die

Semiconductor package with multiple molding routing layers and a method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor package

Semiconductor device and mounting structure of semiconductor device

Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same

Integrated circuit die having a split solder pad

POWER SEMICONDUCTOR DEVICE

Multi terminal capacitor within input output path of semiconductor package interconnect

Mounted semiconductor module with a mold resin portion

Integrated circuit die having a split solder pad

Memories and memory components with interconnected and redundant data interfaces

METHOD FOR PRODUCING A MULTIPLICITY OF CONVERSION ELEMENTS, CONVERSION ELEMENT, AND OPTOELECTRONIC DEVICE

Intelligent power module and manufacturing method thereof

Semiconductor device

CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION

Semiconductor integrated circuit device