207826 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#5402LPS solder paste based low cost fine pitch pop interconnect solutions
#5403Remapped packaged extracted die
#5404Method of manufacturing a semiconductor device
#5405Cavity package with composite substrate
#5406Support terminal integral with die pad in semiconductor package
#5407Semiconductor device with lead terminals having portions thereof extending obliquely
#5408Electronic device
#5409Fabrication method of electronic package
#5410Limiting electronic package warpage
#5411LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE ATTACH PADS
#5412Memory device comprising programmable command-and-address and/or data interfaces
#5413Systems and methods for single-molecule nucleic-acid assay platforms
#5414Solid-state imaging device and imaging system
#5415Semiconductor package and method of fabricating the same
#5416Integrated electronic device with transceiving antenna and magnetic interconnection
#5417Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#5418Noise cancellation for a magnetically coupled communication link utilizing a lead frame
#5419Semiconductor device and manufacturing method thereof
#5420Low profile leaded semiconductor package and method of fabricating the same
#5421Multi-surface edge pads for vertical mount packages and methods of making package stacks
#5422Power module and motor drive circuit
#5423Power electronics module with first and second coolers
#5424Package with partially encapsulated cooling channel for cooling an encapsulated chip
#5425Semiconductor device
#5426Semiconductor packages having an electric device with a recess
#5427MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#5428Strip-type substrate for producing chip card modules
#5429MEMS capacitive shear sensor system having an interface circuit
#5430Multi-row LED wiring member and method for manufacturing the same
#5431Optoelectronic semiconductor component
#5432Semiconductor packages and methods of packaging semiconductor devices
#5433Double-encapsulated power semiconductor module and method for producing the same
#5434Semiconductor device and method of manufacturing same
#5435Manufacturing method of semiconductor device
#5436Embedded semiconductive chips in reconstituted wafers, and systems containing same
#5437Light detection device
#5438Heterojunction semiconductor device having source and drain pads with improved current crowding
#5439Semiconductor device and manufacturing method, and electronic appliance
#5440Solid state drive package
#5441Package-on-package assembly with wire bond vias
#5442Systems and methods for bonding semiconductor elements
#5443Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wire
#5444Integrated passive device for RF power amplifier package
#5445FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
#5446Semiconductor module
#5447Integrated circuit package assembly
#5448Wedge bonding component
#5449Radio frequency (RF) devices
#5450Stretchable electronics fabrication method with strain redistribution layer
#5451Semiconductor package
#5452Semiconductor device manufacturing method
#5453Semiconductor device
#5454Semiconductor module and power converter
#5455Package on-package structure
#5456Bottom package exposed die MEMS pressure sensor integrated circuit package design
#5457Fingerprint identification module and method for manufacturing the same
#5458Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereof
#5459Thermal transfer structures for semiconductor die assemblies
#5460Dense assembly of laterally soldered, overmolded chip packages
#5461Multi terminal capacitor within input output path of semiconductor package interconnect
#5462Lead frame and method of fabricating the same
#5463Electronic components with integral lead frame and wires
#5464Semiconductor device with solders of different melting points and method of manufacturing
#5465Semiconductor device package and methods of manufacture thereof
#5466Semiconductor device and measurement device
#5467Method of manufacturing a circuit device
#5468Magnetic memory device
#5469Light emitting device and method of manufacturing the light emitting device
#5470SEMICONDUCTOR LIGHT EMITTING ELEMENT WITH DISPERSIVE OPTICAL UNIT AND ILLUMINATION DEVICE COMPRISING THE SAME
#5471Semiconductor device having first and second electrode layers electrically disconnected from each other by a slit
#5472Semiconductor chip package with resilient conductive paste post and fabrication method thereof
#5473Semiconductor device
#5474Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
#5475Mechanisms for forming bonding structures
#5476Stud bump structure for semiconductor package assemblies
#5477Side ported MEMS sensor device package and method of manufacturing thereof
#5478Methods for forming shielded radio-frequency modules having reduced area
#5479Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methods
#5480Semiconductor component and method of manufacture
#5481Semiconductor device and method of manufacturing the same
#5482Semiconductor device
#5483Repackaged integrated circuit assembly method
#5484Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#5485ULTRASONIC FINGERPRINT RECOGNITION MODULE AND MANUFACTURING METHOD THEREOF
#5486Semiconductor device with first and second chips and connections thereof and a manufacturing method of the same
#5487Tamper detection for a chip package
#5488Semiconductor device package with strip line structure and high frequency semiconductor device thereof
#5489Package-on-package type semiconductor device including fan-out memory package
#5490Semiconductor device
#5491Wafer level chip scale semiconductor package
#5492Method for manufacturing wiring board
#5493Packaging mechanisms for dies with different sizes of connectors
#5494METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#5495Electrically conductive composition
#5496Using inter-tier vias in integrated circuits
#5497Light-emitting apparatus
#5498Semiconductor device with a wire bonding and a sintered region, and manufacturing process thereof
#5499Bonding wire for semiconductor device
#5500Electronic part embedded substrate and method of producing an electronic part embedded substrate
#5501Electronic Device
#5502SEMICONDUCTOR PACKAGES WITH SUB-TERMINALS AND RELATED METHODS
#5503Field emission devices and methods of making thereof
#5504Camera module and electronic device
#5505Integrated circuit package including miniature antenna
#5506Semiconductor package
#5507Semiconductor assembly with package on package structure and electronic device including the same
#5508Heat-dissipating semiconductor package for lessening package warpage
#5509Ring-frame power package
#5510Semiconductor device substrate, semiconductor device wiring member and method for manufacturing them, and method for manufacturing semiconductor device using semiconductor device substrate
#5511Isolating noise sources and coupling fields in RF chips
#5512Semiconductor device, power conversion apparatus, and vehicle
#5513Devices and methods related to singulated radio-frequency devices
#5514METHOD FOR PROTECTING BOND PADS FROM CORROSION
#5515Semiconductor device including antistatic die attach material
#5516Bonding structure and method
#5517Semiconductor package with multiple molding routing layers and a method of manufacturing the same
#5518Semiconductor device and power conversion device using same
#5519Semiconductor package with multiple molding routing layers and a method of manufacturing the same
#5520Semiconductor package with multiple molding routing layers and a method of manufacturing the same
#5521High reliability housing for a semiconductor package
#5522Half-bridge power semiconductor module and method of manufacturing same
#5523Methods of forming wire interconnect structures
#5524Structure and method of forming a joint assembly
#5525Chip carriers and semiconductor devices including redistribution structures with improved thermal and electrical performance
#5526Mounting jig for semiconductor device
#5527Device and Method for UBM/RDL Routing
#5528Power semiconductor module and electric power steering apparatus using the same
#5529POWER SEMICONDUCTOR MODULE WITH SHORT-CIRCUIT FAILURE MODE
#5530Semiconductor package and fabrication method thereof
#5531Manufacturing method of semiconductor package and manufacturing method of semiconductor device
#5532Semiconductor module and method of manufacturing semiconductor module
#5533Semiconductor package assembly
#5534Electronic package and method for fabricating the same
#5535Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact
#5536Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound
#5537Chip package and method of forming a chip package
#5538Fingerprint sensor and manufacturing method thereof
#5539Power module with low stray inductance
#5540Racetrack layout for radio frequency isolation structure
#5541LED module
#5542Semiconductor device and method of manufacturing the same
#5543Data storage device having multi-stack chip package and operating method thereof
#5544Bond pad structure for bonding improvement
#5545Floating die package
#5546Semiconductor package
#5547CTE compensation for wafer-level and chip-scale packages and assemblies
#5548Semiconductor device including sensor and driving terminals spaced away from the semiconductor device case wall
#5549Method of fabricating a circuit module
#5550Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof
#5551Board-to-board contactless connectors and methods for the assembly thereof
#5552Stacked wafer-level packaging devices
#5553METHOD OF PRODUCING A CARRIER AND METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT
#5554Poly silicon based interface protection
#5555Integrated circuit assembly that includes stacked dice
#5556Chip arrangements
#5557Bonding wire for semiconductor device
#5558Electronic device provided with an integral conductive wire and method of manufacture
#5559Single layer integrated circuit package
#5560System-in-package module with memory
#5561Reflector markers and systems and methods for identifying and locating them
#5562Semiconductor device having die pad
#5563Applicant screening
#5564Semiconductor device and method of manufacturing same
#5565Semiconductor device and power module
#5566Device including a semiconductor chip monolithically integrated with a driver circuit in a semiconductor material
#5567Sensor
#5568Semiconductor device, semiconductor chip, and test method for semiconductor chip
#5569Stack frame for electrical connections and the method to fabricate thereof
#5570Board level shields with virtual grounding capability
#5571Optical sensor module and sensor chip thereof
#5572Chip on package structure and method
#5573Semiconductor device
#5574Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
#5575Printed circuit board and semiconductor package
#5576Interposer and method for manufacturing interposer
#5577Electronic component package and method of manufacturing the same
#5578Interfaces and die packages, and appartuses including the same
#5579Directly Cooled Substrates for Semiconductor Modules
#5580Surface mount device stacking for reduced form factor
#5581Manufacturing method of semiconductor package
#5582Crystal packaging with conductive pillars
#5583Selectively shielding radio frequency module with multi-layer antenna
#5584Selective shielding of radio frequency modules
#5585Thin film light emitting diode
#5586RADIO FREQUENCY TRANSMISSION LINE WITH FINISH PLATING ON CONDUCTIVE LAYER
#5587Clamping system, wire bonding machine, and method for bonding wires
#5588Printed wiring board
#5589MICROELECTRONIC DEVICES AND METHODS FOR FILLING VIAS IN MICROELECTRONIC DEVICES
#5590Methods for selectively shielding radio frequency modules
#5591Semiconductor device and method for manufacturing the same
#5592Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#5593X-RAY SYSTEM, SEMICONDUCTOR PACKAGE, AND TRAY HAVING X-RAY ABSORPTION FILTER
#5594Semiconductor package and manufacturing method thereof
#5595Semiconductor packages and methods for forming semiconductor package
#5596Semiconductor device and method for manufacturing the same
#5597Robust low inductance power module package
#5598Fabrication method of semiconductor package
#5599Power semiconductor device and method for manufacturing the same
#5600Semiconductor package with elastic coupler and related methods
#5601Method of fabricating a carrier-less silicon interposer using photo patterned polymer as substrate
#5602Package for an implantable neural stimulation device
#5603METHOD FOR PRODUCING PRINTED WIRING BOARD
#5604Pre-encapsulated lead frames for microelectronic device packages, and associated methods
#5605Embedded chip packages and methods for manufacturing an embedded chip package
#5606Substrate for system in package (SIP) devices
#5607Method and device for controlling operation using temperature deviation in multi-chip package
#5608WIRE CONNECTING METHOD AND TERMINAL
#5609Method of manufacturing semiconductor device
#5610Semiconductor device and method of manufacturing the same
#5611Systems and methods for electromagnetic interference shielding
#5612Alignment mark design for packages
#5613Contact Expose Etch Stop
#5614Electronic apparatus with pocket of low permittivity material to reduce electromagnetic interference
#5615Power semiconductor module and method for manufacturing the same
#5616Semiconductor device
#5617Method for manufacturing semiconductor device
#5618Package-on-package assembly with wire bonds to encapsulation surface
#5619Curable heat radiation composition
#5620Current breaker
#5621Electronic device with integrated galvanic isolation, and manufacturing method of the same
#5622Integrated system and method of making the integrated system
#5623Semiconductor package
#5624Die stack assembly using an edge separation structure for connectivity through a die of the stack
#5625Structure and method for stabilizing leads in wire-bonded semiconductor devices
#5626Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#5627Surface mount device package having improved reliability
#5628Resin composition
#5629Hybrid carbon-metal interconnect structures
#5630A NOVEL LED SUPPORT STRUCTURE
#5631Dual lead frame semiconductor package and method of manufacture
#5632DIFFUSION BARRIER LAYER FOR RADIO FREQUENCY TRANSMISSION LINE
#5633Mobile device with radio frequency transmission line
#5634Radio frequency transmission line
#5635Semiconductor device and semiconductor device mounting structure having conductor plates
#5636COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAID COATED BOND WIRES
#5637Semiconductor device and a method of manufacturing thereof
#5638Semiconductor device
#5639Sensor chip package assembly and electronic device having sensor chip package assembly
#5640Semiconductor device having a resin case with a notch groove
#5641Semiconductor device and manufacturing method thereof
#5642Semiconductor device and method for manufacturing the same
#5643Leadframe leads having fully plated end faces
#5644Bonding wire-type heat sink structure for semiconductor devices
#5645CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING SAME
#5646Electronic device
#5647Printed adhesion deposition to mitigate integrated circuit delamination
#5648STRUCTURE OF CHIP ON SOFT PANEL AND LIQUID CRYSTAL DISPLAY PANEL EQUIPPED WITH CHIP ON SOFT PANEL
#5649Semiconductor device with metal patterns having convex and concave sides
#5650EMI/RFI shielding for semiconductor device packages
#5651Semiconductor device having conductive wire with increased attachment angle and method
#5652INTEGRATED CIRCUIT (IC) PACKAGE WITH A GROUNDED ELECTRICALLY CONDUCTIVE SHIELD LAYER AND ASSOCIATED METHODS
#5653Stacked chip-on-board module with edge connector
#5654Heat sink for cooling of power semiconductor modules
#5655Resin-encapsulated semiconductor device
#5656Chip on film package and display apparatus having the same
#5657Power amplifier modules with bonding pads and related systems, devices, and methods
#5658Methods of making semiconductor device packages and related semiconductor device packages
#5659Flexible window clamp
#5660SILVER BONDING WIRE AND METHOD OF MANUFACTURING THE SAME
#5661Signal transmission device using electromagnetic resonance coupler
#5662Semiconductor device
#5663Substrate for Optical Device
#5664LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING MODULE COMPRISING SAME
#5665Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips
#5666Semiconductor device and method of stacking semiconductor die for system-level ESD protection
#5667Integrated circuit package and methods of forming same
#5668Multi-access memory system and a method to manufacture the system
#5669Integrated circuit device with overvoltage discharge protection
#5670Alignment mark design for packages
#5671Semiconductor package having multi-phase power inverter with internal temperature sensor
#5672Semiconductor device including a clip
#5673Semiconductor device
#5674Chip capacitor, circuit assembly, and electronic device
#5675Wireless communication device
#5676Method of manufacturing printed circuit board
#5677Fan-out package structure and method for forming the same
#5678Integrated circuit chip packaging
#5679Method for manufacturing semiconductor device
#5680THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAME
#5681Integrated circuit chip packaging including a heat sink topped cavity
#5682DISPLAY DRIVING DEVICE
#5683LED filament and LED light bulb
#5684Semiconductor photomultiplier
#5685Semiconductor device and manufacturing method
#5686Multichip modules and methods of fabrication
#5687Integrated circuit device
#5688Shielded lead frame packages
#5689Method for reinforcing conductor tracks of a circuit board
#5690POP structures with dams encircling air gaps and methods for forming the same
#5691Methods for making multi-die package with bridge layer
#5692Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
#5693Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
#5694Method of manufacturing a common mode filter
#5695Carrier, carrier leadframe, and light emitting device
#5696Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
#5697Power converter monolithically integrating transistors, carrier, and components
#5698Inter-chip alignment
#5699Method for a stacked and bonded semiconductor device
#5700Millimeter wave integrated circuit with ball grid array package including transmit and receive channels