207826 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
Methods of manufacturing an integrated circuit having stress tuning layer
#5702Power quad flat no-lead (PQFN) package in a single shunt inverter circuit
#5703Semiconductor device
#5704Thermoelectric cooling packages and thermal management methods thereof
#5705Chip part and method of making the same
#5706Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area
#5707Method of manufacturing semiconductor device having semiconductor chip mounted on lead frame
#5708Switching circuits having ferrite beads
#5709Hall-effect sensor isolator
#5710Attaching chip attach medium to already encapsulated electronic chip
#5711Electrode terminal, semiconductor device, and power conversion apparatus
#5712Laser-induced forming and transfer of shaped metallic interconnects
#5713Semiconductor devices and methods of manufacture thereof
#5714Power semiconductor device load terminal
#5715Circuit board and smart card module and smart card utilizing the same
#5716Resin-encapsulated semiconductor device
#5717Semiconductor device manufacturing method
#5718Semiconductor device packaging assembly, lead frame strip and unit lead frame with molding compound channels
#5719Semiconductor packaging structure and package having stress release structure
#5720Power semiconductor module having a pressure application body and arrangement therewith
#57213D semiconductor device and system
#5722Bonding wire for semiconductor device
#57233D semiconductor device and structure
#5724Low switching loss high performance power module
#5725Semiconductor device
#5726Shielded QFN package and method of making
#5727Semiconductor device and manufacturing method thereof
#5728Apparatus and associated method
#5729Semiconductor packages having redistribution substrate
#5730Structure and method of reinforcing a conductor soldering point of semiconductor device
#5731Semiconductor device
#5732Printed circuit board, semiconductor package including the printed circuit board, and method of manufacturing the printed circuit board
#5733Mold release film, process for its production, and process for producing semiconductor package
#5734Production method for a detection apparatus and detection apparatuses
#5735Optical module
#5736Light source module
#5737Wire bonded electronic devices to round wire
#5738Power overlay structure and reconstituted semiconductor wafer having wirebonds
#5739Bonding wire for semiconductor device
#5740Bonding wire for semiconductor device
#5741Carrier-free semiconductor package and fabrication method
#5742Method and materials for warpage thermal and interconnect solutions
#5743Directional backlights with light emitting element packages
#5744LED module
#5745Packaged LEDs with phosphor films, and associated systems and methods
#5746Power semiconductor device integrated with ESD protection circuit under source pad, drain pad, and/or gate pad
#5747Apparatus and methods for electrical overstress protection
#5748SEMICONDUCTOR MODULE
#5749Semiconductor device and portable apparatus using the same
#5750Radio frequency power component and radio frequency signal transceiving device
#5751Package substrate, method for fabricating the same, and package device including the package substrate
#5752Leadless electronic packages for GAN devices
#5753Wire support for a leadframe
#5754Semiconductor package, semiconductor device using the same and manufacturing method thereof
#5755Printed adhesion deposition to mitigate integrated circuit package delamination
#5756TRACKPAD SEMICONDUCTOR PACKAGE OF SMART DEVICE AND MANUFACTURING METHOD OF SAME
#5757Conductor pad for flexible circuits and flexible circuit incorporating the same
#5758Method of producing an integrated power transistor circuit having a current-measuring cell
#5759Microelectronic package with horizontal and vertical interconnections
#57603D semiconductor memory device and structure
#5761Semiconductor module
#5762Semiconductor device and semiconductor device manufacturing method
#5763Semiconductor package structure based on cascade circuits
#5764Wiring substrate
#5765Power semiconductor arrangement
#5766Structure for die probing
#5767Semiconductor device, electronic control unit and vehicle apparatus
#5768Flexible electronic system with wire bonds
#5769Semiconductor apparatus
#5770Flipped die stacks with multiple rows of leadframe interconnects
#5771Copper wire and electrode joining method and joint structure
#5772Process of forming an electronic device including a ball bond
#5773ELECTRICAL INTERCONNECTIONS FOR SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME
#5774Semiconductor structure
#5775Semiconductor device
#5776Semiconductor devices with improved thermal and electrical performance
#5777Semiconductor package having a leadframe with multi-level assembly pads
#5778Semiconductor device
#5779Electronic component package and method of manufacturing the same
#5780Integrated circuit packages with temperature sensor traces
#5781Semiconductor device and electric power control apparatus
#5782Semiconductor package
#5783Memory devices with controllers under memory packages and associated systems and methods
#5784Method for producing a bondable coating on a carrier strip
#5785Electronic package having a supporting board and package carrier thereof
#5786Three dimensional device integration method and integrated device
#5787High power and high frequency plastic pre-molded cavity package
#5788Semiconductor package system and related methods
#5789Automotive electronic device having a cover with fins to reduce gel vibration
#5790Semiconductor light-emitting device, method for producing same, and display device
#5791Enhancement-mode III-nitride devices
#5792Capacitor formed on heavily doped substrate
#5793Fingerprint recognition chip packaging structure and packaging method
#5794Method of manufacturing a semiconductor device
#5795Semiconductor device
#5796Edge interconnect packaging of integrated circuits for power systems
#5797Semiconductor device, package, and vehicle
#5798Semiconductor device and method for manufacturing semiconductor device
#5799Thermally conductive sheet and semiconductor device
#5800Semiconductor device
#5801Semiconductor device with lead frame
#5802Power module package and method for manufacturing the same
#5803Electronic device component with an integral diamond heat spreader
#5804Semiconductor device
#5805Method for fabricating stack die package
#5806Memory package including buffer, expansion memory module, and multi-module memory system
#5807Solid-state imaging device, manufacturing method thereof, and electronic apparatus
#5808Half-bridge power semiconductor module and manufacturing method therefor
#5809Stackable molded microelectronic packages
#5810Methods of forming connector pad structures, interconnect structures, and structures thereof
#5811Integrated circuit package substrate
#5812Heterojunction semiconductor device for reducing parasitic capacitance
#5813Semiconductor package including a device and lead frame used for the same
#5814Compact system with memory and PMU integration
#5815Adhesive film and semiconductor package using adhesive film
#5816Broadband radio frequency power amplifiers, and methods of manufacture thereof
#5817Semiconductor module with bus bar including stacked wiring layers
#5818Semiconductor device and method for making semiconductor device
#5819Semiconductor device
#5820SEMICONDUCTOR DEVICE
#5821Through-electrode substrate, method for manufacturing same, and semiconductor device in which through-electrode substrate is used
#5822Wiring board, electronic device, and electronic module
#5823Power electronic switching device comprising a plurality of potential surfaces
#5824Fingerprint recognition chip packaging structure and packaging method
#5825Single-package wireless communication device
#5826Multi-die fine grain integrated voltage regulation
#5827Semiconductor device
#5828Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
#5829Distribution of electronic circuit power supply potentials
#5830Semiconductor chip mounted on a packaging substrate
#5831Semiconductor devices and methods of making the same
#5832Dual-interface IC card
#5833Fingerprint recognition chip packaging structure and packaging method
#5834Method for fabricating an electronic device and a stacked electronic device
#5835Solid-state imaging device, manufacturing method thereof, and electronic apparatus
#5836Three-dimensional package structure
#5837SEMICONDUCTOR DEVICE WITH A RESIN LAYER AND METHOD OF MANUFACTURING THE SAME
#5838Integrated circuit device
#5839Bond Wire Connection
#5840Semiconductor device and semiconductor package including the same
#5841Semiconductor device and method of controlling warpage in reconstituted wafer
#5842Pad structure design in fan-out package
#5843Package structure and fabricating method thereof
#5844Strip-shaped substrate for producing chip carriers, electronic module with a chip carrier of this type, electronic device with a module of this type, and method for producing a substrate
#5845Semiconductor device
#58463D system-level packaging methods and structures
#5847Low profile leaded semiconductor package
#5848Leadless semiconductor packages, leadframes therefor, and methods of making
#5849Recessed lead leadframe packages
#5850Leadframe and semiconductor device
#5851Board for electronic component package, electronic component package, and method of manufacturing board for electronic component package
#5852Solenoid inductor
#5853Semiconductor chip package having optical interface
#5854Integrated circuit device, electronic device, electronic apparatus, and base station
#5855Semiconductor device with oscillation frequency error correction
#5856Light emitting device mount, leadframe, and light emitting apparatus
#5857Semiconductor device and method of manufacturing the same
#5858Semiconductor device, electronic component, and electronic device
#5859Semiconductor device, memory device, electronic device, or method for driving the semiconductor device
#5860Method for producing a power semiconductor module
#5861Semiconductor package including stepwise stacked chips
#5862Coated bond wires for die packages and methods of manufacturing said coated bond wires
#5863Electronic device, electronic part, and solder
#5864Interconnection substrates for interconnection between circuit modules, and methods of manufacture
#5865Semiconductor device and leadframe
#5866Semiconductor package with coated bonding wires and fabrication method thereof
#5867Lead frame assembly
#5868Bridging DMB structure for wire bonding in a power semiconductor module
#5869Semiconductor device
#5870On-bonder automatic overhang die optimization tool for wire bonding and related methods
#5871High-frequency modules
#5872Semiconductor device and semiconductor package
#5873Semiconductor packages and methods of forming the same
#5874Wire bond wires for interference shielding
#5875Circuit package with segmented external shield to provide internal shielding between electronic components
#5876Leadframe
#5877Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium
#5878Lid structure and semiconductor device package including the same
#5879Semiconductor device leadframe
#5880Leadframe package with pre-applied filler material
#5881Semiconductor chip module and semiconductor package including the same
#5882Radio-frequency isolation using front side opening
#5883Embedded wire bond wires
#5884Semiconductor device and method for manufacturing same
#5885Method for fabricating package structure
#5886Resin structure having electronic component embedded therein, and method for manufacturing said structure
#5887DBC structure using a support incorporating a phase change material
#5888Flow passage member and semiconductor module
#5889Laser-induced forming and transfer of shaped metallic interconnects
#5890SEMICONDUCTOR PACKAGE
#5891Semiconductor chips including redistribution interconnections and related semiconductor packages
#5892SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME
#5893Semiconductor device load terminal
#5894SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME
#5895Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package
#5896Die attachment for packaged semiconductor device
#5897Apparatus and methods for PIN diode switches for radio frequency electronic systems
#5898Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#5899Package structure and method for forming same
#5900Semiconductor device and method of manufacturing semiconductor device
#5901Semiconductor chip with multilayer solenoid coil and multi-chip module comprising the same
#5902Packaged integrated circuit device with cantilever structure
#5903Semiconductor device
#5904Electronic device provided with an integral conductive wire and method of manufacture
#5905Fault tolerant memory systems and components with interconnected and redundant data interfaces
#5906Switching circuits having ferrite beads
#5907Package structures and method of forming the same
#5908Stacked microfeature devices and associated methods
#5909Semiconductor package assemblies with system-on-chip (SOC) packages
#5910Compact semiconductor package and related methods
#5911Multi-chip package, system and test method thereof
#5912Semiconductor packages including flexible wing interconnection substrate
#5913Semiconductor device and production method therefor
#5914Semiconductor package, semiconductor device using the same and manufacturing method thereof
#5915Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies
#5916Wireless communication with dielectric medium
#5917Semiconductor device with stripe-shaped trench gate structures and gate connector structure
#5918Semiconductor storage device and manufacturing method thereof
#5919Wire connecting method and terminal
#5920System-level packaging structures
#5921Low cost hybrid high density package
#5922Semiconductor device having terminals directly attachable to circuit board
#5923Wafer-level flipped die stacks with leadframes or metal foil interconnects
#5924Cascode semiconductor package and related methods
#5925Semiconductor device
#5926Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
#5927Fingerprint sensing unit and fingerprint sensing module
#5928Apparatus and methods for radio frequency amplifiers
#5929Light emitting diodes, components and related methods
#5930Wafer-level packaging using wire bond wires in place of a redistribution layer
#5931Semiconductor package and method of forming the same
#5932Semiconductor device
#5933Radio frequency integrated circuit module
#5934SEMICONDUCTOR DEVICE INCLUDING PASSIVE EQUALIZER CIRCUIT
#5935Power converter package with integrated output inductor
#5936Optoelectronic device
#5937Semiconductor device packages, packaging methods, and packaged semiconductor devices
#5938Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
#5939Package structure
#5940Method for manufacturing wire bonding structure, wire bonding structure, and electronic device
#5941Semiconductor device and manufacturing method thereof
#5942Semiconductor device, and method of fabricating the same
#5943Semiconductor devices and methods of making the same
#5944Semiconductor device
#5945System and methods for producing modular stacked integrated circuits
#5946Method of manufacturing semiconductor device and semiconductor device
#5947Selecting a substrate to be soldered to a carrier
#5948Memory system
#5949Display apparatus with a data driving chip and a gate driving chip disposed on a same side of a display panel
#5950Unpacked structure for power device of radio frequency power amplification module and assembly method therefor
#5951Back-to-back stacked dies
#5952Wire bonding methods and systems incorporating metal nanoparticles
#5953Semiconductor device having wire formed with loop portion and method for producing the semiconductor device
#5954Semiconductor apparatus, method for manufacturing the same, electronic device, and moving body
#5955Packaged semiconductor device having leadframe features preventing delamination
#5956High current switch
#5957Nitride semiconductor device
#5958PACKAGING ARRANGEMENTS INCLUDING A SERIALIZING DRAM INTERFACE DIE
#5959Semiconductor packages having EMI shielding parts and methods of fabricating the same
#5960Semiconductor device
#5961Packaged semiconductor chips having heat dissipation layers and ground contacts therein
#5962Stack frame for electrical connections and the method to fabricate thereof
#5963Three-dimensional one-time-programmable memory comprising off-die address/data-translator
#5964Apparatus and methods related to conformal coating implemented with surface mount devices
#5965Semiconductor device
#5966Semiconductor device
#5967High speed, efficient SiC power module
#5968Heterojunction semiconductor device for reducing parasitic capacitance
#5969Method of assembly semiconductor device with through-package interconnect
#5970Method for producing a light emitting device
#5971Semiconductor device, semiconductor package, and method for manufacturing semiconductor device
#5972Semiconductor device having a protective material with a first pH formed around cooper wire bonds and aluminum pads for neutralizes a second pH of an outer encapsulant material
#5973Contactless communication unit connector assemblies with signal directing structures
#5974Optoelectronic component and method of production thereof
#5975Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#5976Low pressure sintering powder
#5977Resin-encapsulated semiconductor device and its manufacturing method
#5978Semiconductor device and method for manufacturing the same
#5979Semiconductor device
#5980Carrier structure, packaging substrate, electronic package and fabrication method thereof
#5981Semiconductor package
#5982Solid state drive package and data storage system including the same
#5983Electric magnetic shielding structure in packages
#5984Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same
#5985Shielded module having compression overmold
#5986Semiconductor component and method of manufacture
#5987Semiconductor component and method of manufacture
#5988Semiconductor component and method of manufacture
#5989Resin-encapsulatd semiconductor device and method of manufacturing the same
#5990Method for determining a bonding connection in a component arrangement and test apparatus
#5991Interfaces and die packages, and apparatuses including the same
#5992Electronic device module and method of manufacturing the same
#5993Microelectronic assemblies with cavities, and methods of fabrication
#5994Shaped lead terminals for packaging a semiconductor device for electric power
#5995Interposer and circuit substrate
#5996Semiconductor device
#5997Semiconductor device
#5998Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
#5999Semiconductor device
#6000Solid-state drive