207826 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
Lead-free soldering method and soldered article
#6002Semiconductor device with lead terminals having portions thereof extending obliquely
#6003LEAD FRAME INCLUDING U-NOTCH
#6004Power electronics module with load connection elements
#6005Semiconductor device
#6006Nitride semiconductor element and nitride semiconductor package
#6007Semiconductor device package having an oscillator and an apparatus having the same
#6008Semiconductor package having an isolation wall to reduce electromagnetic coupling
#6009Optoelectronic component and method of producing an optoelectronic component
#6010Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same
#6011Stacked integrated circuits with redistribution lines
#6012Die-bonding layer formation film, processed product having die-bonding layer formation film attached thereto, and semiconductor device
#6013Semiconductor integrated circuit device
#6014Leadframe package with stable extended leads
#6015Packaging structure, packaging method and template used in packaging method
#6016Power amplifier modules including tantalum nitride terminated through wafer via and related systems, devices, and methods
#6017Power amplifier modules with harmonic termination circuit and related systems, devices, and methods
#6018High voltage device with multi-electrode control
#6019Multilayer semiconductor integrated circuit device
#6020Semiconductor device having recessed edges and method of manufacture
#6021Die package with low electromagnetic interference interconnection
#6022SEMICONDUCTOR WIRE BONDING AND METHOD
#6023Die packaging with fully or partially fused dielectric leads
#6024Power amplifier modules with power amplifier and transmission line and related systems, devices, and methods
#6025Semiconductor package in package
#6026Power semiconductor package device having locking mechanism, and preparation method thereof
#6027Heat isolation structures for high bandwidth interconnects
#6028Semiconductor structure and a method of making thereof
#6029DISPLAY DEVICE
#6030SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#6031Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same
#6032Package substrate and semiconductor package including the same
#6033Electronic device with periphery contact pads surrounding central contact pads
#6034Semiconductor device package for debugging and related fabrication methods
#6035Mixed impedance leads for die packages and method of making the same
#6036Electrically insulating thermal interface on the discontinuity of an encapsulation structure
#6037Semiconductor package including substrates spaced by at least one electrical connecting element
#6038Jig for fabricating semiconductor device
#6039Electrically testable microwave integrated circuit packaging
#6040Etching-before-packaging horizontal chip 3D system-level metal circuit board structure and technique thereof
#6041Light emitting device
#6042Method for producing semiconductor device, and wire-bonding apparatus
#6043Method of manufacturing wafer level packaging including through encapsulation vias
#6044Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices
#6045Semiconductor device that transfers an electric signal with a set of inductors
#6046Semiconductor device
#6047Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
#6048Semiconductor device including structure to control underfill material flow
#6049Radio frequency shielding within a semiconductor package
#6050Resonant circuit including bump pads
#6051Semiconductor-on-insulator with back side heat dissipation
#6052Apparatus for stacked semiconductor packages and methods of fabricating the same
#6053Semiconductor package
#6054Semiconductor device manufacturing method, semiconductor device, and wire bonding apparatus
#6055Discharge examination device, wire-bonding apparatus, and discharge examination method
#6056Semiconductor device comprising regions of different current drive capabilities
#6057Electronic part embedded substrate and method of producing an electronic part embedded substrate
#6058Semiconductor power package and method of manufacturing the same
#6059Method of fabricating a chip module with stiffening frame and directional heat spreader
#6060Semiconductor package including barrier members and method of manufacturing the same
#6061Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#6062Fingerprint sensor and manufacturing method thereof
#6063Reversible top/bottom MEMS package
#6064Solder material and connected structure
#6065Power module packaging structure and method for manufacturing the same
#6066Semiconductor module with two auxiliary emitter conductor paths
#6067Display device
#6068Package-on-package structures and methods for forming the same
#6069Semiconductor device having stacked chips
#6070Printed circuit board, method, and semiconductor package
#6071Ball forming device, wire-bonding apparatus, and ball formation method
#6072Wire bonding apparatus and method of manufacturing semiconductor device
#6073Printed circuit boards having blind vias, method of testing electric current flowing through blind via thereof and method of manufacturing semiconductor packages including the same
#6074Shielded electronic component package
#6075INTEGRATED CIRCUIT
#6076Impedance matching configuration
#6077Semiconductor device
#6078Printed circuit board, package substrate comprising same, and method for manufacturing same
#6079Power semiconductor module
#6080Semiconductor package and mounting structure thereof
#6081Package for a surface-mount semiconductor device and manufacturing method thereof
#6082Limiting electronic package warpage with semiconductor chip lid and lid-ring
#6083Semiconductor structure having thermal backside core
#6084Package structure with an elastomer with lower elastic modulus
#6085Stacked semiconductor die assemblies with support members and associated systems and methods
#6086Package-on-package semiconductor assemblies and methods of manufacturing the same
#6087Semiconductor lead frame, semiconductor package, and manufacturing method thereof
#6088Semiconductor device
#6089Semiconductor device having a cooler
#6090Waterproof electronic device and manufacturing method thereof
#6091Heat dissipating component, manufacturing method for heat dissipating component, electronic device, manufacturing method for electronic device, integrated module, and information processing system
#6092Radio frequency isolation using substrate opening
#6093Radio frequency isolation cavity formation using sacrificial material
#6094Stacked semiconductor die assemblies with die support members and associated systems and methods
#6095Connecting techniques for stacked CMOS devices
#6096Moisture barrier for semiconductor structures with stress relief
#6097Cavity formation in semiconductor devices
#6098Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area
#6099Semiconductor device and method of forming a thin wafer without a carrier
#6100Backside cavity formation in semiconductor devices
#6101Cavity formation in interface layer in semiconductor devices
#6102Manufacturing method of a resin molded article
#6103Circuit packages including modules that include at least one integrated circuit
#6104Portable power supply unit with bus bar adapter and tool-less connection
#6105Methods of forming conductive and insulating layers
#6106Package-on-package type semiconductor device which is realized through applying not a TSV technology but a fan-out wafer level package technology
#6107Ball bonding metal wire bond wires to metal pads
#6108Semiconductor structure with sacrificial anode and method for forming
#6109Semiconductor packages having semiconductor chips disposed in opening in shielding core plate
#6110PACKAGE SUBSTRATE AND METHODS FOR MANUFACTURING THE SAME
#6111Stacking arrangement for integration of multiple integrated circuits
#6112Electronic power device with improved cooling
#6113Semiconductor chip package assembly with improved heat dissipation performance
#6114Methods for connecting inter-layer conductors and components in 3D structures
#6115Magneto-resistive chip package including shielding structure
#6116Electronic module comprising fluid cooling channel and method of manufacturing the same
#6117WIRE BOND STRENGTHENING
#6118Semiconductor device and method for manufacturing the same
#6119Integration of backside heat spreader for thermal management
#6120Semiconductor device, and alternator and power conversion device which use same
#6121Bonding wire for semiconductor devices
#6122Semiconductor package manufacturing method
#6123Method of fabricating a lead frame by additive process
#6124Electronic components with integral lead frame and wires
#6125Semiconductor device
#6126MOSFET with reduced resistance
#6127Methods for packaging integrated circuits
#6128Semiconductor packages including interconnection members
#6129Plastic-packaged semiconductor device having wires with polymerized insulating layer
#6130Method of fabricating semiconductor device having voids between top metal layers of metal interconnects
#6131High-frequency device including high-frequency switching circuit
#6132Monolithic microwave integrated circuit
#6133High voltage polymer dielectric capacitor isolation device
#6134Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
#6135METHOD OF MAKING A QFN PACKAGE
#6136Combined packaged power semiconductor device
#6137Semiconductor device
#6138Wiring board and semiconductor package
#6139Structure and method to minimize warpage of packaged semiconductor devices
#6140Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same
#6141Semiconductor device
#6142Method and device for controlling operation using temperature deviation in multi-chip package
#6143Double-sided semiconductor package and dual-mold method of making same
#6144Cavity package with composite substrate
#6145Semiconductor device
#6146Power module and method of manufacturing power module
#6147Integrated circuit structure and method of forming
#6148Switching device and electronic circuit
#6149Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#6150SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE ARRAY, AND IMAGE FORMATION APPARATUS
#6151Method for manufacturing semiconductor device including step of simultaneous formation of plurality of contact openings
#6152Three-dimensional vertical memory comprising dice with different interconnect levels
#6153Chip on package structure and method
#6154Stacked package configurations and methods of making the same
#6155Methods for forming semiconductor device packages
#6156Semiconductor device
#6157Electrode terminal, semiconductor device for electrical power, and method for manufacturing semiconductor device for electrical power
#6158Guard structure for signal isolation
#6159Circuit assemblies with multiple interposer substrates, and methods of fabrication
#6160Lead frame with deflecting tie bar for IC package
#6161Semiconductor package
#6162Semiconductor device packages
#6163Semiconductor device with sloped sidewall and related methods
#6164Encapsulating resin composition, semiconductor device using the encapsulating resin composition, and method for manufacturing semiconductor device using the encapsulating resin composition
#6165COATED WIRE FOR BONDING APPLICATIONS
#6166Semiconductor package with integrated output inductor using conductive clips
#6167Electronic device and method for production
#6168Semiconductor substrate structure, semiconductor package and method of manufacturing the same
#6169Chip package structure and manufacturing method therefor
#6170Bendable and stretchable electronic devices and methods
#6171Semiconductor device and manufacturing method
#6172Current sensor isolation
#6173Window clamp
#6174Integrated circuit package
#6175Tunable composite interposer
#6176Semiconductor package and mobile device using the same
#6177Chip part and method of making the same
#6178Semiconductor device and method of forming an embedded SoP fan-out package
#6179Non-vertical through-via in package
#6180Semiconductor device and method of forming stacked vias within interconnect structure for FO-WLCSP
#6181Structure for die probing
#6182LEAD FRAME STRUCTURE, METHOD OF MANUFACTURING LEAD FRAME STRUCTURE, AND SEMICONDUCTOR DEVICE
#6183Adjustable losses of bond wire arrangement
#6184Semiconductor device and method of manufacturing the same
#6185Stub minimization for assemblies without wirebonds to package substrate
#6186Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips
#6187Semiconductor package assembly
#6188Resin-encapsulated semiconductor device and method of manufacturing the same
#6189Embedded circuit package
#6190Systems and Methods for Main Distribution on an Integrated Circuit
#6191Method of manufacturing semiconductor package and semiconductor package
#6192Semi-conductor module with an encapsulating cement mass that covers a semi-conductor component
#6193Method for package-on-package assembly with wire bonds to encapsulation surface
#6194Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#6195Packaged integrated circuit including a switch-mode regulator and method of forming the same
#6196SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
#6197Semiconductor device package and method of manufacturing the same
#6198Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#6199Apparatus and method for inspecting a semiconductor package
#6200Integrated circuit underfill scheme
#6201Method of manufacturing semiconductor device and semiconductor device
#6202Hybrid circuit device
#6203Semiconductor device
#6204Wire bonding method
#6205Compensation of bondwires in the microwave regime
#6206Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#6207Light-emitting apparatus
#6208Circuit device and method for the production thereof
#6209Power package lid
#6210Noise cancellation for a magnetically coupled communication link utilizing a lead frame
#6211Semiconductor device with an isolation structure coupled to a cover of the semiconductor device
#6212Semiconductor device
#6213Semiconductor device and manufacturing method of same
#6214Semiconductor modules and methods of forming the same
#6215Singulation method for semiconductor package with plating on side of connectors
#6216Microfluidic delivery member with filter and method of forming same
#6217Amplifier
#6218Magnetically coupled galvanically isolated communication using lead frame
#6219Semiconductor packages and methods of forming the same
#6220Multi-die wirebond packages with elongated windows
#6221Reliable interconnect
#6222Electronic component, semiconductor package, and electronic device using the same
#6223Semiconductor chip package having contact pins at short side edges
#6224Power semiconductor module
#6225Multiple die stacking for two or more die
#6226SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, MEMORY CARDS INCLUDING THE SAME AND ELECTRONIC SYSTEMS INCLUDING THE SAME
#6227Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
#6228Electrode connection structure and electrode connection method
#6229Method of manufacturing semiconductor package
#6230SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#6231Semiconductor device
#6232Semiconductor device
#6233Semiconductor device
#6234Module and method for manufacturing the module
#6235High-frequency semiconductor amplifier
#6236Optoelectronic light-emitting component and leadframe assemblage
#6237Offset interposers for large-bottom packages and large-die package-on-package structures
#62383D package with through substrate vias
#6239Semiconductor device
#6240Package carrier, semiconductor package, and process for fabricating same
#6241Method of manufacturing a circuit device
#6242Package-on-package assembly with wire bonds to encapsulation surface
#6243Semiconductor packages having wire bond wall to reduce coupling
#6244Lead portion of semiconductor device
#6245Leadless chip carrier having improved mountability
#6246Method of producing a semiconductor package
#6247Manufacturing method of semiconductor device
#6248Chip capacitor, circuit assembly, and electronic device
#6249Fingerprint sensor package and method for fabricating the same
#6250Connection pads for a fingerprint sensing device
#6251Semiconductor pressure sensor
#6252High current, low switching loss SiC power module
#6253Semiconductor device and method of manufacturing the same
#6254Semiconductor packages with heat dissipation layers and pillars and methods for fabricating the same
#6255Semiconductor package and method of manufacturing the same
#6256IC package
#6257Semiconductor package with die paddle
#6258Wireless communication link using near field coupling
#6259Contoured package-on-package joint
#6260MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#6261Package carrier
#6262Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die
#6263Method of manufacturing a semiconductor device including through silicon plugs
#6264Embedded semiconductive chips in reconstituted wafers, and systems containing same
#6265Isolator with reduced susceptibility to parasitic coupling
#6266Light emitting device
#6267Semiconductor packages and related methods
#6268Three dimensional device integration method and integrated device
#6269Packaged semiconductor devices having ribbon wires
#6270Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof
#6271Stacked chip-on-board module with edge connector
#6272Electronic device having a lead with selectively modified electrical properties
#6273Electronic devices and methods of manufacturing electronic devices
#6274Thermal interface material layer and package-on-package device including the same
#6275Discrete three-dimensional one-time-programmable memory
#6276Three-dimensional one-time-programmable memory comprising off-die read/write-voltage generator
#6277Detecting and driving load using transistor
#6278Semiconductor photomultiplier
#6279Corrosion-resistant copper bonds to aluminum
#6280Methods of manufacturing an integrated circuit having stress tuning layer
#6281Semiconductor device and lead frame having two leads welded together
#6282Semiconductor device and production method therefor
#6283Semiconductor device and its manufacturing method
#6284Method for preventing die pad delamination
#6285Environmental hardened packaged integrated circuit
#6286Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
#6287Multi-chips in system level and wafer level package structure
#6288Memory module in a package
#6289Semiconductor package including a plurality of stacked chips
#6290Compact semiconductor package and related methods
#6291Semiconductor devices with impedance matching-circuits
#6292EMI/RFI shielding for semiconductor device packages
#6293Integrated circuit device with plating on lead interconnection point and method of forming the device
#6294Integrated circuit (IC) package with a solder receiving area and associated methods
#6295Package structure and fabrication method thereof
#6296Power module and method for manufacturing the same
#6297DC-DC converter with a switching transistor arranged in an area where an inductor overlaps a substrate
#6298Structure of battery protection circuit module package coupled with holder, and battery pack having same
#6299Process of fabrication of electronic devices and electronic device with a double encapsulation ring
#6300Semiconductor device and method for manufacturing the semiconductor device