POP structures with dams encircling air gaps and methods for forming the same

Microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation

Package apparatus and manufacturing method thereof

Method of packaging integrated circuits

Semiconductor device and manufacturing method for the same

Chip structure having bonding wire

Radio frequency isolation structure with racetrack

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor package having improved package-on-package interconnection

Semiconductor die and package jigsaw submount

Flow sensor package

High-frequency module

Electronic component housing package and electronic apparatus

Light emitting device mount, leadframe, and light emitting apparatus

Semiconductor device and an electronic device

Nitride semiconductor element and nitride semiconductor package

Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate

Switching element with a series-connected junction FET (JFET) and MOSFET achieving both improved withstand voltage and reduced on-resistance

Semiconductor device and measurement device

Resin-encapsulated semiconductor device and its manufacturing method

Resin package with a groove for an embedded internal lead

Semiconductor device and method of manufacturing a semiconductor device

Memory devices with controllers under memory packages and associated systems and methods

Semiconductor package and method of forming the same

Thermally-enhanced three dimensional system-in-packages and methods for the fabrication thereof

Semiconductor device and manufacturing method thereof

Semiconductor device with a wire bonding and a sintered region, and manufacturing process thereof

Semiconductor device and manufacturing method thereof

Printed circuit board

Integrated matching circuit for a high frequency amplifier

Semiconductor device

Semiconductor device

Method for manufacturing a semiconductor device, and semiconductor device

Chip package and method for forming the same

Package structure and fabrication method thereof

Reliability improvement of polymer-based capacitors by moisture barrier

Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line

Semiconductor device including an embedded surface mount device and method of forming the same

Semiconductor package

Semiconductor die arrangement

Method for manufacturing cooler for semiconductor-module, cooler for semiconductor-module, semiconductor-module and electrically-driven vehicle

Light emitting device

Integrated fan-out structure and method

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

Coated bonding wire and methods for bonding using same

Cavity package with pre-molded cavity leadframe

Semiconductor device comprising a conductive film joining a diode and switching element

Semiconductor package with dual second level electrical interconnections

Die attachment for packaged semiconductor device

Packaged semiconductor device with interior polygonal pads

Semiconductor package

Package assembly and method for manufacturing the same

Electronic module having an electrically insulating structure with material having a low modulus of elasticity

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

3D packages and methods for forming the same

Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof

Semiconductor package and method of fabricating the same

Semiconductor system and device

Compact multi-die power semiconductor package

Compact single-die power semiconductor package

Electronic device with first and second contact pads and related methods

Semiconductor module, semiconductor device, and vehicle

Vertically integrated systems

Packaged semiconductor devices and packaging methods thereof

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip

Electronic module and method for producing an electronic module

LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate

Using MEMS fabrication incorporating into LED device mounting and assembly

Method of manufacturing a single light-emitting structure

Discrete flexible interconnects for modules of integrated circuits

Circuit substrate interconnect

Semiconductor device and method for manufacturing the same

High isolation wideband switch

Electronic devices with semiconductor die coupled to a thermally conductive substrate

SEMICONDUCTOR PACKAGE APPARATUS

Chip package and method for forming the same

Package-on-Package with via on pad connections

Multi-die package with bridge layer and method for making the same

Flexible circuit leads in packaging for radio frequency devices

Shielded radio-frequency module having reduced area

Integration of backside heat spreader for thermal management

Inclined photonic chip package for integrated optical transceivers and optical touchscreen assemblies

Semiconductor light-emitting device, method for producing same, and display device

Semiconductor device and method of manufacturing the same

Stackable molded microelectronic packages with area array unit connectors

Semiconductor package having cascaded chip stack

METHODS AND APPARATUSES FOR SHAPING AND LOOPING BONDING WIRES THAT SERVE AS STRETCHABLE AND BENDABLE INTERCONNECTS

Semiconductor device

Electronic device module and method of manufacturing the same

Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structure

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

BVA interposer

Semiconductor package including an embedded surface mount device and method of forming the same

Devices and methods related to metallization of ceramic substrates for shielding applications

Power conversion device

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Semiconductor device having recessed edges and method of manufacture

Integrated circuit package fabrication with die attach paddle having middle channels

Packaged semiconductor devices and methods of packaging thereof

Patterned grounds and methods of forming the same

Method of manufacturing RF power amplifier module, RF power amplifier module, RF module, and base station

Integrated circuit with electromagnetic communication

Semiconductor package and method for fabricating the same

WIRE BONDING USING ELEVATED BUMPS FOR SECURING BONDS

Intramodule radio frequency isolation

Semiconductor device and structure therefor

Method for manufacturing a chip arrangement

Chip on film package and display apparatus having the same

Electronic device, optical module and manufacturing process thereof

Hybrid carbon-metal interconnect structures

Metallized electric component

Package-on-package structure with organic interposer

Method for making a microelectronic assembly having conductive elements

Semiconductor packages and methods of forming the same

Wiring core structure, semiconductor evaluation device and semiconductor device

Semiconductor device

Semiconductor device and method of manufacturing the same

Multiple bond via arrays of different wire heights on a same substrate

Radio frequency module including segmented conductive ground plane

Thin plastic leadless package with exposed metal die paddle

Chip-on-film package having bending part

Systems and methods for thermal dissipation

Module arrangement for power semiconductor devices

Floating mold tool for semicondcutor packaging

Radio frequency module including segmented conductive top layer

Pad structure of a semiconductor device, method of manufacturing the pad structure and semiconductor package including the pad structure

Package-in-substrate, semiconductor device and module

Semiconductor package

Reinforcing sheet and method for producing secondary mounted semiconductor device

Composition for forming adhesive layer of dicing film, and dicing film

Light emitting device and method for manufacturing light emitting device

Stacked structure of semiconductor chips having via holes and metal bumps

Die stacking techniques in BGA memory package for small footprint CPU and memory motherboard design

Method of manufacturing semiconductor device

Stacked packaging improvements

Semiconductor device

Support member, wiring substrate, method for manufacturing wiring substrate, and method for manufacturing semiconductor package

Reconfigurable PoP

Integrated Circuit Device With Wire Bond Connections

Semiconductor device, and method for assembling semiconductor device

Manufacturing Method of Semiconductor Device

Electronic component with a leadframe

Discrete three-dimensional memory

Electronic component, manufacturing method for electronic component, electronic apparatus, and moving object

Semiconductor chip and method for forming a chip pad

Package structure and method for fabricating the same

Stacked synchronous buck converter having chip embedded in outside recess of leadframe

Semiconductor device and lead frame used for the same

Wafer level flat no-lead semiconductor packages and methods of manufacture

SMD, IPD, and/or wire mount in a package

Semiconductor device with active shielding of leads

Semiconductor laser structure

Multi-band active antenna

Circuit device, electronic apparatus and moving object

Semiconductor device and manufacturing method for the same

Functional spacer for SIP and methods for forming the same

Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member

Wire bond mold lock method and structure

Anti-fuse on and/or in package

Stacked integrated circuits with redistribution lines

Package-on-package structure and methods for forming the same

SEMICONDUCTOR PACKAGE

Electronic device

Semiconductor device and method of manufacturing the same

Semiconductor device packages, packaging methods, and packaged semiconductor devices

Semiconductor device packages, packaging methods, and packaged semiconductor devices

Methods of fabricating QFN semiconductor package and metal plate

Bumps bonds formed as metal line interconnects in a semiconductor device

Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion

Fabrication method of packaging substrate

Power semiconductor device and power conversion device

Semiconductor module with ultrasonically welded terminals

Chip capacitors

Electronic device and mounting structure of the same

Circuit substrate and method for manufacturing the same

Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same

Integrated system and method of making the integrated system

Semiconductor device and method for making semiconductor device

Semiconductor device with metal film and method for manufacturing semiconductor device with metal film

Semiconductor chip, semiconductor package and fabricating method thereof

Semiconductor device and method for manufacturing same

Electronic device comprising an improved lead frame

Power semiconductor module

Semiconductor device and manufacturing method

Semiconductor device having low on resistance

Multiple bond via arrays of different wire heights on a same substrate

Surface finish for wirebonding

Method of forming a component having wire bonds and a stiffening layer

Semiconductor device and method for manufacturing the semiconductor device

Semiconductor package

Semiconductor packages and methods of packaging semiconductor devices

Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

Semiconductor device and manufacturing method of semiconductor device

Conductor structure for three-dimensional semiconductor device

Methods of packaging semiconductor devices and packaged semiconductor devices

Glass/ceramic replacement of epoxy for high temperature hermetically sealed non-axial electronic packages

Semiconductor device

Wire-pull test location identification on a wire of a microelectronic package

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Semiconductor device and semiconductor package

Semiconductor device having a device fixed on a substrate with an adhesive

Semiconductor device, semiconductor device design method, semiconductor device design apparatus, and program

Semiconductor device

Semiconductor device with a heat-dissipating plate

Heat spreading layer with high thermal conductivity

Millimeter wave integrated circuit with ball grid array package including transmit and receive channels

Stack of integrated-circuit chips and electronic device

Direct die solder of gallium arsenide integrated circuit dies and methods of manufacturing gallium arsenide wafers

Stackable molded microelectronic packages

Pad design for reliability enhancement in packages

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Power module semiconductor device

COATED WIRE FOR BONDING APPLICATIONS

Package and method for fabricating package

Semiconductor device

Methods, circuits and systems for a package structure having wireless lateral connections

Semiconductor device

Integrated electronic package and method of fabrication

Method for producing an electronic assembly

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Package on-package with cavity in interposer

Semiconductor device

3D semiconductor device having two layers of transistors

Enhanced flash chip and method for packaging chip

Package in package (PiP) electronic device and manufacturing method thereof

PACKAGE SUBSTRATE, PACKAGE, PACKAGE ON PACKAGE AND MANUFACTURING METHOD OF PACKAGE SUBSTRATE

Ring structures in device die

Alignment mark design for packages

SUBSTRATE FOR SEMICONDUCTOR PACKAGING AND METHOD OF FORMING SAME

Method for making semiconductor device with lead frame made from top and bottom components and related devices

Over-mold packaging for wide band-gap semiconductor devices

Semiconductor device and method for manufacturing the same

Semiconductor device with encapsulated lead frame contact area and related methods

Stack frame for electrical connections and the method to fabricate thereof

Electronic component device

Semiconductor device

Package on package structure

Integrated circuit package assembly

Microelectronic packages having cavities for receiving microelectronic elements

Compact semiconductor package and related methods

Printed wiring board, semiconductor package, and method for manufacturing printed wiring board

Molded chip package and method of manufacturing the same

Smart card module, smart card, and method for producing a smart card module

Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface

Semiconductor device and automobile

Detecting and driving load using MOS transistor

Structures and methods for shielding magnetically sensitive components

Off-chip vias in stacked chips

Bonding pad arrangment design for multi-die semiconductor package structure

Articles including bonded metal structures and methods of preparing the same

Semiconductor module bonding wire connection method

Semiconductor device with mechanical lock features between a semiconductor die and a substrate

Bonding wire to bonding pad

Semiconductor device having solderable and bondable electrical contact pads

Semiconductor package with shielding member and method of manufacturing the same

Printed circuit board having traces and ball grid array package including the same

Metal base substrate, power module, and method for manufacturing metal base substrate

Memory device comprising programmable command-and-address and/or data interfaces

Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system

Power amplifier modules with bifet and harmonic termination and related systems, devices, and methods

Power amplifier modules including bipolar transistor with grading and related systems, devices, and methods

Power amplifier modules including wire bond pad and related systems, devices, and methods

LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate

High-frequency device including high-frequency switching circuit

Systems and methods for high-speed, low-profile memory packages and pinout designs

Semiconductor device including sense insulated-gate bipolar transistor

Chip package and method for forming the same

Devices and methods for processing singulated radio-frequency units

Semiconductor device

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor device and a manufacturing method thereof

Semiconductor device with notched main lead

Flexible microelectronic systems and methods of fabricating the same

Devices and systems comprising drivers for power conversion circuits

Enhanced flash chip and method for packaging chip

Low forward voltage rectifier

Semiconductor package and semiconductor package mounting structure

Light emitting device

Semiconductor device and method of fabricating semiconductor device

Method of manufacturing stacked semiconductor package

Wafer, package structure and method of manufacturing the same

Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same

Binding wire and semiconductor package structure using the same

Semiconductor device and method of forming bump-on-lead interconnection

Semiconductor package and system with an isolation structure to reduce electromagnetic coupling

Integrated circuit package including miniature antenna

Semiconductor package and method for fabricating the same

Integrated electronic device including an interposer structure and a method for fabricating the same

RECONSTITUTION TECHNIQUES FOR SEMICONDUCTOR PACKAGES

Wire bonding apparatus

Device including multiple semiconductor chips and multiple carriers

Semiconductor device and method of manufacturing the semiconductor device

Semiconductor apparatus including a heat dissipating member

Method of fabricating a packaging substrate including a carrier having two carrying portions

Biocompatible packaging

Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide

Semiconductor device having semiconductor element bonded to base body by adhesive member