H01L24/48 - page 33 - CPC Classification Index

#9601

20110221058

2011-09-15

Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces

#9602

20110221052

2011-09-15

Lead frame for semiconductor device and method of manufacturing of the same

#9603

20110221051

2011-09-15

Leadframe based multi terminal IC package

#9604

20110221050

2011-09-15

Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device

#9605

20110221048

2011-09-15

Package having spaced apart heat sink

#9606

20110221046

2011-09-15

SEMICONDUCTOR ASSEMBLY PACKAGE HAVING SHIELDING LAYER AND METHOD THEREFOR

#9607

20110221033

2011-09-15

High power semiconductor device for wireless applications and method of forming a high power semiconductor device

#9608

20110221028

2011-09-15

Multilayered board semiconductor device with BGA package

#9609

20110221008

2011-09-15

Semiconductor packaging and fabrication method using connecting plate for internal connection

#9610

20110221005

2011-09-15

Integrated circuit package for semiconductior devices with improved electric resistance and inductance

#9611

20110220916

2011-09-15

Electronic circuit device

#9612

20110219611

2011-09-15

Enhanced integrated circuit package

#9613

20110217877

2011-09-08

METHOD FOR SIMULTANEOUSLY FORMING A MECHANICAL AND ELECTRICAL CONNECTION BETWEEN TWO PARTS

#9614

20110217837

2011-09-08

CONNECTING PAD PRODUCING METHOD

#9615

20110216455

2011-09-08

Semiconductor package and semiconductor device

#9616

20110215746

2011-09-08

SEMICONDUCTOR DEVICE

#9617

20110215481

2011-09-08

Semiconductor device

#9618

20110215475

2011-09-08

Multi-surface IC packaging structures

#9619

20110215469

2011-09-08

METHOD FOR FORMING A DOUBLE EMBOSSING STRUCTURE

#9620

20110215464

2011-09-08

Semiconductor package with embedded die and its methods of fabrication

#9621

20110215460

2011-09-08

Stacked semiconductor chips with separate encapsulations

#9622

20110215456

2011-09-08

Thin package system with external terminals and method of manufacture thereof

#9623

20110215455

2011-09-08

Semiconductor device capable of switching operation mode and operation mode setting method therefor

#9624

20110215446

2011-09-08

Chip package and method for fabricating the same

#9625

20110215438

2011-09-08

Stacked semiconductor package having discrete components

#9626

20110215400

2011-09-08

Semiconductor device

#9627

20110215343

2011-09-08

Semiconductor device and optical pickup device

#9628

20110212578

2011-09-01

Semiconductor device with copper wirebond sites and methods of making same

#9629

20110212577

2011-09-01

SEMICONDUCTOR POWER DEVICE HAVING A STACKED DISCRETE INDUCTOR STRUCTURE

#9630

20110212572

2011-09-01

Semiconductor device support for bonding

#9631

20110210956

2011-09-01

CURRENT SENSOR FOR A SEMICONDUCTOR DEVICE AND SYSTEM

#9632

20110210708

2011-09-01

High Frequency Power Supply Module Having High Efficiency and High Current

#9633

20110210455

2011-09-01

Die bond film, dicing die bond film, and semiconductor device

#9634

20110210446

2011-09-01

Semiconductor die having a redistribution layer

#9635

20110210442

2011-09-01

Manufacturing method for semiconductor package

#9636

20110210438

2011-09-01

Thermal vias in an integrated circuit package with an embedded die

#9637

20110210436

2011-09-01

Integrated circuit packaging system with encapsulation connector and method of manufacture thereof

#9638

20110210434

2011-09-01

Semiconductor device and method of manufacturing a semiconductor device

#9639

20110210432

2011-09-01

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#9640

20110210431

2011-09-01

Microwave circuit package

#9641

20110210420

2011-09-01

Semiconductor device having IPD structure with smooth conductive layer and bottom-side conductive layer

#9642

20110209908

2011-09-01

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

#9643

20110208906

2011-08-25

Semiconductor memory device with plural memory die and controller die

#9644

20110207266

2011-08-25

Printed circuit board (PCB) including a wire pattern, semiconductor package including the PCB, electrical and electronic apparatus including the semiconductor package, method of fabricating the PCB, and method of fabricating the semiconductor package

#9645

20110205739

2011-08-25

Light emitting device

#9646

20110205719

2011-08-25

Electronic component

#9647

20110205701

2011-08-25

Resin-sealed electronic control device and method of fabricating the same

#9648

20110204976

2011-08-25

Impedance transformer, integrated circuit device, amplifier, and communicator module

#9649

20110204887

2011-08-25

Current sensors and methods

#9650

20110204858

2011-08-25

Semiconductor circuit and switching power supply apparatus

#9651

20110204514

2011-08-25

PACKAGE DEVICE AND FABRICATION METHOD THEREOF

#9652

20110204512

2011-08-25

Wirebondless wafer level package with plated bumps and interconnects

#9653

20110204510

2011-08-25

Chip structure

#9654

20110204507

2011-08-25

Two-shelf interconnect

#9655

20110204506

2011-08-25

Thermal interface material design for enhanced thermal performance and improved package structural integrity

#9656

20110204505

2011-08-25

Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier

#9657

20110204502

2011-08-25

Method of manufacturing a semiconductor device

#9658

20110204500

2011-08-25

Power device packages having thermal electric modules using peltier effect and methods of fabricating the same

#9659

20110204499

2011-08-25

Semiconductor device assemblies

#9660

20110204498

2011-08-25

LEAD FRAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREWITH

#9661

20110204494

2011-08-25

Integrated circuit packaging system with shield and method of manufacture thereof

#9662

20110204472

2011-08-25

Semiconductor Device and Method of Forming 3D Inductor from Prefabricated Pillar Frame

#9663

20110204464

2011-08-25

Micro-optical device packaging system

#9664

20110201160

2011-08-18

METAL-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME

#9665

20110201159

2011-08-18

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

#9666

20110201158

2011-08-18

Selective removal of gold from a lead frame

#9667

20110201157

2011-08-18

Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace

#9668

20110201155

2011-08-18

Manufacturing method of semiconductor device

#9669

20110201153

2011-08-18

Integrated circuit packaging system and method of manufacture thereof

#9670

20110199749

2011-08-18

Led lead frame structure

#9671

20110199737

2011-08-18

Semiconductor package

#9672

20110199613

2011-08-18

Method for manufacturing optical device, optical device, and biological information detector

#9673

20110199473

2011-08-18

Semiconductor apparatus and endoscope apparatus

#9674

20110199213

2011-08-18

RFID integrated circuit with integrated antenna structure

#9675

20110199158

2011-08-18

Semiconductor device

#9676

20110199116

2011-08-18

METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE

#9677

20110198760

2011-08-18

Semiconductor device, semiconductor package, interposer, semiconductor device manufacturing method and interposer manufacturing method

#9678

20110198752

2011-08-18

Lead frame ball grid array with traces under die

#9679

20110198751

2011-08-18

Method of improving adhesion of bond pad over pad metallization with a neighboring passivation layer by depositing a palladium layer

#9680

20110198744

2011-08-18

Land grid array package capable of decreasing a height difference between a land and a solder resist

#9681

20110198742

2011-08-18

Semiconductor device and electronic device

#9682

20110198741

2011-08-18

Integrated circuit package with enlarged die paddle

#9683

20110198740

2011-08-18

Semiconductor storage device and manufacturing method thereof

#9684

20110198739

2011-08-18

Method for manufacturing semiconductor device

#9685

20110198737

2011-08-18

Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same

#9686

20110198735

2011-08-18

Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly

#9687

20110198662

2011-08-18

Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace

#9688

20110195530

2011-08-11

Semiconductor device and a method of manufacturing the same

#9689

20110195529

2011-08-11

Rule-based semiconductor die stacking and bonding within a multi-die package

#9690

20110194273

2011-08-11

Light emitting device, method for manufacturing the same, and backlight unit

#9691

20110194265

2011-08-11

Embedded component substrate and manufacturing methods thereof

#9692

20110193243

2011-08-11

Unique Package Structure

#9693

20110193237

2011-08-11

Method for making semiconductor package

#9694

20110193215

2011-08-11

SEMICONDUCTOR PACKAGE

#9695

20110193213

2011-08-11

Stacked semiconductor package

#9696

20110193212

2011-08-11

Systems and Methods Providing Arrangements of Vias

#9697

20110193209

2011-08-11

Semiconductor package

#9698

20110193208

2011-08-11

Semiconductor package of a flipped MOSFET and its manufacturing method

#9699

20110193207

2011-08-11

LEAD FRAME FOR SEMICONDUCTOR DIE

#9700

20110193205

2011-08-11

Semiconductor device packages having stacking functionality and including interposer

#9701

20110193204

2011-08-11

SEMICONDUCTOR DEVICE

#9702

20110193192

2011-08-11

Stacked-die electronics package with planar and three-dimensional inductor elements

#9703

20110192885

2011-08-11

WIREBONDING PROCESS

#9704

20110189821

2011-08-04

Semiconductor device

#9705

20110187009

2011-08-04

Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device

#9706

20110187007

2011-08-04

Edge connect wafer level stacking

#9707

20110187003

2011-08-04

Power semiconductor device

#9708

20110186998

2011-08-04

Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate

#9709

20110186994

2011-08-04

Integrated circuit packaging system having dual sided connection and method of manufacture thereof

#9710

20110186993

2011-08-04

Semiconductor module and portable apparatus provided with semiconductor module

#9711

20110186992

2011-08-04

Recessed semiconductor substrates and associated techniques

#9712

20110186983

2011-08-04

Package for housing semiconductor element and semiconductor device using the same

#9713

20110186978

2011-08-04

STACK PACKAGE

#9714

20110186976

2011-08-04

Method of manufacturing a semiconductor device

#9715

20110186962

2011-08-04

Semiconductor device and method of manufacturing the same

#9716

20110186960

2011-08-04

TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES

#9717

20110186901

2011-08-04

LED package

#9718

20110186898

2011-08-04

Semiconductor package structure

#9719

20110186885

2011-08-04

LED assembly with a protective frame

#9720

20110186868

2011-08-04

LED PACKAGE

#9721

20110186340

2011-08-04

Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, and light-emitting device

#9722

20110186220

2011-08-04

Apparatus for manufacturing bonding structure, bonding structure and method of fabricating the same

#9723

20110183474

2011-07-28

Electronic device and manufacturing method of the same

#9724

20110183473

2011-07-28

Method of manufacturing a semiconductor device

#9725

20110183472

2011-07-28

Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole

#9726

20110183465

2011-07-28

Array-molded package-on-package having redistribution lines

#9727

20110182095

2011-07-28

PACKAGE FOR SYNCHRONOUS RECTIFIER MODULE

#9728

20110181350

2011-07-28

High frequency semiconductor device

#9729

20110180942

2011-07-28

Interconnection structure

#9730

20110180940

2011-07-28

Interconnection structure and its design method

#9731

20110180938

2011-07-28

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

#9732

20110180937

2011-07-28

Stacked package of semiconductor device

#9733

20110180936

2011-07-28

Semiconductor device structures and electronic devices including same hybrid conductive vias

#9734

20110180935

2011-07-28

Integrated circuit packaging system with conductive pillars and method of manufacture thereof

#9735

20110180934

2011-07-28

Semiconductor device

#9736

20110180933

2011-07-28

SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD

#9737

20110180928

2011-07-28

Etched recess package on package system

#9738

20110180916

2011-07-28

Multi-chip package having frame interposer

#9739

20110180914

2011-07-28

Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof

#9740

20110180913

2011-07-28

Method of stacking flip-chip on wire-bonded chip

#9741

20110180899

2011-07-28

Semiconductor device

#9742

20110180898

2011-07-28

SEMICONDUCTOR DEVICE

#9743

20110180855

2011-07-28

NON-DIRECT BOND COPPER ISOLATED LATERAL WIDE BAND GAP SEMICONDUCTOR DEVICE

#9744

20110180844

2011-07-28

Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation

#9745

20110180809

2011-07-28

Semiconductor device module

#9746

20110180590

2011-07-28

Method of manufacturing semiconductor device and wire bonding apparatus

#9747

20110180317

2011-07-28

ELECTRONIC COMPONENT PACKAGE, METHOD FOR PRODUCING THE SAME AND INTERPOSER

#9748

20110177657

2011-07-21

Semiconductor device

#9749

20110177643

2011-07-21

Fabrication method of package structure having MEMS element

#9750

20110177629

2011-07-21

Chip packaging with metal frame pin grid array

#9751

20110176339

2011-07-21

Signal transmission arrangement

#9752

20110176280

2011-07-21

Stacked semiconductor package

#9753

20110175241

2011-07-21

Semiconductor device and manufacturing method thereof

#9754

20110175240

2011-07-21

Chip module

#9755

20110175224

2011-07-21

Bonded structure and manufacturing method for bonded structure

#9756

20110175223

2011-07-21

Stacked semiconductor components having conductive interconnects

#9757

20110175222

2011-07-21

SEMICONDUCTOR PACKAGE

#9758

20110175218

2011-07-21

PACKAGE ASSEMBLY HAVING A SEMICONDUCTOR SUBSTRATE

#9759

20110175213

2011-07-21

Semiconductor device and manufacturing method thereof

#9760

20110175212

2011-07-21

Dual die semiconductor package

#9761

20110175210

2011-07-21

EMI shielding package structure and method for fabricating the same

#9762

20110175206

2011-07-21

Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material

#9763

20110175179

2011-07-21

Package structure having MEMS element

#9764

20110175136

2011-07-21

Semiconductor chip assembly with post/base heat spreader and plated through-hole

#9765

20110174865

2011-07-21

Method of teaching eyepoints for wire bonding and related semiconductor processing operations

#9766

20110174527

2011-07-21

ELEMENT MOUNTING BOARD, SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE ELEMENT MOUNTING BOARD, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

#9767

20110174523

2011-07-21

Arrangement for energy conditioning

#9768

20110171780

2011-07-14

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

#9769

20110171779

2011-07-14

Semiconductor device manufacturing method

#9770

20110171777

2011-07-14

Method of manufacturing semiconductor device

#9771

20110169641

2011-07-14

System and Method To Embed A Wireless Communication Device Into Semiconductor Packages

#9772

20110169576

2011-07-14

High frequency amplifier

#9773

20110169549

2011-07-14

Electronic devices and components for high efficiency power circuits

#9774

20110169478

2011-07-14

Laser optical path detection

#9775

20110169173

2011-07-14

WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCOTOR PACKAGE HAVING THE WIRING SUBSTRATE

#9776

20110169169

2011-07-14

Method for providing and connecting two contact areas of a semiconductor component or a substrate, and a substrate having two such connected contact areas

#9777

20110169166

2011-07-14

Semiconductor device sealed in a resin section and method for manufacturing the same

#9778

20110169165

2011-07-14

SEMICONDUCTOR DEVICE

#9779

20110169163

2011-07-14

Attaching passive components to a semiconductor package

#9780

20110169154

2011-07-14

Microelectronic devices

#9781

20110169150

2011-07-14

Semiconductor package with single sided substrate design and manufacturing methods thereof

#9782

20110169149

2011-07-14

Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof

#9783

20110169145

2011-07-14

Manufacturing method of lead frame substrate and semiconductor apparatus

#9784

20110169144

2011-07-14

Die package including multiple dies and lead orientation

#9785

20110169143

2011-07-14

Method for establishing and closing a trench of a semiconductor component

#9786

20110169115

2011-07-14

Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products

#9787

20110169102

2011-07-14

Semiconductor device including a DC-DC converter having a metal plate

#9788

20110169047

2011-07-14

Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation

#9789

20110169042

2011-07-14

Light emitting diode package and method for forming the same

#9790

20110169033

2011-07-14

Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same

#9791

20110168786

2011-07-14

System and Method To Embed A Wireless Communication Device Into Semiconductor Packages, including Chip-Scale Packages and 3D Semiconductor Packages

#9792

20110168785

2011-07-14

System and Method To Embed A Wireless Communication Device Into Semiconductor Packages

#9793

20110168784

2011-07-14

Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products

#9794

20110168564

2011-07-14

Plating method, semiconductor device fabrication method and circuit board fabrication method

#9795

20110168223

2011-07-14

Thermoelectric application for waste heat recovery from semiconductor devices in power electronics systems

#9796

20110165733

2011-07-07

Microelectronic packages and methods therefor

#9797

20110165732

2011-07-07

Semiconductor package having buss-less substrate

#9798

20110165731

2011-07-07

Method for Fabricating Array-Molded Package-on-Package

#9799

20110165729

2011-07-07

METHOD OF PACKAGING SEMICONDUCTOR DEVICE

#9800

20110163458

2011-07-07

Method for manufacturing electronic device and electronic device

#9801

20110163445

2011-07-07

Electronic packages with fine particle wetting and non-wetting zones

#9802

20110163439

2011-07-07

Die bonding a semiconductor device

#9803

20110163438

2011-07-07

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

#9804

20110163436

2011-07-07

Wiring board, semiconductor device and method for manufacturing the same

#9805

20110163435

2011-07-07

Lead frame substrate and method of manufacturing the same, and semiconductor device

#9806

20110163433

2011-07-07

Lead frame substrate, manufacturing method thereof, and semiconductor apparatus

#9807

20110163432

2011-07-07

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#9808

20110163431

2011-07-07

Semiconductor device and method of manufacturing the same

#9809

20110163430

2011-07-07

Leadframe Structure, Advanced Quad Flat No Lead Package Structure Using the Same, and Manufacturing Methods Thereof

#9810

20110163429

2011-07-07

Semiconductor chip package assembly with deflection-resistant leadfingers

#9811

20110163427

2011-07-07

Method and apparatus for directing molding compound flow and resulting semiconductor device packages

#9812

20110163412

2011-07-07

ISOLATOR AND METHOD OF MANUFACTURING THE SAME

#9813

20110163392

2011-07-07

Semiconductor device and method of manufacturing the same

#9814

20110163376

2011-07-07

High voltage devices and methods of forming the high voltage devices

#9815

20110163345

2011-07-07

Lead, wiring member, package component, metal component with resin, resin-encapsulated semiconductor device, and methods for producing the same

#9816

20110163085

2011-07-07

Method for Soldering Contact Wires to Solar Cells

#9817

20110159644

2011-06-30

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

#9818

20110159643

2011-06-30

Fabrication method of semiconductor package structure

#9819

20110159641

2011-06-30

Method of manufacturing semiconductor device

#9820

20110159238

2011-06-30

PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE FILM ADHESIVE, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT

#9821

20110157884

2011-06-30

OPTOELECTRONIC DEVICE

#9822

20110157858

2011-06-30

SYSTEM-IN-PACKAGE HAVING EMBEDDED CIRCUIT BOARDS

#9823

20110157851

2011-06-30

Package structure

#9824

20110157834

2011-06-30

HEAT/ELECTRICITY DISCRETE METAL CORE-CHIP ON BOARD MODULE

#9825

20110156682

2011-06-30

VOLTAGE CONVERTER WITH INTEGRATED SCHOTTKY DEVICE AND SYSTEMS INCLUDING SAME

#9826

20110156678

2011-06-30

Semiconductor device and DC-to-DC converter

#9827

20110156488

2011-06-30

Inductive relayed coupling circuit between substrates

#9828

20110156281

2011-06-30

Quad flat no lead (QFN) package

#9829

20110156275

2011-06-30

Integrated circuit packaging system having planar interconnect and method for manufacture thereof

#9830

20110156274

2011-06-30

SEMICONDUCTOR DEVICE

#9831

20110156269

2011-06-30

Semiconductor package and stack semiconductor package having the same

#9832

20110156260

2011-06-30

PAD STRUCTURE AND INTEGRATED CIRCUIT CHIP WITH SUCH PAD STRUCTURE

#9833

20110156252

2011-06-30

Semiconductor package having electrical connecting structures and fabrication method thereof

#9834

20110156251

2011-06-30

Semiconductor package

#9835

20110156243

2011-06-30

Semiconductor package

#9836

20110156241

2011-06-30

PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME

#9837

20110156238

2011-06-30

Semiconductor package having chip using copper process

#9838

20110156234

2011-06-30

Self repairing IC package design

#9839

20110156233

2011-06-30

Stack package

#9840

20110156229

2011-06-30

Semiconductor device package having a semiconductor chip on wiring board connected to plurality of leads including power MOSFETs

#9841

20110156228

2011-06-30

Semiconductor device

#9842

20110156227

2011-06-30

Semiconductor package structure

#9843

20110156226

2011-06-30

INTERPOSER AND SEMICONDUCTOR DEVICE

#9844

20110156225

2011-06-30

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#9845

20110156224

2011-06-30

Circular shield of a circuit-substrate laminated module and electronic apparatus

#9846

20110156204

2011-06-30

Semiconductor package and method for making the same

#9847

20110156188

2011-06-30

Image sensor packaging structure with black encapsulant

#9848

20110156094

2011-06-30

ELECTRICAL MODULE

#9849

20110156091

2011-06-30

Contacting a device with a conductor

#9850

20110156090

2011-06-30

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/POST HEAT SPREADER AND ASYMMETRIC POSTS

#9851

20110156035

2011-06-30

Disguising test pads in a semiconductor package

#9852

20110155423

2011-06-30

Circuit board and its wire bonding structure

#9853

20110151626

2011-06-23

Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts

#9854

20110151622

2011-06-23

Method of manufacturing semiconductor device

#9855

20110151195

2011-06-23

PHOTOSENSITIVE ADHESIVE COMPOSITION, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER AND SEMICONDUCTOR DEVICE USING THE PHOTOSENSITIVE ADHESIVE COMPOSITION

#9856

20110149620

2011-06-23

Device and method for limiting drain-source voltage of transformer-coupled push pull power conversion circuit

#9857

20110149540

2011-06-23

Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with a wire element

#9858

20110149493

2011-06-23

Systems employing a stacked semiconductor package

#9859

20110148545

2011-06-23

Apparatus and method for embedding components in small-form-factor, system-on-packages

#9860

20110148543

2011-06-23

Integrated circuit with inductive bond wires

#9861

20110148529

2011-06-23

Radio frequency amplifier with effective decoupling

#9862

20110147954

2011-06-23

SEMICONDUCTOR DEVICE, AND RESIN COMPOSITION USED FOR SEMICONDUCTOR DEVICE

#9863

20110147953

2011-06-23

Microelectronic assembly with joined bond elements having lowered inductance

#9864

20110147949

2011-06-23

Hybrid integrated circuit device

#9865

20110147934

2011-06-23

Metal plugged substrates with no adhesive between metal and polyimide

#9866

20110147933

2011-06-23

Multiple surface finishes for microelectronic package substrates

#9867

20110147931

2011-06-23

Lead frame land grid array with routing connector trace under unit

#9868

20110147928

2011-06-23

MICROELECTRONIC ASSEMBLY WITH BOND ELEMENTS HAVING LOWERED INDUCTANCE

#9869

20110147926

2011-06-23

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

#9870

20110147925

2011-06-23

Pre-soldered leadless package

#9871

20110147920

2011-06-23

Apparatus and method for embedding components in small-form-factor, system-on-packages

#9872

20110147919

2011-06-23

Window ball grid array (BGA) semiconductor packages

#9873

20110147917

2011-06-23

Integrated circuit package with embedded components

#9874

20110147911

2011-06-23

Stackable circuit structures and methods of fabrication thereof

#9875

20110147910

2011-06-23

METHOD FOR STACKING DIE IN THIN, SMALL-OUTLINE PACKAGE

#9876

20110147908

2011-06-23

Module for Use in a Multi Package Assembly and a Method of Making the Module and the Multi Package Assembly

#9877

20110147906

2011-06-23

Integrated circuit packaging system with embedded interconnect and method of manufacture thereof

#9878

20110147903

2011-06-23

Leadframe circuit and method therefor

#9879

20110147901

2011-06-23

Integrated circuit packaging system with package stacking and method of manufacture thereof

#9880

20110147899

2011-06-23

Integrated circuit package system employing device stacking

#9881

20110147859

2011-06-23

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#9882

20110147057

2011-06-23

Printed wiring board and method for manufacturing printed wiring board

#9883

20110146398

2011-06-23

Flow sensors having nanoscale coating for corrosion resistance

#9884

20110143662

2011-06-16

Semiconductor device and communication method

#9885

20110143500

2011-06-16

Semiconductor connection component

#9886

20110143499

2011-06-16

Vertically packaged MOSFET and IC power devices as integrated module using 3D interconnected laminates

#9887

20110141681

2011-06-16

External storage device and method of manufacturing external storage device

#9888

20110140287

2011-06-16

Integrated circuit packaging system with bond wire pads and method of manufacture thereof

#9889

20110140286

2011-06-16

Multilayer wiring substrate mounted with electronic component and method for manufacturing the same

#9890

20110140285

2011-06-16

Semiconductor device having a microcomputer chip mounted over a memory chip

#9891

20110140283

2011-06-16

Integrated circuit packaging system with a stackable package and method of manufacture thereof

#9892

20110140273

2011-06-16

Semiconductor devices including voltage switchable materials for over-voltage protection

#9893

20110140272

2011-06-16

Ball grid array package enhanced with a thermal and electrical connector

#9894

20110140268

2011-06-16

High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming same

#9895

20110140263

2011-06-16

Semiconductor device and method of forming PiP with inner known good die interconnected with conductive bumps

#9896

20110140261

2011-06-16

Integrated circuit packaging system with interconnect and method of manufacture thereof

#9897

20110140260

2011-06-16

Chip assembly with chip-scale packaging

#9898

20110140259

2011-06-16

Integrated circuit packaging system with stacking interconnect and method of manufacture thereof

#9899

20110140258

2011-06-16

Integrated circuit packaging system with package stacking and method of manufacture thereof

#9900

20110140256

2011-06-16

Semiconductor device, substrate and semiconductor device manufacturing method