Semiconductor device

Semiconductor package using copper wires and wire bonding method for the same

Integrated circuit package device with improved bond pad connections, a lead-frame and an electronic device

Semiconductor device and method for producing the same

Structure and method for self protection of power device with expanded voltage ranges

Semiconductor device

STACKED SEMICONDUCTOR DEVICE ASSEMBLY AND PACKAGE

Leadframe Configuration to Enable Strip Testing of SOT-23 Packages and the Like

Electronic flame-off electrode with ball-shaped tip

Printed wiring board and method for manufacturing printed wiring board

On chip transformer isolator

Semiconductor device

Semiconductor device

Power semiconductor module

Fabric type semiconductor device package and methods of installing and manufacturing same

Semiconductor device

Three-dimensional semiconductor device

Integration type semiconductor device and method for manufacturing the same

Semiconductor Device and Method for Fabricating the Same

Wiring board manufacturing method, semiconductor device manufacturing method and wiring board

Cut-out heat slug for integrated circuit device packaging

Heat-dissipating semiconductor package structure and method for manufacturing the same

Semiconductor packaging with internal wiring bus

Integrated circuit package system for package stacking and method of manufacture therefor

High Input/Output, Low Profile Package-On-Package Semiconductor System

Simplified Substrates for Semiconductor Devices in Package-on-Package Products

Ultra-thin chip packaging

Wiring board and semiconductor package using the same

LEAD FRAME FREE PACKAGE AND METHOD OF MAKING

Lead frame, semiconductor device using the lead frame, and methods of manufacturing the same

Leadframe for leadless package, structure and manufacturing method using the same

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Semiconductor device comprising a semiconductor chip stack and method for producing the same

Non-leaded semiconductor package and a method to assemble the same

Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the Same

Etched leadframe structure including recesses

Semiconductor device with power noise suppression

LIGHT-EMITTING DIODE AND METHOD FOR PRODUCING IT

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

LEAD FRAME, MOLDING DIE, AND MOLDING METHOD

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

Electronic Circuit Assembly, Device Comprising Such Assembly and Method for Fabricating Such Device

Power-MOSFETs with improved efficiency for multi-channel class-D audio amplifiers and packaging thereof

Molding apparatus, molded semiconductor package using multi-layered film, fabricating and molding method for fabricating the same

Chip stack package and method of fabricating the same

SEMICONDUCTOR DEVICE

Wire Bonds Having Pressure-Absorbing Balls

SEMICONDUCTOR DEVICE INCLUDING WIRING SUBSTRATE HAVING ELEMENT MOUNTING SURFACE COATED BY RESIN LAYER

Multi-chip module

Semiconductor device package having multi-chips with side-by-side configuration and method of the same

Package on-package secure module having BGA mesh cap

Package-on-package secure module having anti-tamper mesh in the substrate of the upper package

Curing layers of a semiconductor product using electromagnetic fields

Plastic package and method of fabricating the same

STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM

Semiconductor device

Semiconductor device

Semiconductor device

Apparatus for shielding integrated circuit devices

Mounted body and method for manufacturing the same

SEMICONDUCTOR PACKAGE

LOW-STRESS HERMETIC DIE ATTACH

Semiconductor module including semiconductor chips coupled to external contact elements

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Mounting substrate and electronic device

Wiring design support apparatus for bond wire of semiconductor devices

Integrated circuit carrier arrangement with electrical connection islands

Arrangement for Energy Conditioning

Solid-state image sensing device

Method And System for Output Matching of Rf Transistors

Semiconductor device and method of manufacturing same

Interconnect for chip level power distribution

Stack package, a method of manufacturing the stack package, and a digital device having the stack package

SEMICONDUCTOR DEVICE WITH BONDING PAD

Heat dissipation unit and a semiconductor package that has the heat dissipation unit

Semiconductor device

Semiconductor device

Integrated circuit device and method for the production thereof

Semiconductor device and method of manufacturing semiconductor device

Chip package structure

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

STACKED AND SHIELDED DIE PACKAGES WITH INTERCONNECTS

Detector system and detector subassembly

Electronic component assembly with composite material carrier

CIRCUIT BOARD STRUCTURE FOR EMBEDDING SEMICONDUCTOR CHIP THEREIN AND METHOD FOR FABRICATING THE SAME

Method of creating contour structures to highlight inspection region

METHOD OF MAKING SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Method for fabricating a low cost integrated circuit (IC) package

Method of assembling chips

Semiconductor device with electrode pad having probe mark

Semiconductor device

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, HEAT SINK, SEMICONDUCTOR CHIP, INTERPOSER SUBSTRATE, AND GLASS PLATE

Semiconductor device

Semiconductor device

Semiconductor package, method of fabricating the same, and semiconductor package mold

SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND

Semiconductor device and method of manufacturing the same

Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof

Integrated circuit package system with bonding in via

Semiconductor device

Semiconductor device including an insulating film and insulating pillars and manufacturing method of the semiconductor device

Semiconductor package

Semiconductor Package and Method for Fabricating the Same

Ball grid array package and its substrate

Semiconductor device

Semiconductor device and manufacturing method thereof

MULTI-CHIP SEMICONDUCTOR PACKAGE STRUCTURE

MULTI-CHIP SEMICONDUCTOR PACKAGE STRUCTURE

Package structure and manufacturing method thereof

Package structure and method of manufacturing the same

Controlling substrate surface properties via colloidal coatings

Semiconductor device and method of manufacturing the same

Composite semiconductor device

Image sensing devices including image sensor chips, image sensor package modules employing the image sensing devices, electronic products employing the image sensor package modules, and methods of fabricating the same

Semiconductor chip comprising a directional coupler having a specific main line and sub-line arrangement

Semiconductor device with different sized ESD protection elements

Light emitting diode lamp with low thermal resistance

LIGHT RECEIVING APPARATUS

Circuit board and circuit device

Method of wire bonding over active area of a semiconductor circuit

Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

Method for manufacturing a semiconductor device

CONVERSION SUBSTRATE FOR A LEADFRAME AND THE METHOD FOR MAKING THE SAME

Antenna device and radio communication device

Output Circuit

Semiconductor package land grid array substrate and plurality of first and second electrodes

Module comprising a semiconductor chip

Surface treatments for contact pads used in semiconductor chip packagages and methods of providing such surface treatments

Semiconductor device, semiconductor package for use therein, and manufacturing method thereof

Semiconductor device and its manufacturing method

Semiconductor device and method for manufacturing the same

Wire-bonded semiconductor component with reinforced inner connection metallization

Semiconductor integrated circuit device and fabrication process thereof

SEMICONDUCTOR PACKAGE USING WIRES CONSISTING OF Ag OR Ag ALLOY

Stackable semiconductor device and fabrication method thereof

Integrated circuit and method for producing the same

Semiconductor device with Al pad

Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip

Semiconductor device and method for manufacturing thereof

Chip package module

Structure and electronics device using the structure

Semiconductor device including mounting board with stitches and first and second semiconductor chips

Semiconductor package and the method of making the same

Semiconductor device package having multi-chips with side-by-side configuration and method of the same

CHIP PACKAGE STRUCTURE

Integrated circuit package system with lead support

SEMICONDUCTOR PACKAGE HAVING WIRE REDISTRIBUTION LAYER AND METHOD OF FABRICATING THE SAME

Leadframe design for QFN package with top terminal leads

Semiconductor light emitting device

HEAT BLOCK

Electronic part, method for fabricating electronic part, acceleration sensor, and method for fabricating acceleration sensor

System for fabricating semiconductor components with conductive interconnects

Fibrous laminate interface for security coatings

Wirebond structure and method to connect to a microelectronic die

Wire bonding method and related device for high-frequency applications

Integrated circuit package system employing multi-package module techniques

Method of joining chips utilizing copper pillar

Molded beam for optoelectronic sensor chip substrate

Semiconductor device and method of manufacturing the same

Power delivery package having through wafer vias

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Chip structure with bumps and testing pads

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor module with multiple semiconductor chips

Electronic device and method for producing electronic devices

Device having a bonding structure for two elements

METHOD, APPARATUS, AND SYSTEM FOR PHASE CHANGE MEMORY PACKAGING

Lead structure for a semiconductor component and method for producing the same

Base substrate for chip scale packaging

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Package structure and stacked package module using the same

Multi-chip package with a single die pad

Method and apparatus for fabricating a plurality of semiconductor devices

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Low cost lead-free preplated leadframe having improved adhesion and solderability

Multi-chip stack structure and fabrication method thereof

OPTOELECTRONIC DEVICE ALIGNMENT IN AN OPTOELECTRONIC PACKAGE

Power module having stacked flip-chip and method of fabricating the power module

CHIP PACKAGE STRUCTURE

Semiconductor device and method of manufacturing the same

Lead frame, semiconductor device, and method of manufacturing the semiconductor device

Vertical electrical interconnect formed on support prior to die mount

Circuit component and method of manufacture

CHIP PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor device package

Semiconductor device and manufacturing method of the same

BGA PACKAGE SUBSTRATE AND METHOD OF FABRICATING SAME

Semiconductor component and production method

Semiconductor module

Method of fabricating module having stacked chip scale semiconductor packages

Thin film deposition as an active conductor and method therefor

Electronic device, package having the same, and electronic apparatus

Class D amplifier arrangement

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns

Substrate with feedthrough and method for producing the same

Semiconductor device

Removal of integrated circuits from packages

Stacked-Chip Semiconductor Device

Semiconductor component and method of manufacture

Semiconductor device and method of manufacturing same

Chip package substrate and structure thereof

Package substrate strip, metal surface treatment method thereof and chip package structure

Semiconductor device and method of manufacturing the same

Substrate for mounting semiconductor element and method of manufacturing the same

Resin molded semiconductor device and differential amplifier circuit

Integrated passive cap in a system-in-package

Space-efficient package for laterally conducting device

Method for manufacturing the BGA package board

SEMICONDUCTOR PACKAGE HAVING ENHANCED HEAT DISSIPATION AND METHOD OF FABRICATING THE SAME

Resin encapsulation molding method for semiconductor device

Substrate based unmolded package

Thermosetting die bonding film

SEMICONDUCTOR COMPONENT

Carbon nanotube bond pad structure and method therefor

Semiconductor apparatus and mobile apparatus

Method of assembling chips

High temperature, stable SiC device interconnects and packages having low thermal resistance

Power semiconductor module and method for producing the same

Interposer for die stacking in semiconductor packages and the method of making the same

Electronic package and manufacturing method thereof

Planar multi semiconductor chip package and method of manufacturing the same

SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME

IC card and method of manufacturing the same

Memory IC package assembly having stair step metal layer and apertures

Semiconductor package configuration with improved lead portion arrangement

Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product

Semiconductor device

High-heat-resistive semiconductor device

Methods for fabricating semiconductor components with conductive interconnects

Soldering method and method of manufacturing semiconductor device including soldering method

Electronic component structure and method of making

CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL, AND SEMICONDUCTOR DEVICE

Component assembly

Semiconductor memory device and defect remedying method thereof

Package having a plurality of mounting orientations

THREE-DIMENSIONAL INTERCONNECT INTERPOSER ADAPTED FOR USE IN SYSTEM IN PACKAGE AND METHOD OF MAKING THE SAME

CHIP CARD MODULE AND METHOD OF PRODUCING A CHIP CARD MODULE

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POWER CONVERSION APPARATUS INCORPORATING THIS SEMICONDUCTOR DEVICE

Packaged integrated circuit

Semiconductor package and fabrication method thereof

Semiconductor device

INTEGRATED CIRCUIT

Semiconductor integrated circuit device and fabrication method for the same

Semiconductor device including a coupling region which includes layers of aluminum and copper alloys

High frequency device module and manufacturing method thereof

Universal substrate for a semiconductor device having selectively activated fuses

Stackable bare-die package

Stacked Package and Method of Fabricating the Same

Stackable integrated circuit package system with multiple interconnect interface

High current semiconductor power device SOIC package

QUAD FLAT NO-LEAD CHIP CARRIER WITH STAND-OFF

Semiconductor components with conductive interconnects

High Frequency Switch With Low Loss, Low Harmonics, And Improved Linearity Performance

Method for fabricating an electronic device substrate

Manufacturing method of semiconductor device and manufacturing method of lead frame

Leadframe enhancement and method of producing a multi-row semiconductor package

Method for manufacturing a semiconductor laser

Package board and method for manufacturing thereof

DIE COAT PERIMETER TO ENHANCE SEMICONDUCTOR RELIABILITY

Semiconductor device and wire bonding method

Semiconductor package having stacked semiconductor chips

Electronic package structure and method

Single-sided, flat, no lead, integrated circuit package

CHIP PACKAGE

Module comprising a semiconductor chip comprising a movable element

Semiconductor device package with multi-chips and method of the same

Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same

SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND CONNECTING THROUGH-HOLE AND METHOD OF THE SAME

Semiconductor device package with multi-chips and method of the same

Semiconductor device and semiconductor module using the same

Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method

Stacked electronic component and manufacturing method thereof

Package structure and manufacturing method thereof

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Integrated Circuit Device Package with an Additional Contact Pad, a Lead Frame and an Electronic Device

Electronic component and method for manufacturing an electronic component

Apparatus for wire bonding and integrated circuit chip package

Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same

SEMICONDUCTOR DEVICE FOR WHICH ELECTRICAL TEST IS PERFORMED WHILE PROBE IS IN CONTACT WITH CONDUCTIVE PAD

Semiconductor sensor and manufacturing method therefor

Transfer mask in micro ball mounter

Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device

Semiconductor device and method of manufacturing the same

Method for manufacturing passive device and semiconductor package using thin metal piece

Ribbon bonding tool and process

High-frequency module

SEMICONDUCTOR PACKAGE WIRE BONDING

Panel, semiconductor device and method for the production thereof

Integrated circuit including gas phase deposited packaging material

Multi-chip module

Module with silicon-based layer

Subminiature electronic device having hermetic cavity and method of manufacturing the same

CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING OPENING AND METHOD OF THE SAME

Image sensor package with die receiving opening and method of the same

Stacked semiconductor package

SEMICONDUCTOR PACKAGE