Surface mount electronic component and process for manufacturing same

SEMICONDUCTOR DEVICE AND PACKAGING STRUCTURE THEREFOR

CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Semiconductor package and its manufacturing method

SEMICONDUCTOR CHIP SUPPRESSING A VOID DURING A DIE ATTACHING PROCESS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Ribbon bonding tool and process

Method of fabricating chip package structure

Monolithic Controller for the Generator Unit of a Motor Vehicle

Semiconductor device with inductor

Semiconductor and Method For Producing the Same

Semiconductor Substrate Having Enhanced Adhesion And Method For Manufacturing The Same

INTEGRATED CIRCUIT SYSTEM WITH PRE-CONFIGURED BOND WIRE BALL

Stacked structure of semiconductor chips, memory card, and method of manufacturing stacked structure of semiconductor chips

Semiconductor package substrate

Semiconductor substrate

Semiconductor device

Package structure and method for chip with two arrays of bonding pads on BGA substrate for preventing gold bonding wires from collapse

Integrated circuit packaging system with interposer

Heat dissipating device with preselected designed interface for thermal interface materials

Semiconductor device including semiconductor elements and method of producing semiconductor device

Stackable semiconductor package having metal pin within through hole of package

Microelectronic packages and methods therefor

SEMICONDUCTOR PACKAGE STRUCTURE AND CARRIER STRUCTURE

Chip package structure

Semiconductor die package including leadframe with die attach pad with folded edge

PACKAGE-ON-PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME BY USING A LEADFRAME

Integrated circuit package system with integral inner lead and paddle

Package-level electromagnetic interference shielding

Integrated circuit assembly with passive integration substrate for power and ground line routing on top of an integrated circuit chip

RESIN-SEALED SEMICONDUCTOR LIGHT RECEIVING ELEMENT, MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE USING THE SAME

High performance sub-system design and assembly

Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment

Passivation layer for a circuit device and method of manufacture

Method for manufacturing integrated circuit device having antenna conductors

Low Cost Stacked Package

Varied Solder Mask Opening Diameters Within a Ball Grid Array Substrate

Die package with asymmetric leadframe connection

Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same

Method for precision assembly of integrated circuit chip packages

Fabrication method of semiconductor package

BOND PAD FOR SEMICONDUCTOR DEVICE

Circuit module and circuit device including circuit module

ELECTRONIC PACKAGE STRUCTURE

Semiconductor module, module substrate structure, and method of fabricating the same

PACKAGE STRUCTURE WITH EMBEDDED CAPACITOR, FABRICATING PROCESS THEREOF AND APPLICATIONS OF THE SAME

Structure and method for self protection of power device

SEMICONDUCTOR PACKAGE HAVING EVAPORATED SYMBOLIZATION

Stacked semiconductor device and method of manufacturing the same

Localized alloying for improved bond reliability

Wiring board and semiconductor device

Semiconductor device

Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package

Integrated circuit package system with an encapsulant cavity and method of fabrication thereof

Multi-chip semiconductor package and method for fabricating the same

SEMICONDUCTOR DEVICE INCLUDING A PLURAL CHIPS WITH PROTRUDING EDGES LAMINATED ON A DIE PAD SECTION THAT HAS A THROUGH SECTION

ELECTRONIC PACKAGE STRUCTURE

STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTION JOINTS

Lead frame for chip packages with wire-bonding at single-side pads

SUBSTRATE AND SEMICONDUCTOR DEVICE USING THE SAME

Modular board device, high frequency module, and method of manufacturing the same

Stress free package and laminate-based isolator package

Fabrication method of multichip stacking structure

Circuit module and process for producing the same

PRE-MOLDED LEAD FRAME AND PROCESS FOR MANUFACTURING THE SAME

Electronic component built-in substrate and method of manufacturing electronic component built-in substrate

IC package reducing wiring layers on substrate and its chip carrier

Multichip stacking structure

Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package

Chip having side pad, method of fabricating the same and package using the same

Electronic device having metal pad structure and method of fabricating the same

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor device manufacturing method, semiconductor device, and wiring board

Semiconductor device and method of manufacturing the same

Package, electronic device, substrate having a separation region and a wiring layers, and method for manufacturing

Semiconductor device having a high frequency electrode positioned with a via hole

Zigzag-stacked package structure

Chip arrangement and method for producing a chip arrangement

Memory card and manufacturing method of the same

Semiconductor device including isolation layer

Thermally enhanced single inline package (SIP)

Semiconductor device with parylene coating

Method of manufacturing a printed wiring board lead frame package

Integrated circuit package system with leads having multiple sides exposed

Method of fabricating a semiconductor multi package module having an inverted package stacked over ball grid array (BGA) package

Circuit substrate and the semiconductor package having the same

System-in-package packaging for minimizing bond wire contamination and yield loss

Plastic semiconductor packages having improved metal land-locking features

Semiconductor device and programming method

IC chip package with near substrate scale chip attachment

Stack type semiconductor chip package having different type of chips and fabrication method thereof

Semiconductor device and method of fabricating the same

Enhanced durability multimedia card

Semiconductor Device

Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof

Electric Device Comprising a Housing and a Cooling Body

Semiconductor device

Electric power semiconductor device

MULTI-CHIP PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor package with flow controller

Substrate improving immobilization of ball pads for BGA packages

Chip package structure

Ball grid array structures having tape-based circuitry

Semiconductor package, manufacturing method thereof and IC chip

Microelectronic component assemblies with recessed wire bonds and methods of making same

Semiconductor power device

Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package

High power semiconductor package

Thin semiconductor package having stackable lead frame and method of manufacturing the same

Method for reduction of soft error rates in integrated circuits

CHIP PACKAGE CAPABLE OF MINIMIZING ELECTRO-MAGNETIC INTERFERENCE

MEMS microphone package and method thereof

Light emitting device and method of fabricating light emitting device

APPARATUS FOR INTEGRATED INPUT/OUTPUT CIRCUIT AND VERIFICATION METHOD THEREOF

Integrated circuit/printed circuit board substrate structure and communications

Pin with shape memory alloy

SEMICONDUCTOR DEVICE HAVING FUSE CIRCUIT ON CELL REGION AND METHOD OF FABRICATING THE SAME

Method for fabricating semiconductor package

Method of forming component package

Method of making a semiconductor device having multiple die redistribution layer

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATING FILM FORMING METHOD AND BONDING METHOD USING THE SAME

Local wireless communications within a device

Chip mount, methods of making same and methods for mounting chips thereon

Stacked type chip package structure

Sub-assembly

Dual molded multi-chip package system

Integrated circuit package with top pad

Semiconductor device package having pseudo chips

Semiconductor components having through interconnects

Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same

Semiconductor device having multiple die redistribution layer

Control of Standoff Height Between Packages with a Solder-Embedded Tape

Method for fabricating heat-dissipating package and heat-dissipating structure applicable thereto

Heat dissipation semiconductor pakage

Memory module for improving impact resistance

Semiconductor device and method of manufacturing the same

Semiconductor device with chip mounted on a substrate

Multiple electronic component containing substrate

Method of making a multi-layered semiconductor device

Integrated circuit package with molded cavity

Stackable integrated circuit package system with recess

Laterally Interconnected IC Packages and Methods

Mountable integrated circuit package-in-package system with adhesive spacing structures

Bridge stack integrated circuit package-on-package system

Semiconductor package having leadframe with exposed anchor pads

Power device package

Lead frame and method of manufacturing the same, and semiconductor device

Multi-die semiconductor package structure and method for manufacturing the same

Lead Frame

CHIP PACKAGE STRUCTURE

CHIP PACKAGE STRUCTURE

Stacked-package quad flat null lead package

Microelectronic Assembly Using Chip-On-Lead (COL) and Cantilever Leads

Stress mitigation in packaged microchips

Package having shield case

Method for direct bonding of metallic conductors to a ceramic substrate

Alignment and cutting of microelectronic substrates

Chip mounting with flowable layer

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DICE HAVING BACK SIDE REDISTRIBUTION LAYER ACCESSED USING THROUGH-SILICON VIAS, METHODS

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Light emitting diode package with direct leadframe heat dissipation

Accessible electronic storage apparatus

System in package integrating a plurality of semiconductor chips

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Circuit for suppressing voltage jitter and method thereof

Voltage regulator integrated with semiconductor chip

Semiconductor package and method of manufacturing the same

Mounting structure for semiconductor element

Integrated circuit package system with offset stacked die and method of manufacture thereof

Semiconductor device and manufacturing method of the same

Stacked die package with stud spacers

Stacked-die packages with silicon vias and surface activated bonding

Semiconductor device comprising a plastic housing, a semiconductor chip and an interposer including a convex or concave lens-shape top side fitting shape

Semiconductor Package With Rigid And Flexible Circuits

Stacked semiconductor chips having double adhesive insulating layer interposed therebetween

Integrated circuit package system employing mold flash prevention technology

Semiconductor package on package having plug-socket type wire connection between packages

Memory device

Semiconductor package structure and method for manufacturing the same

Inverted lead frame in substrate

Multi-die IC package and manufacturing method

Semiconductor device with lead frame including conductor plates arranged three-dimensionally

IC package encapsulating a chip under asymmetric single-side leads

Multi-chip package

MULTI-CHIP MODULE, MANUFACTURING METHOD THEREOF, MOUNTING STRUCTURE OF MULTI-CHIP MODULE, AND MANUFACTURING METHOD OF MOUNTING STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE

Method of fabricating a shielded stacked integrated circuit package system

Plastic electronic component package

Integrated circuit device mounting with folded substrate and interposer

Semiconductor device and electronic device

Method for fabricating a circuit component

Semiconductor package, manufacturing method thereof and IC chip

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Manufacturing method for micro-SD flash memory card

Semiconductor apparatus and manufacturing method of semiconductor apparatus

Electronic package

Circuit board and manufacturing method thereof

Flip chip semiconductor packaging device and testing method using first and second reflectors for determining gap between chip and circuit board or first and second chips

MICROBALL MOUNTING METHOD AND MOUNTING DEVICE

Semiconductor package having non-ceramic based window frame

Three-dimensional package and method of making the same

Stress management in BGA packaging

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Chip package and method of manufacturing the same

3D ELECTRONIC PACKAGING STRUCTURE WITH ENHANCED GROUNDING PERFORMANCE AND EMBEDDED ANTENNA

Integrated circuit package system employing a support structure with a recess

Leadframe on heat sink (LOHS) semiconductor packages and fabrication methods thereof

Semiconductor device package diepad having features formed by electroplating

Lead-frame circuit package

Integrated circuit package with elevated edge leadframe

Manufacturing process of a carrier

Semiconductor chip and production process therefor

Microelectronic devices and methods for forming interconnects in microelectronic devices

METHOD OF MANUFACTURING MULTI-STACK PACKAGE

Method of making semiconductor device

Integrated circuit package system employing thin profile techniques

Method for manufacturing an antenna

Memory chip and insert card having the same thereon

Stacked die in die BGA package

Semiconductor package and method of manufacturing the same

Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus

Method of bonding wire of semiconductor package

Method for manufacturing semiconductor device and semiconductor device

Direct via wire bonding and method of assembling the same

Packaged integrated circuit with enhanced thermal dissipation

High power semiconductor package and method of making the same

Semiconductor package and method for manufacturing the same

Semiconductor device

Stacked integrated circuit package-in-package system

Stacked integrated circuit package-in-package system

Stackable integrated circuit package system

Multi-layer semiconductor package

Carrierless chip package for integrated circuit devices, and methods of making same

Wire bond interconnection

Electronic component with layered frame

LDO regulator with ground connection through package bottom

Semiconductor device having plurality of leads

SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH PROJECTING BUMPS OR BALLS

Integrated circuit package system employing structural support

Amplifier chip mounted on a lead frame

Fabrication method of semiconductor package and structure thereof

Electroplating method for a semiconductor device

METHOD OF DIE STACKING USING INSULATED WIRE BONDS

Method of fabricating a film-on-wire bond semiconductor device

COMPLEX MEMORY CHIP, MEMORY CARD HAVING THE SAME, AND METHOD OF MANUFACTURING THE MEMORY CARD

Epoxy resin composition for encapsulating semiconductor and semiconductor device

Resin-sealed electronic device and method of manufacturing the same

Wire bond integrated circuit package for high speed I/O

Microcircuit package having ductile layer

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Semiconductor package having semiconductor device featuring externally-accessible endless ring-shaped resistance circuit

CHIP PACKAGE AND FABRICATING PROCESS THEREOF

Semiconductor chip package, printed circuit board assembly including the same and manufacturing methods thereof

System-in-package (SiP) and method of manufacturing the same

Substrate for a flexible microelectronic assembly and a method of fabricating thereof

Stacked die package

SEMICONDUCTOR DEVICE

DIE STACKING USING INSULATED WIRE BONDS

FILM-ON-WIRE BOND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Chip on leads

Semiconductor device and printed circuit board

Semiconductor chip and method of producing the same

SEMICONDUCTOR INTEGRATED CIRCUIT AND FABRICATION METHOD FOR THE SAME

Semiconductor integrated circuit providing for wire bonding directly above an active circuit region, and manufacturing method thereof

Leadframe, semiconductor package and support lead for bonding with groundwires

Thin film light emitting diode

Light emitting device having a mirror portion

PARTIALLY INSULATION COATED METAL WIRE FOR WIRE BONDING AND WIRE BONDING METHOD FOR SEMICONDUCTOR PACKAGE USING THE SAME

MULTI-COMPONENT ELECTRONIC PACKAGE WITH PLANARIZED EMBEDDED-COMPONENTS SUBSTRATE

Circuit Device and Manufacturing Method of the Same

Bonding structures and methods of forming bonding structures

Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device

Rotation joint and semiconductor device having the same

Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

Semiconductor module with at least two substrates

Balanced semiconductor device packages including lead frame with floating leads and associated methods

Thermally enhanced semiconductor package

HEAT SPREADER FOR AN ELECTRICAL DEVICE

Semiconductor device

Semiconductor device

Semiconductor device package

Semiconductor Device And Production Method For Semiconductor Device

Leadframe finger design to ensure lead-locking for enhanced fatigue life of bonding wire in an overmolded package

Stamped leadframe and method of manufacture thereof

Collective and synergistic MRAM shields

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF

Spread spectrum isolator

Circuit device

Wire and solder bond forming methods

Wire and solder bond forming methods

Card adapter for use with a storage apparatus

Accessible electronic storage apparatus for use with support frame

Method of Manufacturing a Ignition Device and a Semiconductor Device

Semiconductor device and method for manufacturing same

Semiconductor device

MULTI-CHIP STRUCTURE

Semiconductor package and fabrication method thereof

BGA package with encapsulation on bottom of substrate