Electrically connecting substrate with electrical device

Integrated circuit package system with multiple molding

Mixed wire semiconductor lead frame package

INTEGRATED CIRCUIT PACKAGE STRUCTURE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE

Method for connecting an electronic chip to a radiofrequency identification device

Component with sensitive component structures and method for the production thereof

Method of fabricating chip package

Stacked microelectronic devices and methods for manufacturing microelectronic devices

PRODUCING A SURFACE-MOUNTABLE RADIATION EMITTING COMPONENT

Semiconductor Device Package Disassembly

INTEGRATED CIRCUIT WITH BONDING WIRE ANTENNA STRUCTURE AND METHODS FOR USE THEREWITH

Integrated circuit with power supply line antenna structure and methods for use therewith

RFID integrated circuit with integrated antenna structure

Dual mirror chips, wafer including the dual mirror chips, multi-chip packages, methods of fabricating the dual mirror chip, the wafer, and multichip packages, and a method for testing the dual mirror chips

COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT

Stackable microelectronic device carriers, stacked device carriers and methods of making the same

Power semiconductor substrates with metal contact layer and method of manufacture thereof

Semiconductor device with pads of enhanced moisture blocking ability

Chip package

Semiconductor device with welded leads and method of manufacturing the same

Semiconductor device

Heat dissipation plate and semiconductor device

Semiconductor package system with patterned mask over thermal relief

High-Density Fine Line Structure And Method Of Manufacturing The Same

Chip embedded substrate and method of producing the same

Ultra slim semiconductor package and method of fabricating the same

Integrated circuit package system with flex bump

Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Multi-chip electronic package with reduced stress

Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads

Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

ELECTRONIC APPARATUS

Method of fabricating a semiconductor package having through holes for molding back side of package

Method for fabricating semiconductor package free of substrate

METHOD OF PACKAGE STACKING USING UNBALANCED MOLDED TSOP

Method of fabricating a two-sided die in a four-sided leadframe based package

Method of fabricating a semiconductor die having a redistribution layer

Fabrication method of semiconductor integrated circuit device

Method of fabricating a memory card using SiP/SMT hybrid technology

Methods for forming quad flat no-lead (QFN) packages

METHOD OF MULTI-CHIP PACKAGING IN A TSOP PACKAGE

Multilayer wiring element having pin interface

Packaging system with hollow package and method for the same

Chip attack protection

Semiconductor device with a buffer region with tightly-packed filler particles

Integrated circuit package system with overhang die

Integrated circuit package system with dual side connection

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SHEET, AND SEMICONDUCTOR DEVICE OBTAINED BY THE METHOD

Semiconductor die having a distribution layer

Semiconductor device and wire bonding method

High-density fine line structure and method of manufacturing the same

Integrated circuit package system with overhanging connection stack

Multi-chips Stacked package structure

Structure and method for wire bond integrity check on BGA substrates using indirect electrical interconnectivity pathway between wire bonds and ground

Semiconductor device and method of manufacturing the same

Integrated circuit package in package system with adhesiveless package attach

High thermal performance packaging for circuit dies

Semiconductor device, a method of manufacturing the same and an electronic device

Semiconductor device including semiconductor chips having contact elements

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SYMMETRIC PACKAGING

High-Density Fine Line Structure And Method Of Manufacturing The Same

Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same

Stackable package by using internal stacking modules

Integrated circuit package system with top and bottom terminals

Electronic component and a method of fabricating an electronic component

Semiconductor module for a switched-mode power supply and method for its assembly

Two-sided die in a four-sided leadframe based package

MULTI-CHIP PACKAGING IN A TSOP PACKAGE

Plastic-Encapsulated Semiconductor Device with an Exposed Radiator at the Top and Manufacture Thereof

Integrated circuit package system with integral inner lead and paddle

Semiconductor device

PACKAGE STACKING USING UNBALANCED MOLDED TSOP

Thinned wafer having stress dispersion parts and method for manufacturing semiconductor package using the same

Semiconductor device including fuse elements and bonding pad

Packaged device and method of manufacturing the same

Semiconductor device, method of fabricating the same, stacked module including the same, card including the same, and system including the stacked module

Manufacturing Method of Semiconductor Integrated Circuit Device

Manufacturing method for semiconductor integrated device

Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates

Semiconductor memory device and semiconductor memory card using the same

Quad flat non-leaded chip package

Semiconductor device including a stress buffer

SEMICONDUCTOR WAFER THAT SUPPORTS MULTIPLE PACKAGING TECHNIQUES

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Electrical shielding in stacked dies by using conductive die attach adhesive

Structure and manufactruing method of chip scale package

Semiconductor device

CHIP PACKAGE

Semiconductor device and manufacturing method thereof

Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the Same

Integrated circuit package system employing device stacking

Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CAVITY SUBSTRATE

Power Semiconductor Module And Method of Manufacturing the Power Semiconductor Module

Semiconductor device having through contacts through a plastic housing composition and method for the production thereof

Mold compound circuit structure for enhanced electrical and thermal performance

RF transistor packages with internal stability network and methods of forming RF transistor packages with internal stability networks

RF power transistor packages with internal harmonic frequency reduction and methods of forming RF power transistor packages with internal harmonic frequency reduction

Array molded package-on-package having redistribution lines

Multiple die integrated circuit package

Lead frame, semiconductor device using same and manufacturing method thereof

Integrated circuit package system having perimeter paddle

INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH MAGNETIC FILM

Method of making a wafer level integration package

Semiconductor device and semiconductor package having the same

Thin double-sided package substrate and manufacture method thereof

Semiconductor module

Power composite integrated semiconductor device and manufacturing method thereof

Manufacturing method for semiconductor device containing stacked semiconductor chips

Process for producing a functional device-mounted module

Lead frame and method for fabricating semiconductor package employing the same

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Thick film circuit component and method for manufacturing the same

Method Of Manufacturing A Fingerprint Sensor And Corresponding Sensor

Semiconductor power device having a stacked discrete inductor structure

Semiconductor memory device

Semiconductor package and fabrication method thereof

Die offset die to die bonding

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DIFFERENT CONNECTION STRUCTURES

Semiconductor device with heat sink plate

Heat dissipation package structure and method for fabricating the same

Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package

Embedded chip package

Chip package

CHIP PACKAGE

CHIP PACKAGE

STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

EMI shielded semiconductor package

METHOD OF MANUFACTURING WIRING BOARD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRING BOARD

Method of fabricating a semiconductor device

Method of manufacturing a semiconductor device

Heat spreader for center gate molding

Method for fabricating semiconductor device installed with passive components

Plastic electronic component package

SEMICONDUCTOR MOLDED PANEL HAVING REDUCED WARPAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR DISCHARGING ELECTRONIC DEVICES ON A SUBSTRATE

Electronic circuit package

Chip package without core and stacked chip package structure

Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE PRODUCT

High-Density Fine Line Structure And Method Of Manufacturing The Same

Chip-in-slot interconnect for 3D chip stacks

Semiconductor package and method for fabricating the same

Integrated circuit package system with contoured die

Microelectronic packages having cavities for receiving microelectric elements

Leadframe with die pad and leads corresponding thereto

Three-dimensional package structure

Lead frame-BGA package with enhanced thermal performance and I/O counts

Integrated circuit package system with leadfinger

Integrated circuit package system with leaded package

Semiconductor chip package

Device configuration and method to manufacture trench MOSFET with solderable front metal

Concave face wire bond capillary and method

Circuit device and manufacturing method therefor

Methods of making metal core foldover package structures

ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME

Integrated circuit die with logically equivalent bonding pads

One piece method for integrated circuit (IC) assembly

Wiring board having a connecting pad area which is smaller than a surface plating layer area

Method of manufacturing infrared rays receiver and structure thereof

Current sensor

Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device

Resin molded semiconductor device

Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier

REDUCED-DIMENSION MICROELECTRONIC COMPONENT ASSEMBLIES WITH WIRE BONDS AND METHODS OF MAKING SAME

MEMORY DEVICES INCLUDING SEPARATING INSULATING STRUCTURES ON WIRES AND METHODS OF FORMING

Reduced inductance in ball grid array packages

Multi-die wafer level packaging

Semiconductor package

SEMICONDUCTOR DEVICE

Package stacking through rotation

Microelectronic package having interconnected redistribution paths

Lead frame and manufacturing method thereof, and semiconductor apparatus and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Packages and assemblies including lidded chips

Semiconductor chip mounting board with multiple ports

CONCENTRATION PHOTOVOLTAIC MODULE

Fully integrated RF transceiver integrated circuit

Arrangement of at least one power semiconductor module and a printed circuit board

Method of manufacturing chip integrated substrate

COMPOUND WIREBONDING AND METHOD FOR MINIMIZING INTEGRATED CIRCUIT DAMAGE

Semiconductor package, method for fabricating the same, and semiconductor device

Semiconductor package, printed circuit board, and electronic device

Antenna structure for integrated circuit die using bond wire

Semiconductor device with integrated coils

SURFACE-MOUNT TYPE CRYSTAL OSCILLATOR

Semiconductor device and process for fabrication thereof

SEMICONDUCTOR DEVICE WITH BONDING PAD SUPPORT STRUCTURE

SEMICONDUCTOR PACKAGE HAVING MOLDED BALLS AND METHOD OF MANUFACTURING THE SAME

Chip Assembly and Method of Manufacturing Thereof

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Mounting board, mounted body, and electronic equipment using the same

STACKED CHIP SEMICONDUCTOR DEVICE

Semiconductor device and a method of manufacturing the same

LEAD FRAME FOR SEMICONDUCTOR DEVICE

Leadframe with extended pad segments between leads and die pad, and leadframe package using the same

Integrated circuit package system with relief

Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component

SEMICONDUCTOR DEVICE, LEADFRAME AND STRUCTURE FOR MOUNTING SEMICONDUCTOR DEVICE

METHOD OF PACKAGING INTEGRATED CIRCUITS

LEAD-FRAME ARRAY PACKAGE STRUCTURE AND METHOD

Semiconductor device

Bonding pad structure disposed in semiconductor device and related method

Semiconductor device and method of blowing fuse thereof

Transistor package with wafer level dielectric isolation

Integrated circuit for various packaging modes

CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING CONNECTION BOARD, AND MANUFACTURING METHOD THEREOF

MULTI-STRAND SUBSTRATE FOR BALL-GRID ARRAY ASSEMBLIES AND METHOD

Composite substrate and method for manufacturing composite substrate

Downhill Wire Bonding for QFN L - Lead

Semiconductor Substrate Having Enhanced Adhesion And Method For Manufacturing The Same

Method of making integrated circuit package with transparent encapsulant

Packaging Substrate with Flat Bumps for Electronic Devices and Method of Manufacturing the Same

Method for Fabricating Array-Molded Package-On-Package

Base semiconductor component for a semiconductor component stack and method for the production thereof

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PERIMETER PADDLE

METHODS OF FABRICATING CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE, AND CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE FABRICATED USING THE METHODS

Semiconductor device

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Semiconductor package having die with recess and discrete component embedded within the recess

Integrated circuit package system with thin profile

Semiconductor device and fabrication method

Semiconductor package using chip-embedded interposer substrate

Stacked package structure and fabrication method thereof

Die stacking system and method

Multi layer low cost cavity substrate fabrication for pop packages

Housed active microstructures with direct contacting to a substrate

System-in-package type semiconductor device

Circuit substrate, molding semiconductor device, tray and inspection socket

Semiconductor device and manufacturing method thereof

Multi-chip semiconductor device having leads and method for fabricating the same

Chip-On-Lead and Lead-On-Chip Stacked Structure

LEAD FRAME FOR SEMICONDUCTOR PACKAGE

Semiconductor Package Having Reduced Thickness

Leadframe for a semiconductor device

Methods of forming stacked semiconductor devices with a leadframe and associated assemblies

Semiconductor Device and Its Fabrication Method

Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

Method for manufacturing light reflecting metal wall

Multilayer ceramic substrate

Method for manufacturing strip level substrate without warpage and method for manufacturing semiconductor package using the same

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Etch method

Semiconductor package and method of forming the same, and printed circuit board

RF-coupled digital isolator

RF-coupled digital isolator

Device comprising an element with electrodes coupled to connections

Semiconductor device including an interconnect

Semiconductor package and method of forming the same

Semiconductor device and a method of manufacturing the same

Flash memory card

POWER SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, LEAD FRAME MEMBER, AND METHOD OF MAKING POWER SEMICONDUCTOR DEVICE

Semiconductor device

Electronic device manufacturing method and supporter

Circuit board and method of fabricating the same

Al-AlN composite material, related manufacturing method and heat exchanger using such composite material

Semiconductor package having through-hole via on saw streets formed with partial saw

Semiconductor device package with multi-chips and method of the same

Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

Method of assembling electronic components of an electronic system, and system thus obtained

Multi-layer thermal insulation for a bonding system

COPPER-METALLIZED INTEGRATED CIRCUITS HAVING ELECTROLESS THICK COPPER BOND PADS

Integrated circuit package system with interference-fit feature

Memory card and method for fabricating the same

SEMICONDUCTOR DEVICE INCLUDING MULTILAYER WIRING BOARD WITH POWER SUPPLY CIRCUIT

SYSTEM FOR IMPLEMENTING HARD-METAL WIRE BONDS

Land grid array semiconductor package

Integrated circuit package system with device cavity

Package-on-package using through-hole via die on saw streets

Through-hole via on saw streets

Air cavity package for a semiconductor die and methods of forming the air cavity package

Same size die stacked package having through-hole vias formed in organic material

Semiconductor die package and integrated circuit package and fabricating method thereof

Semiconductor die with through-hole via on saw streets and through-hole via in active area of die

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

High Density Nanotube Devices

Temperature control of a bonding stage

Substrate with feedthrough and method for producing the same

LED epiwafer pad manufacturing process & new construction thereof

Manufacturing method of a semiconductor device

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Chip package

Bidirectional multiplexed RF isolator

Magnetoresistive device and method of packaging same

Housing for an electronic circuit and method for sealing the housing

Phase change cooled electrical connections for power electronic devices

Leadframe Configuration to Enable Strip Testing of SOT-23 Packages and the Like

Semiconductor device package having a semiconductor element with a roughened surface

Semiconductor device with a semiconductor chip and electrical connecting elements to a conductor structure

Die bonding agent and a semiconductor device made by using the same

Semiconductor device having a sealing resin and method of manufacturing the same

MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE MULTI-CHIP PACKAGE

Semiconductor chip with post-passivation scheme formed over passivation layer

SUBSTRATE WITH PIN, WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

Quad flat no-lead chip carrier with standoff

Semiconductor device and method of fabricating the semiconductor device

STACK PACKAGE WITH RELEASING LAYER AND METHOD FOR FORMING THE SAME

Etched interposer for integrated circuit devices

Substrate for multi-chip stacking, multi-chip stack package utilizing the substrate and its applications