Low profile, chip-scale package and method of fabrication

Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same

Stacked packages

Hybrid integrated circuit device

Ceramic package, assembled substrate, and manufacturing method therefor

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods and apparatuses for providing stacked-die devices

Methods and systems for attaching die in stacked-die packages

Memory card with an adaptor

Process and lead frame for making leadless semiconductor packages

Half-bridge package

Wire bond with improved shear strength

Concave face wire bond capillary and method

Circuit device manufacturing method

Programmable radio transceiver

Selectively coating bond pads

Method for fabricating semiconductor package with circuit side polymer layer

Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components

Method of creating electrostatic discharge protection in a microelectronic module

Apparatus and methods for constructing antennas using wire bonds as radiating elements

Radio frequency power amplifier module

Semiconductor device with semiconductor components connected to one another

Component arrangement having an evaluation circuit for detecting wear on connections

Film carrier tape for mounting of electronic part

Semiconductor package, method for fabricating the same, and semiconductor device

Method and apparatus for stacked die packaging

Stacked chip package with exposed lead-frame bottom surface

Semiconductor device

Structure with spherical contact pins

Bonding structure, wire bonding method, actuator device and liquid jet head

Optical or electronic module and method for its production

Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame

Surface treatment for oxidation removal in integrated circuit package assemblies

Metal pad of semiconductor device and method for bonding the metal pad

Methods of forming wire bonds for semiconductor constructions

Method of manufacturing circuit device

Stacked chip electronic package having laminate carrier and method of making same

Control unit and method for producing the same

Interconnects with interlocks

Hermetic chip in wafer form

Power semiconductor package having integral fluid cooling

Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance

Semiconductor chip-embedded substrate and method of manufacturing same

Semiconductor device and method of manufacturing same

Interposer with flexible solder pad elements and methods of manufacturing the same

Chip-under-tape package structure and manufacture thereof

Semiconductor package with stacked chips and method for fabricating the same

LOC semiconductor assembled with room temperature adhesive

Solderable metal finish for integrated circuit package leads and method for forming

Chip structure with redistribution traces

Semiconductor device and a manufacturing method of the same

Semiconductor package having a grid array of pin-attached balls

Electronic device and angular velocity detector

Method for manufacturing semiconductor device having shielding case, electronic equipment using the semiconductor device, and shielding case attaching method

Method for manufacturing plastic ball grid array package with integral heatsink

Magnetic shield for integrated circuit packaging

Active plate-connector device with built-in semiconductor dies

Microelectronic component assemblies with recessed wire bonds and methods of making same

Semiconductor device and method of manufacturing a semiconductor device

High frequency semiconductor apparatus, transmitting apparatus and receiving apparatus

Heterogeneous organic laminate stack ups for high frequency applications

BGA package board and method for manufacturing the same

Semiconductor package and method for its manufacture

IC with stably mounted chip

Semiconductor device and its manufacturing method

Bonding configurations for lead-frame-based and substrate-based semiconductor packages

Power semiconductor package

Electronic module with layer of adhesive and process for producing it

Methods for processing integrated circuit packages formed using electroplating and apparatus made therefrom

Resin encapsulation molding method for semiconductor device

Method for fabricating a semiconductor component with contacts situated at the underside

Manufacturing method of semiconductor device and manufacturing method of lead frame

Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal

Semiconductor chip resin encapsulation method

Semiconductor package including rivet for bonding of lead posts

Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package

Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same

Methods of bonding two semiconductor devices

Method of packaging integrated circuits, and integrated circuit packages produced by the method

Electronic device with semiconductor chip including a radiofrequency power module

Heat dissipation device for integrated circuits

Semiconductor package and method for its manufacture

Semiconductor device and manufacturing method therefor

Semiconductor chip assembly with metal containment wall and solder terminal

Integrated circuit die with pedestal

Semiconductor package

Radiofrequency power semiconductor module with cavity housing, and method for producing it

Formation of a wire bond with enhanced pull

Electronic package having a folded flexible substrate and method of manufacturing the same

Semiconductor device

Manufacturing method for magnetic sensor and lead frame therefor

Electronic device package

Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration

Substrate based unmolded package

BGA package with concave shaped bonding pads

Thermal interposer for cooled electrical packages

Semiconductor component having stacked, encapsulated dice and method of fabrication

Multi-chip package having heat dissipating path

Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers

Ultrathin module for semiconductor device and method of fabricating the same

Plastic encapsulated semiconductor device with reliable down bonds

Semiconductor device

Semiconductor device in which semiconductor chip is mounted on lead frame

Lead frame for improving molding reliability and semiconductor package with the lead frame

Switch elements and a DC/DC converter using the same

Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices

Semiconductor device packages including hermetic packaging elements for at least partially encapsulating conductive elements and other package elements for protecting the portions of semiconductor devices not covered by the hermetic package elements, and packaging methods

Stacked package electronic device

Substrate based unmolded package

Method for fabricating semiconductor components using conductive layer and grooves

Housing for a semiconductor device and semiconductor device testing system for testing the contacting for semiconductor devices positioned one above the other

Technique for protecting photonic devices in optoelectronic packages with clear overmolding

In-line wire bonding on a package, and method of assembling same

Method for manufacturing a semiconductor device

Semiconductor device

Circuit device and manufacturing method thereof

Package stress management

Methods and apparatus for integrated circuit ball bonding using stacked ball bumps

Chip-to-chip trench circuit structure

Direct connection multi-chip semiconductor element structure

Packaging stacked chips with finger structure

Low inductance semiconductor device having half-bridge configuration

Semiconductor chip package with thermoelectric cooler

Integrated circuit package including embedded thin-film battery

Quad flat non-leaded package

Package Structure

Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication

Taped lead frames and methods of making and using the same in semiconductor packaging

Component interconnect with substrate shielding

Circular wire-bond pad, package made therewith, and method of assembling same

Modular board device, high frequency module, and method of manufacturing same

Heat sink formed of multiple metal layers on backside of integrated circuit die

Microelectronic devices and methods for forming interconnects in microelectronic devices

Leadless semiconductor package and method for manufacturing the same

Process for manufacturing leadless semiconductor packages including an electrical test in a matrix of a leadless leadframe

Method for fabricating semiconductor packages

Electronic device package

Carrier for substrate film

Methods for designing carrier substrates with raised terminals

Leadframe for a multi-chip package and method for manufacturing the same

Leadframe with a chip pad for two-sided stacking and method for manufacturing the same

Apparatus of antenna with heat slug and its fabricating process

Electrostatic discharge (ESD) protection for integrated circuit packages

Method and structure for manufacturing improved yield semiconductor packaged devices

Arrangement for increasing the reliability of substrate-based BGA packages

Semiconductor device with wire bond inductor and method

Bottom heat spreader

Semiconductor package with exposed heat sink and the heat sink thereof

Multi-chip semiconductor connector assemblies

Method and system for expanding flash storage device capacity

Substrate-based die package with BGA or BGA-like components

Microelectronic packages and methods therefor

Method of embedding semiconductor element in carrier and embedded structure thereof

Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same

Semiconductor device and method of manufacturing the same

Ultra thin dual chip image sensor package structure and method for fabrication

High-frequency circuit

Semiconductor package including a semiconductor device, and method of manufacturing the same

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Circuit apparatus provided with asperities on substrate surface

Capillary for wire bonding

Components with posts and pads

Sensor equipment having sensing portion and method for manufacturing the same

Method for encapsulating multiple integrated circuits

Heat spreader in integrated circuit package

Unmolded package for a semiconductor device

Prefabricated semiconductor chip carrier

Apparatus for molding a semiconductor die package with enhanced thermal conductivity

Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same

Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same

Ground plane for integrated circuit package

Multiple device package

Memory card with a cap having indented portions

Semiconductor device and manufacturing method therefor

Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages

Co-packaged control circuit, transistor and inverted diode

Semiconductor package having integrated metal parts for thermal enhancement

Semiconductor device

Wire bonding wedge

Bondhead for wire bonding apparatus

Compliant spring contact structures

Field weldable connections

Method for fabricating chip structure

Compound semiconductor device and manufacturing method thereof

Chip scale package with open substrate

Encapsulation for particle entrapment

Semiconductor device and semiconductor apparatus

Semiconductor apparatus and method of manufacturing semiconductor apparatus

Semiconductor device mounted on and electrically connected to circuit board

Package and method for packaging an integrated circuit die

Internal package heat dissipator

Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly

Vertical conduction power electronic device package and corresponding assembling method

Embedded chip semiconductor having dual electronic connection faces

High density chip scale leadframe package and method of manufacturing the package

Method and system for improved wire bonding

Metal substrate apparatus, method of manufacturing an IC card module apparatus, and an IC card module apparatus

Semiconductor device having inductor

Packaged microelectronic imagers and methods of packaging microelectronic imagers

Microelectronic imagers and methods of packaging microelectronic imagers

Compound semiconductor device and manufacturing method thereof

Nitride semiconductor device

Spread spectrum isolator

Circuit device

Methods of making microelectronic packages

Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance

RF isolator for isolating voltage sensing and gate drivers

RF isolator with differential input/output

Transformer isolator for digital power supply

Method of making photolithographically-patterned out-of-plane coil structures

Electrical contact

Semiconductor package, mold used in manufacturing the same, and method for manufacturing the same

Semiconductor device

Ribbon bonding in an electronic package

Stacked semiconductor package having adhesive/spacer structure and insulation

Ball grid array housing having a cooling foil

Conductor device and method of manufacturing thereof

System-in-package (SIP) structure and fabrication thereof

Package for sealing an integrated circuit die

Internal package heat dissipator

Semiconductor equipment having multiple semiconductor devices and multiple lead frames

On chip transformer isolator

Semiconductor device

Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith

Corrosion resistance enhancement of tin surfaces

Wire-bonding method for chips with copper interconnects by introducing a thin layer

Manufacturing method of semiconductor device

Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits

Module with multiple power amplifiers and power sensors

Method for balancing molding flow during the assembly of semiconductor packages with defective carrying units

Manufacturing methods for semiconductor structures having stacked semiconductor devices

Encapsulated chip and method of fabrication thereof

Wiring substrate and method of fabricating the same

Semiconductor integrated circuit device and method for fabricating the same

Circuit device and manufacturing method thereof

Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device

Electronic system including a semiconductor device with at least one semiconductor die, a carrier, and an encapsulant that fills a space between the die and the carrier and covers intermediate conductive elements that connect the die and the carrier

Circuit device and manufacturing method thereof

Integrated circuit package with optimized mold shape

Semiconductor device including amplifier and frequency converter

Circuit device and manufacturing method thereof

Cold weld hermetic MEMS package and method of manufacture

Laminated radiation member, power semiconductor apparatus, and method for producing the same

Interposer substrate, semiconductor package and semiconductor device, and their producing methods

Method of fabricating a semiconductor device used in a stacked-type semiconductor device

Semiconductor device, method for manufacturing the same, circuit board, and electronic equipment

IC chip package

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Semiconductor device and a method of manufacturing the same

System and method for forming one or more integrated circuit packages using a flexible leadframe structure

Integrated circuit leadframe and fabrication method therefor

Semiconductor device and method for manufacturing the same

Layout structure for providing stable power source to a main bridge chip substrate and a motherboard

Circuit device with dummy elements

Semiconductor device

Wire bonding method and apparatus for integrated circuit

Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip

Circuit device and manufacturing method thereof

Moisture-resistant electronic device package and methods of assembly

Method and apparatus for stacking electrical components using outer lead portions and exposed inner lead portions to provide interconnection

Multi-band tunable resonant circuit

Package with barrier wall and method for manufacturing the same

Circuit device, manufacturing method thereof, and sheet-like board member

Method for fabricating leadless packages with mold locking characteristics

Integrated ball and via package and formation process

Method and system for applying an adhesive substance on an electronic device

Dual row leadframe and fabrication method

Semiconductor device and interposer

Semiconductor molding method and structure

Fine-pitch packaging substrate and a method of forming the same

Circuit board and semiconductor device using the same

Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon

Double density method for wirebond interconnect

Semiconductor device and manufacturing process thereof

Adhesive/spacer island structure for multiple die package

Semiconductor device, method for mounting the same, and method for repairing the same

Semiconductor device and method of manufacturing the same

Leadless leadframe with an improved die pad for mold locking

Packaged integrated circuit with MLP leadframe and method of making same

Power composite integrated semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method therefor

Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

Packaging of a microchip device

Chemical-enhanced package singulation process

Method of fabricating stacked semiconductor device

Method of attaching a leadframe to singulated semiconductor dice

Adhesive film, lead frame with adhesive film, and semiconductor device using same

Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device

Semiconductor package and method for fabricating the same

High heat release semiconductor and method for manufacturing the same

Universal interconnect die

Semiconductor device

Integrated circuit packaging method and structure for redistributing configuration thereof

Solder flow stops for semiconductor die substrates

Integrated passive devices

High electrical performance semiconductor package

Mold gates and tape substrates including the mold gates

Semiconductor device and manufacturing method therefor

Package design and method for electrically connecting die to package

Semiconductor device structure with adhesion-enhanced semiconductor die