Simplified multichip packaging and package design

Semiconductor device

Integrated circuit including silicon wafer with annealed glass paste

Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same

Package for a semiconductor device

Semiconductor device having low-k dielectric film in pad region and method for manufacture thereof

Semiconductor device, and method for manufacturing the same

Electronic device and manufacturing method of the same

Ultra-thin semiconductor package device and method for manufacturing the same

Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same

Method for two-stage transfer molding device to encapsulate MMC module

Multilayered circuit substrate, semiconductor device and method of producing same

Thermal management of surface-mount circuit devices on laminate ceramic substrate

Semiconductor device, method and apparatus for fabricating the same

Power module, and phase leg assembly

Semiconductor component package

Multi-chip package and method of fabricating the same

Multi-chip package using an interposer

Package structure of memory card and packaging method for the structure

Encapsulated electronic device structure

Die bonded device and method for transistor packages

Leadframe designs for integrated circuit plastic packages

Semiconductor device and method of fabricating the same

ESD protection apparatus for an electrical device

Insulating substrate and semiconductor device having a thermally sprayed circuit pattern

Electronic device and method of manufacturing the same

Semiconductor chip package having an adhesive tape attached on bonding wires

Techniques for microchannel cooling

Fabrication method of semiconductor integrated circuit device

Electronic device with high lead density

Hybrid card

Power amplifier module

System-in-package type semiconductor device

Methods and systems for rise-time improvements in differential signal outputs

BGA package having substrate with exhaust hole

Heat dissipating packages structure and method for fabricating the same

Semiconductor package system with substrate heat sink

Integrated circuit package system with heat slug

Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate

Modular construction component with encapsulation

Semiconductor packages with asymmetric connection configurations

Multi-chip package

Carrier for substrate film

Integrated circuit package system with leadframe substrate

Multilayered lead frame for a semiconductor light-emitting device

Semiconductor system with fine pitch lead fingers

Active area bonding compatible high current structures

Tolerance bondwire inductors for analog circuitry

Micro lead frame packages and methods of manufacturing the same

Fabricating surface mountable semiconductor components with leadframe strips

High density direct connect loc assembly

Wire positioning and mechanical attachment for a radio-frequency indentification device

Semiconductor package device and method for fabricating the same

Integration type semiconductor device and method for manufacturing the same

IC chip package with cover

Semiconductor package with conductive molding compound and manufacturing method thereof

Semiconductor device having flip-chip package and method for fabricating the same

Staggered wirebonding configuration

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Chip package with grease heat sink

Substrate for electrical device and methods for making the same

Multi chip package

IC chip package with isolated vias

Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads

Stepped integrated circuit packaging and mounting

Integrated circuit device having flexible leadframe

Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound

Integrated circuit chip package having a ring-shaped silicon decoupling capacitor

Semiconductor device having post-mold nickel/palladium/gold plated leads

Vertical protecting element formed in semiconductor substrate and semiconductor device using the same

Integrated circuit die with logically equivalent bonding pads

Multi-chip package

Semiconductor light-emitting device, lighting module and lighting apparatus

Methods for designing and tuning one or more packaged integrated circuits

Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits

Method for fabricating semiconductor components

Thermal enhance package and manufacturing method thereof

Methods of manufacturing interposers with flexible solder pad elements

Method of manufacturing a wafer assembly

Semiconductor device and method for manufacturing same

Cavity-down Package and Method for Fabricating the same

Semiconductor device and method for fabricating the same

Electronic component comprising external surface contacts and a method for producing the same

Circuitized substrate with trace embedded inside ground layer

Land grid array module

Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same

Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion

Semiconductor device and method of fabricating the same

Bond pad structure with stress-buffering layer capping interconnection metal layer

Cavity-down thermally enhanced package

Semiconductor package with heat sink and method for fabricating same

Hybrid integrated circuit device, and method for fabricating the same, and electronic device

Semiconductor device and a method for manufacturing of the same

Plastic package and semiconductor component comprising such a plastic package, and method for its production

Multiple die stack apparatus employing t-shaped interposer elements

Multiple die stack apparatus employing T-shaped interposer elements

Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module

Stacked semiconductor multi-chip package

Flexible leaded stacked semiconductor package

Semiconductor device and manufacturing process thereof

Chip-on-board package having flip chip assembly structure and manufacturing method thereof

Flip chip package including a non-planar heat spreader and method of making the same

Power distribution within a folded flex package method and apparatus

IC package structures having separate circuit interconnection structures and assemblies constructed thereof

Low cost power MOSFET with current monitoring

Manufacturing method of solid-state image sensing device

Method for fabricating semiconductor package with short-prevented lead frame

Chip package, chip packaging, chip carrier and process thereof

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Packaged device and method of forming same

Molded high density electronic packaging structure for high performance applications

Multilayer semiconductor device

Semiconductor device and method for producing the same

IC (integrated circuit) card

Thermally enhanced molded package for semiconductors

IC substrate and manufacturing method thereof and semiconductor element package thereby

Cavity-down multiple-chip package

Semiconductor device having element portion and control circuit portion

Iridium oxide nanowires and method for forming same

Circuit carrier and production thereof

Method for making electronic packages

Plating method, semiconductor device fabrication method and circuit board fabrication method

Method for fabricating quad flat non-leaded package

Packaging method for an electronic element

Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits

Semiconductor device having aluminum electrode and metallic electrode

Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device

Method of forming a bond pad on an I/C chip and resulting structure

Integrated circuit package employing a heat-spreader member

Heat dissipating package structure and method for fabricating the same

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Memory card module with an inlay design

Multichip leadframe package

Semiconductor HBT MMIC device and semiconductor module

Flexible circuit board processing method

Manufacturing method of a semiconductor device

Semiconductor device and its manufacturing method

Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices

Semiconductor device and manufacturing method for the same

Inspection method of bonded status of ball in wire bonding

Memory card structure and manufacturing method thereof

Folded substrate with interposer package for integrated circuit devices

Bonding structure, actuator device and liquid-jet head

Semiconductor device package with concavity-containing encapsulation body to prevent device delamination and increase thermal-transferring efficiency

Stacked die module

Power amplifier module

Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module

Semiconductor component with plastic housing, and process for producing the same

Memory card structure

Attachment of integrated circuit structures and other substrates to substrates with vias

Power transistor including a leadframe and a semiconductor chip arranged on the leadframe

Semiconductor package structure with microstrip antennan

Die attach paddle for mounting integrated circuit die

Integrated circuit package employing a flexible substrate

Electronic device and method for fabricating the same

Semiconductor device

Electronic flame-off electrode with ball-shaped tip

Contour structures to highlight inspection regions

Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same

Power semiconductor module

Mold compound interlocking feature to improve semiconductor package strength

Copper interconnect

Semiconductor device

Methods for manufacturing semiconductor device, semiconductor device and metal mold

Method of forming a stacked semiconductor package

Semiconducting device that includes wirebonds

Surface-mounted microwave package and corresponding mounting with a multilayer circuit

Semiconductor lead frame, semiconductor package having the same, and method of plating the same

Apparatus of antenna with heat slug and its fabricating process

Lead frame and semiconductor package therefor

Active device bases, leadframes utilizing the same, and leadframe fabrication methods

ELECTRICAL PACKAGE STRUCTURE INCLUDING CHIP WITH POLYMER THEREON

Semiconductor device having power semiconductor elements

Wire bonder and method of operating the same

Nano-sized metals and alloys, and methods of assembling packages containing same

Radio frequency module and manufacturing method thereof

Thermally conductive composite and uses for microelectronic packaging

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Package stress management

Semiconductor package with wire bond arrangement to reduce cross talk for high speed circuits

Method for manufacturing wafer level chip scale package structure

Die down ball grid array package

Reinforced bond pad for a semiconductor device

Apparatus for singulating and bonding semiconductor chips, and method for the same

Semiconductor package with crossing conductor assembly and method of manufacture

Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor

Electronic device

Chip package

Circuit device and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Semiconductor package having a heat slug and manufacturing method thereof

Method for producing a packaged integrated circuit

Stacked die module and techniques for forming a stacked die module

Production methods for a leadframe and electronic devices

Semiconductor device having a switch circuit

Electronic package having a folded package substrate

Semiconductor device

Semiconductor package, and fabrication method and carrier thereof

Assembly for stacked BGA packages

Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components

Semiconductor device package

Semiconductor device and semiconductor device unit

Integrated radio frequency module

Method of forming solder ball, and fabricating method and structure of semiconductor package using the same

Wafer stacking package method

Method of forming a wafer backside interconnecting wire

Power module package having excellent heat sink emission capability and method for manufacturing the same

Light-emitting semiconductor device having an overvoltage protector

Semiconductor device and a method of assembling a semiconductor device

Copper interconnect

Copper interconnect

Copper interconnect

Copper interconnect for semiconductor device

Semiconductor equipment having a pair of heat radiation plates

Semiconductor packages

Semiconductor device and method for fabricating the same

Bonding wire and bonded connection

Method of fabricating a semiconductor die package having improved inductance characteristics

Tape ball grid array package with electromagnetic interference protection and method for fabricating the package

Methods of forming semiconductor packages

Integrated heatspreader for use in wire bonded ball grid array semiconductor packages

Semiconductor apparatus including power semiconductor device constructed by using wide band gap semiconductor

Apparatus for and method of packaging semiconductor devices

Chip carrier with oxidation protection layer

Multi-chip package structure

Robust power semiconductor package

Semiconductor packages

Integrated circuit package with open substrate

Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment

IC card and method of manufacturing the same

Methods for forming conductive bumps and wire loops

Method of measuring thickness of bonded ball in wire bonding

Physical quantity sensor, lead frame, and manufacturing method therefor

Module assembly and method for stacked BGA packages

Method of forming precision leads on a chip-supporting leadframe

Technique for attaching die to leads

Methods for packaging image sensitive electronic devices

Methods for packaging image sensitive electronic devices

Methods for packaging image sensitive electronic devices

Package having dummy package substrate and method of fabricating the same

Chip module

Semiconductor package having a partial slot cover for encapsulation process

Semiconductor chip stack structure and method for forming the same

Wire-bonding method for connecting wire-bond pads and chip and the structure formed thereby

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device, lead frame, and methods for manufacturing the same

Semiconductor device and wire bonding chip size package therefor

High density interconnect power and ground strap and method therefor

Module assembly for stacked BGA packages

Substrate-based housing component with a semiconductor chip

Package having dummy package substrate and method of fabricating the same

Method of manufacturing a semiconductor device

Lead frame and semiconductor device having the lead frame

Method of making circuitized substrate

Methods for packaging image sensitive electronic devices

Semiconductor chip packages and methods for fabricating the same

Method of manufacturing semiconductor device

Magnetic shielding for magnetic random access memory card

Surface-mounting semiconductor device and method of making the same

Wire sweep resistant semiconductor package and manufacturing method thereof

Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same

Integrated circuit with substantially perpendicular wire bonds

Semiconductor device having laminated structure

Apparatus and method for reducing signal cross talk between wire bonds of semiconductor packages

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Semiconductor device having a heat-dissipation member

Method for heat dissipation on semiconductor device

Structure and process of semiconductor package with an exposed heatsink

Electronic component package

Air pocket resistant semiconductor package

Multichip module package and fabrication method

Stacked die packaging and fabrication method

Apparatus for improved power distribution in wirebond semiconductor packages

Method of making a semiconductor device adapted to remove noise from a signal

SMT three phase inverter package and lead frame

Floating lead finger on a lead frame, lead frame strip, and lead frame assembly including same

Electronic component with multilayered rewiring plate and method for producing the same

Semiconductor integrated circuit device which restricts an increase in the area of a chip, an increase in the number of lead terminals of a package, and can reduce parasitic inductance

Method of manufacturing printed wiring board

Method of making circuitized substrate

Attachment of integrated circuit structures and other substrates to substrates with vias

Etched interposer for integrated circuit devices

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

Substrate for producing semiconductor packages

Submember mounted on a chip of electrical device for electrical connection

Methods and systems for attaching die in stacked-die packages

Electronic packages with dice landed on wire bonds

Stacked wafer scale package

QFN package and method therefor

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

High frequency module and manufacturing method thereof

Invertible microfeature device packages

Semiconductor element

Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities

Process and lead frame for making leadless semiconductor packages

Methods and apparatuses for providing stacked-die devices

Methods for designing spacers for use in stacking semiconductor devices or semiconductor device components

Integrated circuit package including miniature antenna