207826 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
Semiconductor device assemblies including an encapsulant located over intermediate conductive elements and filling a space between a semiconductor die and a carrier of the assembly
#16802Systems for degating packaged semiconductor devices with tape substrates
#16803Method of forming an array of semiconductor packages
#16804Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly
#16805Power module and electric transportation apparatus incorporating the same
#16806Large die package structures and fabrication method therefor
#16807Resin-molded package with cavity structure
#16808Die package
#16809Semiconductor micro device
#16810Microelectronic assembly having a perimeter around a MEMS device
#16811Semiconductor (LED) chip attachment
#16812Method of bumping die pads for wafer testing
#16813Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape
#16814Wiring board and semiconductor package using the same
#16815Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
#16816Method and apparatus for decoupling conductive portions of a microelectronic device package
#16817Method for internal electrical insulation of a substrate for a power semiconductor module
#16818Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components
#16819Whisker inhibition in tin surfaces of electronic components
#16820Current sensor
#16821Electronic device with high lead density
#16822Semiconductor device
#16823Embedded chip semiconductor without wire bondings
#16824CHIP-PACKAGING WITH BONDING OPTIONS CONNECTED TO A PACKAGE SUBSTRATE
#16825Circuit method integrating the power distribution functions of the circuits and leadframes into the chip surface
#16826High data rate chip mounting
#16827Electronic circuit package
#16828Chip-packaging with bonding options having a plurality of package substrates
#16829Resin-encapsulated semiconductor apparatus and process for its fabrication
#16830Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads
#16831Optical surface mount technology package
#16832Surface mount multichip devices
#16833Leads under chip IC package
#16834Integrated circuit leadframes patterned for measuring the accurate amplitude of changing currents
#16835Semiconductor device
#16836Methods of forming conductive through-wafer vias
#16837Method of using capacitive bonding in a high frequency integrated circuit
#16838Sealing and protecting integrated circuit bonding pads
#16839Single row bond pad arrangement
#16840Method of manufacturing a semiconductor device
#16841Microelectronic connection components having bondable wires
#16842Method and apparatus for synthesizing high-frequency signals for wireless communications
#16843Semiconductor chip having pads with plural junctions for different assembly methods
#16844Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
#16845Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging
#16846Semiconductor chip package and method for manufacturing the same
#16847Method for low loop wire bonding
#16848Method of fabricating a rat's nest RFID antenna
#16849High voltage power device with low diffusion pipe resistance
#16850Method for producing a BGA chip module and BGA chip module
#16851Method for manufacturing an adhesive substrate with a die-cavity sidewall
#16852Power module comprising at least two substrates and method for producing the same
#16853Semiconductor chip having pads with plural junctions for different assembly methods
#16854Semiconductor device and hybrid integrated circuit device
#16855Wire bonding system and method of use
#16856Semiconductor package for a large die
#16857Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same
#16858Semiconductor device in which semiconductor chip is mounted on lead frame
#16859High-frequency amplification device
#16860Semiconductor device
#16861Laminate ceramic circuit board and process therefor
#16862Compliant interconnect assembly
#16863Method of manufacturing multi-stack package
#16864Lead frame and method of manufacturing the same
#16865Semiconductor device and a method of manufacturing the same
#16866Semiconductor package having multiple row of leads
#16867Semiconductor device
#16868Semiconductor device
#16869High power Doherty amplifier
#16870Semiconductor chip package
#16871Microelectronic assembly having a redistribution conductor over a microelectronic die
#16872Bonding pad structure and method of forming the same
#16873Semiconductor device
#16874CARRIER, CHIP PACKAGE STRUCTURE, AND CIRCUIT BOARD PACKAGE STRUCTURE
#16875Semiconductor device and multilayer substrate therefor
#16876Semiconductor device and printed circuit board
#16877NANO IC packaging
#16878Semiconductor packages, and methods of forming semiconductor packages
#16879Display device
#16880Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module
#16881In-process semiconductor packages with leadframe grid arrays
#16882Power semiconductor module
#16883Manufacturing method for semiconductor device, semiconductor device and semiconductor chip
#16884Leadframe packaging structure and the method of manufacturing the same
#16885Semiconductor device with stacked semiconductor chips of the same type
#16886CHIP PACKAGING STRUCTURE
#16887Semiconductor integrated circuit
#16888Semiconductor device
#16889Automatic wiring method and apparatus for semiconductor package and automatic identifying method and apparatus for semiconductor package
#16890Programmable radio transceiver
#16891Packaging method for integrated circuits
#16892Method for manufacturing semiconductor device
#16893Adhesive of folded package
#16894Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits
#16895Structure and method for contact pads having double overcoat-protected bondable metal plugs over copper-metallized integrated circuits
#16896Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits
#16897Heat curable adhesive composition, article, semiconductor apparatus and method
#16898Electronic component mounting method and apparatus
#16899Wafer level mounting frame for ball grid array packaging, and method of making and using the same
#16900Integrated circuit package and method having wire-bonded intra-die electrical connections
#16901Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus
#16902Die with discrete spacers and die spacing method
#16903Semiconductor package with heat dissipating structure and method of manufacturing the same
#16904Chip package structure and chip packaging process
#16905Thermal dissipation in integrated circuit systems
#16906Semiconductor device and method of fabricating the same
#16907Stackable optoelectronics chip-to-chip interconnects and method of manufacturing
#16908Power semiconductor device package
#16909Exposed pad module integrating a passive device therein
#16910CHIP PACKAGE STRUCTURE
#16911Circuit device
#16912Thermally enhanced component interposer: finger and net structures
#16913System for reducing or eliminating semiconductor device wire sweep
#16914Multi-part lead frame
#16915Chip fixed structure
#16916Integrated circuit device having flexible leadframe
#16917Leadless semiconductor package and manufacturing method thereof
#16918Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
#16919Power semiconductor switching-device and semiconductor power module using the device
#16920Integrated circuit with intergrated capacitor and methods for making same
#16921Resin encapsulated semiconductor device and the production method
#16922Method of making chip package with grease heat sink
#16923Circuit support for a semiconductor chip and component
#16924Semiconductor device
#16925Semiconductor device assemblies and packages including multiple semiconductor device components
#16926Die down semiconductor package
#16927Split-gate power module for suppressing oscillation therein
#16928Method for manufacturing leadless semiconductor packages
#16929Through electrode, spacer provided with the through electrode, and method of manufacturing the same
#16930Microelectronic assembly having encapsulated wire bonding leads
#16931Semiconductor device, a method of manufacturing the same and an electronic device
#16932Interposer including adhesive tape
#16933Semiconductor device of a charge storage type
#16934Semiconductor device with non-overlapping chip mounting sections
#16935Semiconductor BGA package having a segmented voltage plane and method of making
#16936Method and semiconductor device having copper interconnect for bonding
#16937Top finger having a groove and semiconductor device having the same
#16938Device mounting board and semiconductor apparatus using device mounting board
#16939Power semiconductor module
#16940Wire bonding apparatus
#16941Wire bond capillary tip
#16942Circuit board for connecting an integrated circuit to a support and IC BGA package using same
#16943Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
#16944Low fabrication cost, high performance, high reliability chip scale package
#16945Circuit device and manufacturing method thereof
#16946Land grid array packaged device and method of forming same
#16947Lower profile flexible substrate package for electronic components
#16948Programmable radio transceiver
#16949Motor driving system having power semiconductor module life detection function
#16950Semiconductor device
#16951Resin-sealed semiconductor device and method of manufacturing the same
#16952Semiconductor device package having a semiconductor element with resin
#16953Multichip semiconductor package
#16954Semiconductor device and manufacturing metthod thereof
#16955Semiconductor apparatus with improved yield
#16956Copper interconnect
#16957Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities
#16958Semiconductor device
#16959Circuit device
#16960Vertically stacked semiconductor device
#16961Semiconductor chip package
#16962Circuit device and manufacturing method thereof
#16963Multilayer integrated circuit for RF communication and method for assembly thereof
#16964Semiconductor device designed to produce no resonance of loop due to ultrasonic vibration, semiconductor design apparatus and method of manufacturing semiconductor device
#16965Semiconductor device and method of manufacturing the same
#16966Lead on chip semiconductor package
#16967Surface-mountable semiconductor component and method for producing it
#16968Charge device model (CDM) electrostatic discharge (ESD) failure rate via capacitive coating
#16969Integrated circuit module package and assembly method thereof
#16970Solid state imaging device having electromagnetic wave absorber attached to a mounting board
#16971Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module
#16972Method for fabricating window ball grid array semiconductor package
#16973Semiconductor chip packaging method with individually placed film adhesive pieces
#16974Electronic component housing package and electronic apparatus
#16975System and method for attenuating electromagnetic interference
#16976Semiconductor device and method of manufacturing the same
#16977Chip module
#16978Stress and force management techniques for a semiconductor die
#16979Multi-flip chip on lead frame on over molded IC package and method of assembly
#16980Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits
#16981Semiconductor apparatus
#16982Wire bonding method and semiconductor device
#16983Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier
#16984Die package with higher useable die contact pad area
#16985Module with integrated active substrate and passive substrate
#16986Microelectronic assembly formation with releasable leads
#16987Semiconductor device
#16988Stacked electronic part
#16989Method of sensor packaging
#16990Thin semiconductor package including stacked dies
#16991Circuit device and manufacturing method thereof
#16992Semiconductor package having step type die and method for manufacturing the same
#16993Board-on-chip packages
#16994Package with stacked substrates
#16995Method of fabricating a wire bond with multiple stitch bonds
#16996Thin-film semiconductor device and method of manufacturing the same
#16997Manufacturing and testing of electrostatic discharge protection circuits
#16998Semiconductor device and manufacturing method thereof
#16999Semiconductor device and method for manufacturing the same
#17000Method and apparatus for bonding a wire
#17001Semiconductor package
#17002Multi-chip package
#17003Semiconductor device
#17004Semiconductor package having heat spreader and package stack using the same
#17005Semiconductor stack package and memory module with improved heat dissipation
#17006Semiconductor device and manufacturing method thereof
#17007Semiconductor device and electronic device
#17008Leadframe with die pad
#17009Package array and package unit of flip chip LED
#17010Semiconductor device and method of manufacturing the same
#17011High frequency module board device
#17012Wire bonding method and liquid-jet head
#17013Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
#17014Circuit component with bump formed over chip
#17015Semiconductor device having a multi-chip stacked structure and reduced thickness
#17016Bonding pad structure, display panel and bonding pad array structure using the same and manufacturing method thereof
#17017Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same
#17018Multi-chip package including at least one semiconductor device enclosed therein
#17019High frequency semiconductor device
#17020Semiconductor package free of substrate and fabrication method thereof
#17021Semiconductor package free of substrate and fabrication method thereof
#17022Semiconductor package free of substrate and fabrication method thereof
#17023Bonding pad arrangement method for semiconductor devices
#17024Testable electrostatic discharge protection circuits
#17025Semiconductor device
#17026Light emitting device
#17027Infrared receiver chip
#17028Ultrasonic bonding apparatus and method
#17029Bump bonding apparatus and bump bonding method
#17030Multiple-ball wire bonds
#17031Semiconductor packaging techniques for use with non-ceramic packages
#17032Via structure of packages for high frequency semiconductor devices
#17033Semiconductor package free of substrate and fabrication method thereof
#17034Semiconductor device assembly process
#17035Low fabrication cost, high performance, high reliability chip scale package
#17036LSI package, LSI element testing method, and semiconductor device manufacturing method
#17037Packaged die on PCB with heat sink encapsulant and methods
#17038Semiconductor package with crossing conductor assembly and method of manufacture
#17039Apparatus for encapsulating a multi-chip substrate array
#17040Semiconductor package
#17041Interconnect system without through-holes
#17042Semiconductor device
#17043Packaging substrates for integrated circuits and soldering methods
#17044Chip package structure
#17045Method of manufacturing a semiconductor device
#17046Method of surface mounting a semiconductor device
#17047Lead-frame for electonic devices with extruded pads
#17048Multiple die package
#17049Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus
#17050Semiconductor relay apparatus and wiring board fabrication method
#17051Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods
#17052Intrinsic thermal enhancement for FBGA package
#17053Semiconductor package for lowering electromagnetic interference and method for fabricating the same
#17054Semiconductor integrated circuit device
#17055Packaged systems with MRAM
#17056Daisy chaining of serial I/O interface on stacking devices
#17057Electrode package for semiconductor device
#17058Optimized power delivery to high speed, high pin-count devices
#17059Semiconductor device and a memory system including a plurality of IC chips in a common package
#17060Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
#17061Semiconductor device package of stacked semiconductor chips with spacers provided therein
#17062Electronic device configured as a multichip module, leadframe and panel with leadframe positions
#17063Semiconductor package free of substrate and fabrication method thereof
#17064Two die semiconductor assembly and system including same
#17065Lead frame and method for manufacturing semiconductor package with the same
#17066High density lead arrangement package structure
#17067Lead frame for semiconductor package and method of fabricating semiconductor package
#17068Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit
#17069Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask
#17070Microelectronic packages and methods therefor
#17071SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF
#17072Semiconductor device and method of manufacturing same
#17073Semiconductor device for wire-bonding and flip-chip bonding package and manufacturing method thereof
#17074Semiconductor copper bond pad surface protection
#17075Method of producing a digital fingerprint sensor and the corresponding sensor
#17076Electronic circuit module
#17077Semiconductor device and method of manufacturing the same
#17078Thermal head and bonding connection method therefor
#17079Semiconductor component having stiffener, stacked dice and circuit decals
#17080Semiconductor device with capacitor
#17081Thermally enhanced metal capped BGA package
#17082Method for fabricating semiconductor component with stiffener and circuit decal
#17083Miniaturized chip scale package structure
#17084Method of forming a leadframe for a semiconductor package
#17085Semiconductor memory device and defect remedying method thereof
#17086Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
#17087Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles
#17088Method for manufacturing semiconductor device
#17089Method of manufacturing hybrid integrated circuit device
#17090Chip-on-board module, and method of manufacturing the same
#17091Manufacturing method of a semiconductor device utilizing a flexible adhesive tape
#17092High-frequency power amplifier module
#17093Semiconductor device having bonding pad above low-k dielectric film
#17094Microelectronic assembly having array including passive elements and interconnects
#17095Connector assembly
#17096Quad flat non-leaded package comprising a semiconductor device
#17097Wire-bonding method and semiconductor package using the same
#17098Semiconductor package with wire bonded stacked dice and multi-layer metal bumps
#17099Method for assembling a ball grid array package with two substrates
#17100Semiconductor package and method for manufacturing the same