Semiconductor device

Method of fabricating a semiconductor device having a heat sink with an exposed surface

Packaged semiconductor device and method of manufacturing the packaged semiconductor device

Semiconductor device with less power supply noise

Semiconductor device having a stacked multi structure that has layered insulated gate-type bipolar transistors

Semiconductor device and method of manufacturing the same

Semiconductor power device package having a lead frame-based integrated inductor

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Method of making a connection component with posts and pads

Semiconductor device

Stacked dual MOSFET package

Stacked-die package for battery power management

Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device

SEMICONDUCTOR MODULE AND IMAGE PICKUP APPARATUS

SEMICONDUCTOR MODULE AND IMAGE PICKUP APPARATUS

Semiconductor power module packages with simplified structure and methods of fabricating the same

Power device packages and methods of fabricating the same

Multilayer dielectric substrate and semiconductor package

Integrated circuit with intra-chip clock interface and methods for use therewith

Imaging device and method for a bonding apparatus

Semiconductor chip and semiconductor device including the same

Semiconductor package and mounting method thereof

Semiconductor device and method for manufacturing thereof

SEMICONDUCTOR MODULE AND IMAGE PICKUP APPARATUS

Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting region

Stacked semiconductor package

Semiconductor chip package

Self-aligning structures and method for integrated circuits

Clip mount for integrated circuit leadframes

Lead frame structure and applications thereof

Semiconductor device having spacer formed on semiconductor chip connected with wire

Semiconductor package

Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same

Semiconductor package and semiconductor device

Integrated circuit package system with array of external interconnects

Integrated circuit package

Reduction of package height in a stacked die configuration

SEMICONDUCTOR DEVICE HAVING THROUGH-SILICON VIAS FOR HIGH CURRENT,HIGH FREQUENCY, AND HEAT DISSIPATION

Packaged gallium nitride material transistors and methods associated with the same

Semiconductor device and method for adjusting characteristics thereof

DIE-ATTACH MATERIAL OVERFLOW CONTROL FOR DIE PROTECTION IN INTEGRATED CIRCUIT PACKAGES

High capacity memory with stacked layers

Solder-top enhanced semiconductor device for low parasitic impedance packaging

SEMICONDUCTOR DEVICE HAVING A FINE PITCH BONDPAD

Semiconductor integrated circuit device, PDP driver, and plasma display panel

Stacked package and method of manufacturing the same

SEMICONDUCTOR DEVICE

Semiconductor structure and method of manufacture

Power recovery circuit based on partial standing waves

Power Integrated Circuit with Bond-Wire Current Sense

Electrically enhanced wirebond package

Device including a housing for a semiconductor chip including leads extending into the housing

Packaged microchip with spacer for mitigating electrical leakage between components

Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure

Electronic device

Method for Singulating a Group of Semiconductor Packages that Contain a Plastic Molded Body

Layout schemes and apparatus for high performance DC-DC output stage

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE AND LEAD FRAME USED FOR THE SAME

Semiconductor circuit with amplifier, bond wires and inductance compensating bond wire

Semiconductor apparatus with decoupling capacitor

Method of manufacturing semiconductor device

Die offset die to bonding

Die offset die to die bonding

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR SUBSTRATE

Semiconductor device

Semiconductor Device Package

Memory Packages Having Stair Step Interconnection Layers

Partitioned Integrated Circuit Package with Central Clock Driver

Lead frame, electronic component including the lead frame, and manufacturing method thereof

Wireless semiconductor package for efficient heat dissipation

Semiconductor device

Semiconductor device having grooved leads to confine solder wicking

Dual capillary IC wirebonding

Manufacturing process of leadframe-based BGA packages

Shielding Apparatus and Manufacturing Method Thereof

PLASMA DISPLAY APPARATUS

Integrated circuit package including miniature antenna

Audio power amplifier package

Semiconductor packages having interposers, electronic products employing the same, and methods of manufacturing the same

Semiconductor device and semiconductor memory device

ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING

Power semiconductor arrangement

Semiconductor device

Integrated circuit package system with leadframe array

MULTI-BAND TUNABLE RESONANT CIRCUIT

Multi-chip package for reducing parasitic load of pin

ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT

Integrated circuit package system with multiple device units

Stacked dual-die packages, methods of making, and systems incorporating said packages

Semiconductor device having decoupling capacitor formed on substrate where semiconductor chip is mounted

Integrated circuit packaging system with passive components

Semiconductor device and manufacturing method of the same

Integrated circuit package system with under paddle leadfingers

Center Conductor to Integrated Circuit for High Frequency Applications

Semiconductor device

Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards

Three dimensional packaging optimized for high frequency circuitry

Method of manufacturing a semiconductor device

Power integrated circuit with high insensitivity to parasitic inductances of wires for connection to a package and package for said integrated circuit

Minimizing the number of external terminals required when compensation is to be provided for signal drop in bond wire of a package in which an integrated circuit is provided

Semiconductor device, and manufacturing method of semiconductor device

Semiconductor device with double-sided electrode structure and its manufacturing method

Integrated circuit package system with delamination prevention structure

PACKAGED INTEGRATED CIRCUITS AND METHODS TO FORM A STACKED INTEGRATED CIRCUIT PACKAGE

Intergrated circuit packaging with improved die bonding

Integrated circuit package system with dual connectivity

Integrated circuit package system with leads separated from a die paddle

Thermal enhanced upper and dual heat sink exposed molded leadless package

Molded semiconductor device including IC-chip covered with conductor member

Formation of circuitry with modification of feature height

Three-Dimensional Memory-Based Three-Dimensional Memory Module

Semiconductor connection component

High density in-package microelectronic amplifier

Chip module and a fabrication method thereof

Package structure for multiple die stack

Multi-chip semiconductor device

Semiconductor device package structure

Semiconductor device with leadframe including a diffusion barrier

Method of manufacturing a semiconductor device including plural semiconductor chips

Imaging device and method for a bonding apparatus

Bidirectional switch module

Semiconductor device

Semiconductor apparatus

Semiconductor apparatus

SEMICONDUCTOR PACKAGE AND APPARATUS USING THE SAME

Semiconductor device with non-overlapped circuits

MULTIPLE CHIP SEMICONDUCTOR DEVICE

Method and structure for increased wire bond density in packages for semiconductor chips

Stacked chip package with redistribution lines

Semiconductor device and plural semiconductor elements with suppressed bending

Ball grid array package enhanced with a thermal and electrical connector

STACKED SEMICONDUCTOR PACKAGE WITH A REDUCED VOLUME

CO-PACKAGED HIGH-SIDE AND LOW-SIDE NMOSFETS FOR EFFICIENT DC-DC POWER CONVERSION

Self locking and aligning clip structure for semiconductor die package

Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Semiconductor device

Micro-power source module

CORNER I/O PAD DENSITY

Semiconductor device, substrate and semiconductor device manufacturing method

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

Semiconductor component

Semiconductor device and printed circuit board

Semiconductor device

Method for producing shock and tamper resistant microelectronic devices

Multi-substrate region-based package and method for fabricating the same

Microelectronic package

Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producing

Power semiconductor device

INTEGRATED DEVICE AND CIRCUIT SYSTEM

Cascode current sensor for discrete power semiconductor devices

Semiconductor circuit and switching power supply apparatus

Method of fabricating stacked assembly including plurality of stacked microelectronic elements

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Power semiconductor module

Leadframe-based semiconductor package

SEMICONDUCTOR DEVICE

Adhesive bleed prevention method and product produced from same

Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same

Output control device, and AC/DC power source device, circuit device, LED backlight circuit device, and switching DC/DC converter device each using output control device

Semiconductor device and method of providing common voltage bus and wire bondable redistribution

SEMICONDUCTOR DEVICE

Arrangement of stacked integrated circuit dice having a direct electrical connection

Semiconductor chip package and method for designing the same

INTEGRATED CIRCUIT

Integrated circuit packaging system for fine pitch substrates

Semiconductor device and lead frame

Lead frame package apparatus and method

TFCC (TM) and SWCC (TM) thermal flex contact carriers

Rearrangement sheet, semiconductor device and method of manufacturing thereof

MCU with integrated voltage isolator to provide a galvanic isolation between input and output

Tapered dielectric and conductor structures and applications thereof

Electrical connections for multichip modules

Heat extraction from packaged semiconductor chips, scalable with chip area

Semiconductor device package

Thin plastic leadless package with exposed metal die paddle

Semiconductor device

Light emitting device and method of manufacturing the same

Memory card and its manufacturing method

Semiconductor device sealed in a resin section and method for manufacturing the same

WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

Semiconductor device and manufacturing method of the same

QUAD FLAT PACKAGE WITH EXPOSED COMMON ELECTRODE BARS

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

Capacitive isolator

DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Fretting and whisker resistant coating system and method

Semiconductor assembly

Integrated circuit with electromagnetic intrachip communication and methods for use therewith

Semiconductor module, and hybrid vehicle drive device including the same

Electronic device which disconnects first and second terminals upon lapse of a prescribed device lifetime

Interposer chip, method of manufacturing the interposer chip, and multi-chip package having the interposer chip

Stacked semiconductor device and semiconductor memory device

Integrated circuit package system with wire-in-film isolation barrier

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Lead frame, semiconductor package including the lead frame and method of forming the lead frame

Integrated circuit package for semiconductor devices with improved electric resistance and inductance

Fusion quad flat semiconductor package

Electrically connecting substrate with electrical device

Mixed wire semiconductor lead frame package

Semiconductor Device Package Disassembly

INTEGRATED CIRCUIT WITH BONDING WIRE ANTENNA STRUCTURE AND METHODS FOR USE THEREWITH

Integrated circuit with power supply line antenna structure and methods for use therewith

RFID integrated circuit with integrated antenna structure

Dual mirror chips, wafer including the dual mirror chips, multi-chip packages, methods of fabricating the dual mirror chip, the wafer, and multichip packages, and a method for testing the dual mirror chips

COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT

Semiconductor device with pads of enhanced moisture blocking ability

Semiconductor device

Integrated circuit package system with flex bump

Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Multi-chip electronic package with reduced stress

Method for fabricating semiconductor package free of substrate

Method of fabricating a two-sided die in a four-sided leadframe based package

METHOD OF MULTI-CHIP PACKAGING IN A TSOP PACKAGE

Integrated circuit package system with overhang die

Semiconductor device and wire bonding method

Integrated circuit package system with overhanging connection stack

Multi-chips Stacked package structure

Structure and method for wire bond integrity check on BGA substrates using indirect electrical interconnectivity pathway between wire bonds and ground

Semiconductor device and method of manufacturing the same

Semiconductor device including semiconductor chips having contact elements

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SYMMETRIC PACKAGING

Semiconductor module for a switched-mode power supply and method for its assembly

Two-sided die in a four-sided leadframe based package

MULTI-CHIP PACKAGING IN A TSOP PACKAGE

Plastic-Encapsulated Semiconductor Device with an Exposed Radiator at the Top and Manufacture Thereof

Integrated circuit package system with integral inner lead and paddle

Semiconductor device

Packaged device and method of manufacturing the same

Semiconductor memory device and semiconductor memory card using the same

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Electrical shielding in stacked dies by using conductive die attach adhesive

Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same

Power Semiconductor Module And Method of Manufacturing the Power Semiconductor Module

RF transistor packages with internal stability network and methods of forming RF transistor packages with internal stability networks

RF power transistor packages with internal harmonic frequency reduction and methods of forming RF power transistor packages with internal harmonic frequency reduction

Multiple die integrated circuit package

Lead frame, semiconductor device using same and manufacturing method thereof

Integrated circuit package system having perimeter paddle

INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH MAGNETIC FILM

Power composite integrated semiconductor device and manufacturing method thereof

Manufacturing method for semiconductor device containing stacked semiconductor chips

Process for producing a functional device-mounted module

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Semiconductor power device having a stacked discrete inductor structure

Semiconductor memory device

Semiconductor package and fabrication method thereof

Die offset die to die bonding

Method of manufacturing a semiconductor device

Method for fabricating semiconductor device installed with passive components

Electronic circuit package

Circuit arrangement and integrated circuit

Chip-in-slot interconnect for 3D chip stacks

Microelectronic packages having cavities for receiving microelectric elements

Leadframe with die pad and leads corresponding thereto

Lead frame-BGA package with enhanced thermal performance and I/O counts

Integrated circuit package system with leadfinger

Device configuration and method to manufacture trench MOSFET with solderable front metal

Integrated circuit die with logically equivalent bonding pads

Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device

REDUCED-DIMENSION MICROELECTRONIC COMPONENT ASSEMBLIES WITH WIRE BONDS AND METHODS OF MAKING SAME

MEMORY DEVICES INCLUDING SEPARATING INSULATING STRUCTURES ON WIRES AND METHODS OF FORMING

Reduced inductance in ball grid array packages

Semiconductor package

SEMICONDUCTOR DEVICE

Microelectronic package having interconnected redistribution paths

Packages and assemblies including lidded chips

Semiconductor chip mounting board with multiple ports

Semiconductor package, printed circuit board, and electronic device

Antenna structure for integrated circuit die using bond wire

Semiconductor device with integrated coils

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

STACKED CHIP SEMICONDUCTOR DEVICE

Semiconductor device and a method of manufacturing the same

LEAD FRAME FOR SEMICONDUCTOR DEVICE

Leadframe with extended pad segments between leads and die pad, and leadframe package using the same

SEMICONDUCTOR DEVICE, LEADFRAME AND STRUCTURE FOR MOUNTING SEMICONDUCTOR DEVICE

LEAD-FRAME ARRAY PACKAGE STRUCTURE AND METHOD

Semiconductor device and method of blowing fuse thereof

Transistor package with wafer level dielectric isolation

Integrated circuit for various packaging modes

Composite substrate and method for manufacturing composite substrate

Downhill Wire Bonding for QFN L - Lead

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PERIMETER PADDLE

Semiconductor device

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Die stacking system and method

Semiconductor device and manufacturing method thereof

LEAD FRAME FOR SEMICONDUCTOR PACKAGE

Semiconductor Package Having Reduced Thickness

Methods of forming stacked semiconductor devices with a leadframe and associated assemblies

Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

Semiconductor package and method of forming the same, and printed circuit board

RF-coupled digital isolator

RF-coupled digital isolator