Device comprising an element with electrodes coupled to connections

Flash memory card

POWER SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, LEAD FRAME MEMBER, AND METHOD OF MAKING POWER SEMICONDUCTOR DEVICE

Semiconductor device

Semiconductor device package with multi-chips and method of the same

Method of assembling electronic components of an electronic system, and system thus obtained

Integrated circuit package system with interference-fit feature

Memory card and method for fabricating the same

Land grid array semiconductor package

Air cavity package for a semiconductor die and methods of forming the air cavity package

Manufacturing method of a semiconductor device

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Bidirectional multiplexed RF isolator

Phase change cooled electrical connections for power electronic devices

Leadframe Configuration to Enable Strip Testing of SOT-23 Packages and the Like

MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE MULTI-CHIP PACKAGE

Semiconductor chip with post-passivation scheme formed over passivation layer

STACK PACKAGE WITH RELEASING LAYER AND METHOD FOR FORMING THE SAME

Substrate for multi-chip stacking, multi-chip stack package utilizing the substrate and its applications

Semiconductor device

Integrated circuit package device with improved bond pad connections, a lead-frame and an electronic device

Structure and method for self protection of power device with expanded voltage ranges

Semiconductor device

Leadframe Configuration to Enable Strip Testing of SOT-23 Packages and the Like

On chip transformer isolator

Power semiconductor module

Semiconductor device

Integration type semiconductor device and method for manufacturing the same

Semiconductor packaging with internal wiring bus

Lead frame, semiconductor device using the lead frame, and methods of manufacturing the same

Leadframe for leadless package, structure and manufacturing method using the same

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Semiconductor device comprising a semiconductor chip stack and method for producing the same

Semiconductor device with power noise suppression

LEAD FRAME, MOLDING DIE, AND MOLDING METHOD

Power-MOSFETs with improved efficiency for multi-channel class-D audio amplifiers and packaging thereof

SEMICONDUCTOR DEVICE

Multi-chip module

Semiconductor device package having multi-chips with side-by-side configuration and method of the same

Plastic package and method of fabricating the same

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor module including semiconductor chips coupled to external contact elements

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Wiring design support apparatus for bond wire of semiconductor devices

Method And System for Output Matching of Rf Transistors

Interconnect for chip level power distribution

Heat dissipation unit and a semiconductor package that has the heat dissipation unit

Semiconductor device

Semiconductor device

Integrated circuit device and method for the production thereof

Chip package structure

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Detector system and detector subassembly

Semiconductor device

Semiconductor package, method of fabricating the same, and semiconductor package mold

SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND

Integrated circuit package system with bonding in via

Semiconductor package

Semiconductor Package and Method for Fabricating the Same

Semiconductor device

Semiconductor chip comprising a directional coupler having a specific main line and sub-line arrangement

Semiconductor device with different sized ESD protection elements

Method for manufacturing a semiconductor device

Antenna device and radio communication device

Output Circuit

Contact carriers (tiles) for populating larger substrates with spring contacts

Semiconductor package land grid array substrate and plurality of first and second electrodes

Module comprising a semiconductor chip

SEMICONDUCTOR PACKAGE USING WIRES CONSISTING OF Ag OR Ag ALLOY

Semiconductor device with Al pad

Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip

Structure and electronics device using the structure

Semiconductor device including mounting board with stitches and first and second semiconductor chips

Semiconductor device package having multi-chips with side-by-side configuration and method of the same

Fibrous laminate interface for security coatings

Wire bonding method and related device for high-frequency applications

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Semiconductor module with multiple semiconductor chips

Base substrate for chip scale packaging

Multi-chip package with a single die pad

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Multi-chip stack structure and fabrication method thereof

OPTOELECTRONIC DEVICE ALIGNMENT IN AN OPTOELECTRONIC PACKAGE

CHIP PACKAGE STRUCTURE

Lead frame, semiconductor device, and method of manufacturing the semiconductor device

CHIP PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor device and manufacturing method of the same

Semiconductor module

Method of fabricating module having stacked chip scale semiconductor packages

Class D amplifier arrangement

Semiconductor component and method of manufacture

Semiconductor device and method of manufacturing same

Semiconductor device and method of manufacturing the same

Substrate for mounting semiconductor element and method of manufacturing the same

Resin molded semiconductor device and differential amplifier circuit

Space-efficient package for laterally conducting device

SEMICONDUCTOR COMPONENT

Semiconductor apparatus and mobile apparatus

High temperature, stable SiC device interconnects and packages having low thermal resistance

Power semiconductor module and method for producing the same

Interposer for die stacking in semiconductor packages and the method of making the same

Memory IC package assembly having stair step metal layer and apertures

Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product

Semiconductor device

Electronic component structure and method of making

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POWER CONVERSION APPARATUS INCORPORATING THIS SEMICONDUCTOR DEVICE

Packaged integrated circuit

Semiconductor device

Semiconductor integrated circuit device and fabrication method for the same

Universal substrate for a semiconductor device having selectively activated fuses

High current semiconductor power device SOIC package

Method for fabricating an electronic device substrate

Leadframe enhancement and method of producing a multi-row semiconductor package

Package board and method for manufacturing thereof

DIE COAT PERIMETER TO ENHANCE SEMICONDUCTOR RELIABILITY

Semiconductor device and wire bonding method

Semiconductor package having stacked semiconductor chips

Electronic package structure and method

Semiconductor device package with multi-chips and method of the same

SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND CONNECTING THROUGH-HOLE AND METHOD OF THE SAME

Semiconductor device package with multi-chips and method of the same

Semiconductor device and semiconductor module using the same

Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method

Stacked electronic component and manufacturing method thereof

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Apparatus for wire bonding and integrated circuit chip package

Semiconductor device and method of manufacturing the same

Electronic component module and method for manufacturing the same

Panel, semiconductor device and method for the production thereof

Multi-chip module

Module with silicon-based layer

CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING OPENING AND METHOD OF THE SAME

Stacked semiconductor package

SEMICONDUCTOR PACKAGE

Surface mount electronic component and process for manufacturing same

SEMICONDUCTOR DEVICE AND PACKAGING STRUCTURE THEREFOR

CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Semiconductor package and its manufacturing method

Monolithic Controller for the Generator Unit of a Motor Vehicle

Semiconductor and Method For Producing the Same

INTEGRATED CIRCUIT SYSTEM WITH PRE-CONFIGURED BOND WIRE BALL

Semiconductor package substrate

Semiconductor substrate

Package structure and method for chip with two arrays of bonding pads on BGA substrate for preventing gold bonding wires from collapse

Integrated circuit packaging system with interposer

Heat dissipating device with preselected designed interface for thermal interface materials

Semiconductor device including semiconductor elements and method of producing semiconductor device

Semiconductor die package including leadframe with die attach pad with folded edge

Integrated circuit package system with integral inner lead and paddle

Varied Solder Mask Opening Diameters Within a Ball Grid Array Substrate

Die package with asymmetric leadframe connection

Circuit module and circuit device including circuit module

Structure and method for self protection of power device

Probe card assembly and kit

Localized alloying for improved bond reliability

SEMICONDUCTOR DEVICE INCLUDING A PLURAL CHIPS WITH PROTRUDING EDGES LAMINATED ON A DIE PAD SECTION THAT HAS A THROUGH SECTION

Stress free package and laminate-based isolator package

Fabrication method of multichip stacking structure

PRE-MOLDED LEAD FRAME AND PROCESS FOR MANUFACTURING THE SAME

Electronic component built-in substrate and method of manufacturing electronic component built-in substrate

IC package reducing wiring layers on substrate and its chip carrier

Multichip stacking structure

Chip having side pad, method of fabricating the same and package using the same

Semiconductor device manufacturing method, semiconductor device, and wiring board

Zigzag-stacked package structure

Memory card and manufacturing method of the same

Semiconductor device including isolation layer

Semiconductor device with parylene coating

Circuit substrate and the semiconductor package having the same

Semiconductor Device

Semiconductor device

Electric power semiconductor device

MULTI-CHIP PACKAGE AND METHOD OF FABRICATING THE SAME

Ball grid array structures having tape-based circuitry

High power semiconductor package

Method of making a semiconductor device having multiple die redistribution layer

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATING FILM FORMING METHOD AND BONDING METHOD USING THE SAME

Chip mount, methods of making same and methods for mounting chips thereon

Integrated circuit package with top pad

Semiconductor device package having pseudo chips

Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same

Semiconductor device having multiple die redistribution layer

Laterally Interconnected IC Packages and Methods

Power device package

Lead frame and method of manufacturing the same, and semiconductor device

CHIP PACKAGE STRUCTURE

Microelectronic Assembly Using Chip-On-Lead (COL) and Cantilever Leads

Stress mitigation in packaged microchips

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

System in package integrating a plurality of semiconductor chips

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Circuit for suppressing voltage jitter and method thereof

Mounting structure for semiconductor element

Integrated circuit package system with offset stacked die and method of manufacture thereof

Semiconductor device and manufacturing method of the same

Stacked die package with stud spacers

Stacked-die packages with silicon vias and surface activated bonding

Semiconductor Package With Rigid And Flexible Circuits

Stacked semiconductor chips having double adhesive insulating layer interposed therebetween

Memory device

Inverted lead frame in substrate

Multi-die IC package and manufacturing method

Semiconductor device with lead frame including conductor plates arranged three-dimensionally

IC package encapsulating a chip under asymmetric single-side leads

Multi-chip package

Semiconductor device and electronic device

Manufacturing method for micro-SD flash memory card

Three-dimensional package and method of making the same

Chip package and method of manufacturing the same

Integrated circuit package system employing a support structure with a recess

Leadframe on heat sink (LOHS) semiconductor packages and fabrication methods thereof

Lead-frame circuit package

Manufacturing process of a carrier

Method of making semiconductor device

Memory chip and insert card having the same thereon

Semiconductor package and method of manufacturing the same

Method of bonding wire of semiconductor package

Packaged integrated circuit with enhanced thermal dissipation

High power semiconductor package and method of making the same

Semiconductor device

Stack package and stack packaging method

Stacked integrated circuit package-in-package system

Carrierless chip package for integrated circuit devices, and methods of making same

Wire bond interconnection

Electronic component with layered frame

LDO regulator with ground connection through package bottom

Semiconductor device having plurality of leads

SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH PROJECTING BUMPS OR BALLS

Amplifier chip mounted on a lead frame

Electroplating method for a semiconductor device

METHOD OF DIE STACKING USING INSULATED WIRE BONDS

Method of fabricating a film-on-wire bond semiconductor device

Resin-sealed electronic device and method of manufacturing the same

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

CHIP PACKAGE AND FABRICATING PROCESS THEREOF

Semiconductor chip package, printed circuit board assembly including the same and manufacturing methods thereof

System-in-package (SiP) and method of manufacturing the same

Stacked die package

DIE STACKING USING INSULATED WIRE BONDS

FILM-ON-WIRE BOND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Semiconductor device and printed circuit board

SEMICONDUCTOR INTEGRATED CIRCUIT AND FABRICATION METHOD FOR THE SAME

Semiconductor integrated circuit providing for wire bonding directly above an active circuit region, and manufacturing method thereof

Leadframe, semiconductor package and support lead for bonding with groundwires

Thin film light emitting diode

Balanced semiconductor device packages including lead frame with floating leads and associated methods

Semiconductor device

Spread spectrum isolator

Method of Manufacturing a Ignition Device and a Semiconductor Device

Semiconductor device and method for manufacturing same

Semiconductor device

MULTI-CHIP STRUCTURE

Package structure having through hole in spacer thereof

Wirebond Package Design for High Speed Data Rates

IC package keeping attachment level of leads on chip during molding process

Module with carrier element

Semiconductor integrated circuit and multi-chip module

Radiation hardened lateral MOSFET structure

Electronic assembly and circuit board

PACKAGE DESIGNS FOR VERTICAL CONDUCTION DIE

Integrated circuit package system with encapsulation lock

Integrated circuit package system with heat sink

Method for fabricating semiconductor package free of substrate

Power module and motor integrated control unit

Electrical component having external contacting

Vertical Integration of Passive Component in Semiconductor Device Package for High Electrical Performance

Semiconductor device and manufacturing method of the same

Semiconductor device, wiring of semiconductor device, and method of forming wiring

Power semiconductor module

Non-pull back pad package with an additional solder standoff

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Method and apparatus of power ring positioning to minimize crosstalk

Die-up integrated circuit package with grounded stiffener

Bondwire utilized for coulomb counting and safety circuits

Stacked chip package structure with leadframe having inner leads with transfer pad

Semiconductor package and method of forming wire loop of semiconductor package

CONNECTING A PLURALITY OF BOND PADS AND/OR INNER LEADS WITH A SINGLE BOND WIRE

Stacked chip packaging with heat sink structure

Semiconductor device and method of manufacturing the same

Semiconductor integrated circuit and method for manufacturing the same

Semiconductor module arrangement

SEMICONDUCTOR PACKAGE PREVENTING WARPING AND WIRE SEVERING DEFECTS, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

CHIP PACKAGE STRUCTURE

Wire bonding and wire bonding method

ATTACHING AND INTERCONNECTING DIES TO A SUBSTRATE

Semiconductor device and wire bonding method therefor

Semiconductor integrated circuit device having reduced terminals and I/O area

Semiconductor apparatus

Semiconductor package preventing generation of static electricity therein

Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same

Semiconductor device and an information management system therefor

Wiring board

Semiconductor device

Microelectronic component assemblies and microelectronic component lead frame structures

Electronic device and lead frame

Light emitting device