207827 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
Semiconductor device including power supply bar having jutted portion, parallel running portion and bent portion and manufacturing method therefor
#4202Integrated circuit package system with bumped lead and nonbumped lead
#4203Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation
#4204Manufacturing method for integrating a shunt resistor into a semiconductor package
#4205Semiconductor chip assembly with post/base heat spreader and horizontal signal routing
#4206Electronic device having contact elements with a specified cross section and manufacturing thereof
#4207Method of manufacturing layered chip package
#4208Method of fabricating stacked wire bonded semiconductor package with low profile bond line
#4209Method of fabricating stacked semiconductor package with localized cavities for wire bonding
#4210Laser optical path detection in integrated circuit packaging
#4211Non-destructive laser optical integrated circuit package marking
#4212Method of making an electronic device and electronic device substrate
#4213Semiconductor package with reduced inductive coupling between adjacent bondwire arrays
#4214Semiconductor memory device
#4215Layered chip package and method of manufacturing same
#4216WIRE ON WIRE STITCH BONDING IN A SEMICONDUCTOR DEVICE
#4217Stacked wire bonded semiconductor package with low profile bond line
#4218Stacked semiconductor package with localized cavities for wire bonding
#4219Semiconductor device and manufacturing method for the same
#4220Semiconductor device and method of manufacturing the same
#4221Integrated circuit package system with locking terminal
#4222Semiconductor device and semiconductor integrated circuit
#4223Method and apparatus of power ring positioning to minimize crosstalk
#4224METHOD OF FABRICATING WIRE ON WIRE STITCH BONDING IN A SEMICONDUCTOR DEVICE
#4225Method for manufacturing a semiconductor integrated circuit device
#4226Semiconductor device
#4227Magnetic field sensor arrangement and method for non-contact measurement of a magnetic field
#4228Layered chip package and method of manufacturing same
#4229Electrode structure and semiconductor device
#4230Pin substrate and package
#4231Semiconductor device
#4232Stacked semiconductor devices and a method for fabricating the same
#4233Prefabricated lead frame and bonding method using the same
#4234INTEGRATED CIRCUIT DISTRIBUTED OVER AT LEAST TWO NON-PARALLEL PLANES AND ITS METHOD OF PRODUCTION
#4235Method of controlling the trajectory of a bonding tool during the formation of a wire loop
#4236Circuit apparatus and method of manufacturing the same
#4237Systems and methods for power amplifier with integrated passive device
#4238Return loss techniques in wirebond packages for high-speed data communications
#4239Semiconductor package system with substrate having different bondable heights at lead finger tips
#4240Semiconductor module and method for fabricating semiconductor module
#4241Semiconductor device mounted on heat sink having protruded periphery
#4242Semiconductor device having lands disposed inward and outward of an area of a wiring board where electrodes are disposed
#4243Integrated circuit package system with die and package combination
#4244LEAD FRAME, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING LEAD FRAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#4245CHIP PACKAGE FOR SEMICONDUCTOR DEVICES
#4246VERTICAL TRANSISTOR WITH INTEGRATED ISOLATION
#4247STACKED DIE PACKAGE
#4248Semiconductor device having function circuits selectively connected to bonding wire
#4249Semiconductor arrangement having specially fashioned bond wires
#4250Semiconductor package fabricated by cutting and molding in small windows
#4251Resin sealed semiconductor device and manufacturing method therefor
#4252Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package
#4253Integrated circuit packaging system with isolated pads and method of manufacture thereof
#4254COL (Chip-On-Lead) multi-chip package
#4255Method of forming a leaded molded array package
#4256SEMICONDUCTOR DIE AND BOND PAD ARRANGEMENT METHOD THEREOF
#4257Method for fabricating a module including a sintered joint
#4258SEMICONDUCTOR DEVICE
#4259Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package
#4260Semiconductor device
#4261Semiconductor device and manufacturing method therefor
#4262Semiconductor device assembly and method thereof
#4263Stacked structure of integrated circuits having space elements
#4264LEAD FRAME AND SEMICONDUCTOR DEVICE UTILIZING THE SAME
#4265CARD TYPE MEMORY PACKAGE
#4266ELECTRONIC CIRCUIT AND METHOD FOR MANUFACTURING SAME
#4267Method of manufacturing a semiconductor device and molding die
#4268Semiconductor device and method of manufacturing a semiconductor device
#4269SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME
#4270Circuit board, lead frame, semiconductor device, and method for fabricating the same
#4271System and method for stacking a plurality of electrically coupled semiconductor chips with a conductive pin
#4272Integrated circuit package system with shield and tie bar
#4273Power semiconductor device
#4274Semiconductor package with a chip on a support plate
#4275Semiconductor device and method of fabrication thereof
#4276Thermally Enhanced Package with Embedded Metal Slug and Patterned Circuitry
#4277Ball-bump bonded ribbon-wire interconnect
#4278Semiconductor chip package structure
#4279SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
#4280Package structure and method
#4281Integrated circuit package system with slotted die paddle and method of manufacture thereof
#4282OPTICAL SEMICONDUCTOR DEVICE
#4283Semiconductor device using lead frame
#4284QFN Semiconductor package
#4285Semiconductor chip package assembly with deflection- resistant leadfingers
#4286Method of fabricating chip package
#4287Device and method for limiting drain-source voltage of transformer-coupled push pull power conversion circuit
#4288Semiconductor device package with internal device protection
#4289Semiconductor device and method of fabrication
#4290SEMICONDUCTOR DIE PACKAGE INCLUDING DIE STACKED ON PREMOLDED SUBSTRATE INCLUDING DIE
#4291Substrate for mounting electronic component and electronic apparatus including the substrate
#4292Semiconductor integrated circuit
#4293High density memory device manufacturing using isolated step pads
#4294Bond wire loop for high speed noise isolation
#4295SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#4296Semiconductor device including offset bonding pad and inspection method therefor
#4297Interposer chip and multi-chip package having the interposer chip
#4298Method of forming an integrated circuit with MM-wave antennas using conventional IC packaging
#4299Microwave Chip Supporting Structure
#4300Semiconductor device
#4301Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same
#4302Circuit device including rotated stacked die
#4303Low voltage drop and high thermal performance ball grid array package
#4304Heat extraction from packaged semiconductor chips, scalable with chip area
#4305Electronic circuit device and method for manufacturing same
#4306INTEGRATED CIRCUIT PACKAGE AND MANUFACTURING METHOD THEREOF
#4307Semiconductor device with a peripheral circuit formed therein
#4308Power semiconductor module with pressure element and method for fabricating a power semiconductor module with a pressure element
#4309Chip package
#4310SEMICONDUCTOR PACKAGE WITH LEAD INTRUSIONS
#4311DFN semiconductor package having reduced electrical resistance
#4312Power converter apparatus
#4313COMPACT PACKAGING FOR POWER AMPLIFIER MODULE
#4314Semiconductor device packages with electromagnetic interference shielding
#4315METHOD FOR MANUFACTURING STACK CHIP PACKAGE STRUCTURE
#4316Three chip package
#4317Electronic component and method for its production
#4318LEADFRAME-BASED IC-PACKAGE WITH SUPPLY-REFERENCE COMB
#4319Semiconductor device package having features formed by stamping
#4320Semiconductor device having wiring formed on wiring board and electric conductor formed in wiring board and conductor chip formed over wiring
#4321Power Device Substrates and Power Device Packages Including the Same
#4322Semiconductor device capable of switching operation modes and operation mode setting method therefor
#4323Semiconductor device and manufacturing method of the same
#4324Window type BGA semiconductor package and its substrate
#4325Substrate, manufacturing method thereof, method for manufacturing semiconductor device
#4326Semiconductor device package
#4327Integrated circuit package system with stacking module
#4328Mountable integrated circuit package system with substrate
#4329Mountable integrated circuit package system with exposed external interconnects
#4330Method and apparatus for a package having multiple stacked die
#4331Complex semiconductor packages and methods of fabricating the same
#4332Lead frame and package of semiconductor device
#4333Semiconductor chip package assembly method and apparatus for countering leadfinger deformation
#4334Leadframe, semiconductor packaging structure and manufacturing method thereof
#4335I/O connection scheme for QFN leadframe and package structures
#4336Method of manufacturing semiconductor device and semiconductor device
#4337Capacitive isolation circuitry with improved common mode detector
#4338Semiconductor device capable of switching operation modes
#4339Methods for a multiple die integrated circuit package
#4340High frequency power amplifier
#4341Integrated circuit package system with support structure for die overhang
#4342Wire bonding over active circuits
#4343RF transistor output impedance technique for improved efficiency, output power, and bandwidth
#4344Ball grid array package system
#4345THERMALLY-ENHANCED MULTI-HOLE SEMICONDUCTOR PACKAGE
#4346Semiconductor device
#4347IC PACKAGE WITH WIREBOND AND FLIPCHIP INTERCONNECTS ON THE SAME DIE WITH THROUGH WAFER VIA
#4348Semiconductor memory card and semiconductor memory device
#4349COL SEMICONDUCTOR PACKAGE
#4350Semiconductor chip package
#4351Semiconductor chip package
#4352Integrated circuit package system with isloated leads
#4353Chip arrangement and a method of determining an inductivity compensation structure for compensating a bond wire inductivity in a chip arrangement
#4354Semiconductor device and manufacturing method of the same
#4355Dual flat non-leaded semiconductor package
#4356Semiconductor package and multi-chip package using the same
#4357Semiconductor die package including embedded flip chip
#4358Semiconductor die package including multiple semiconductor dice
#4359System for solder ball inner stacking module connection
#4360Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof
#4361Method for producing a semiconductor device and the semiconductor device
#4362Stress Mitigation in Packaged Microchips
#4363Leadframe package with dual lead configurations
#4364Semiconductor die package including IC driver and bridge
#4365Semiconductor device and method of manufacturing the same
#4366Semiconductor device and manufacturing method thereof
#4367Integrated circuit with step molded inner stacking module package in package system
#4368Semiconductor device with wire-bonding on multi-zigzag fingers
#4369Semiconductor device having a gate contact on one surface electrically connected to a gate bus on an opposing surface
#4370Lead frame isolation using laser technology
#4371Semiconductor device
#4372SEMICONDUCTOR DEVICE
#4373Storage medium and semiconductor package
#4374Semiconductor device, electronic device, and manufacturing method of the same
#4375Capacitive isolation circuitry
#4376Semiconductor device
#4377Semiconductor device and a method of manufacturing the same
#4378Integrated circuit package system with overhang film
#4379Ball grid array package layout supporting many voltage splits and flexible split locations
#4380Thermally enhanced molded leadless package
#4381Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof
#4382Pressure sense die pad layout and method for direct wire bonding to programmable compensation integrated circuit die
#4383Electronic device substrate and its fabrication method, and electronic device and its fabrication method
#4384Semiconductor device
#4385RF module
#4386Wirebond over post passivation thick metal
#4387System and method for integrated waveguide packaging
#4388Intermediate Bond Pad for Stacked Semiconductor Chip Package
#4389Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom
#4390Enhanced Die-Up Ball Grid Array and Method for Making the Same
#4391INDUCTANCE ELEMENT IN AN INTEGRATED CIRCUIT PACKAGE
#4392Semiconductor device
#4393Integrated circuit having wide power lines
#43943D smart power module
#4395Semiconductor device and manufacturing method thereof
#4396Integrated circuit package
#4397Semiconductor device and manufacturing method of the same
#4398Method of fabricating chip package structure
#4399Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires
#4400Differential internally matched wire-bond interface
#4401Integrated circuit with supply line intra-chip clock interface and methods for use therewith
#4402Semiconductor package and methods of fabricating the same
#4403Semiconductor device package and method of making a semiconductor device package
#4404Semiconductor device packages with electromagnetic interference shielding
#4405Semiconductor device packages with electromagnetic interference shielding
#4406SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
#4407Wire bonding method
#4408Bondwire design
#4409Semiconductor device and manufacturing method thereof
#4410Apparatus for improved power distribution in wirebond semiconductor packages
#4411Semiconductor device
#4412STACK CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#4413Integrated Circuit, Semiconductor Module and Method for Manufacturing a Semiconductor Module
#4414Tape wiring substrate and tape package using the same
#4415Method of manufacturing semiconductor device
#4416Semiconductor package with stacked dice for a buck converter
#4417Semiconductor device and manufacturing method of the same
#4418Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device
#4419Ultra-Thin Semiconductor Package
#4420Semiconductor device
#4421Power semiconductor devices having integrated inductor
#4422Semiconductor power device with bias circuit
#4423Semiconductor package apparatus having redistribution layer
#4424SEMICONDUCTOR DEVICE PACKAGE
#4425Leadless package
#4426Integrated circuit incorporating wire bond inductance
#4427Integrated circuit package-on-package stacking system and method of manufacture thereof
#4428Semiconductor device and method of manufacturing the same
#4429Semiconductor device, DC/DC converter and power supply
#4430Method of manufacturing a semiconductor device
#4431Semiconductor device having a chip mounting portion and a plurality of suspending leads supporting the chip mounting portion and each suspension lead having a bent portion
#4432High power integrated RF amplifier
#4433Module with Flat Construction and Method for Placing Components
#4434Semiconductor package and semiconductor device
#4435Semiconductor package with an embedded printed circuit board and stacked die
#4436Flexible contactless wire bonding structure and methodology for semiconductor device
#4437Radio frequency over-molded leadframe package
#4438IC MODULE, IC INLET, AND IC MOUNTED BODY
#4439Integrated circuit device and method of producing
#4440Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits
#4441Compact inductive power electronics package
#4442Method for cutting and molding in small windows to fabricate semiconductor packages
#4443Integrated circuit package with improved connections
#4444Power semiconductor module
#4445SEMICONDUCTOR CHIP PACKAGE
#4446SEMICONDUCTOR STACK DEVICE AND MOUNTING METHOD
#4447Semiconductor memory device
#4448Etched surface mount islands in a leadframe package
#4449LEAD FRAME DIE ATTACH PADDLES WITH SLOPED WALLS AND BACKSIDE GROOVES SUITABLE FOR LEADLESS PACKAGES
#4450Integrated circuit package system with shielding
#4451Semiconductor device and its manufacture
#4452WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
#4453Integrated circuit and manufacturing process facilitating selective configuration for electromagnetic compatibility
#4454Semiconductor chip
#4455AVOIDING ELECTRICAL SHORTS IN PACKAGING
#4456Low profile wire bonded USB device
#4457Method of forming a wafer level package
#4458Semiconductor device
#4459Electronic circuit arrangement and method for producing an electronic circuit arrangement
#4460Compact power semiconductor package and method with stacked inductor and integrated circuit die
#4461Surface-mount type crystal oscillator
#4462DOWNHOLE TOOL
#4463Managed Memory Component
#4464Package with multiple dies
#4465Low cost high frequency device package and methods
#4466Integrated circuit package system with offset stacking and anti-flash structure
#4467Semiconductor device and optical pickup device
#4468Microwave chip supporting structure
#4469Circuit board having bypass pad
#4470Controller chip mounted on a memory chip with re-wiring lines
#4471Methods and systems for packaging integrated circuits
#4472Integrated circuit packaging system with interposer
#4473Electronic device
#4474Integrated circuit package system for shielding electromagnetic interference
#4475Electronic device including an inductor
#4476Semiconductor component
#4477Disguising test pads in a semiconductor package
#4478FORMING EDGE METALLIC CONTACTS AND USING COULOMB FORCES TO IMPROVE OHMIC CONTACT
#4479SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
#4480Wire bonding personalization and discrete component attachment on wirebond pads
#4481Semiconductor device and method of manufacturing the same
#4482Method for attaching a semiconductor die to a leadframe, and a semiconductor device
#4483Chip-stacked package structure with asymmetrical leadframe
#4484Lead frame and semiconductor device provided with lead frame
#4485Semiconductor device
#4486Electronic device
#4487Embedded package security tamper mesh
#4488Integrated circuit package system with shield
#4489Integrated circuit package system for electromagnetic isolation
#4490Component attach methods and related device structures
#4491MULTI-LAYERED WIRING SUBSTRATE, METHOD FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE
#4492Surface mount device
#4493Reconfigurable system that exchanges substrates using coulomb forces to optimize a parameter
#4494Data transfer between chips in a multi-chip semiconductor device with an increased data transfer speed
#4495LCD Driver IC and Method for Manufacturing the Same
#4496Touch screen system with light reflection
#4497System-in-package
#4498Metal foil interconnection of electrical devices
#4499Chip package
#4500Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device