207827 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
Electronic component housing package and electronic apparatus
#6302Semiconductor device and method of manufacturing the same
#6303Chip module
#6304Wire bonding method and semiconductor device
#6305Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier
#6306Module with integrated active substrate and passive substrate
#6307Stacked electronic part
#6308Method of sensor packaging
#6309Thin semiconductor package including stacked dies
#6310Semiconductor package having step type die and method for manufacturing the same
#6311Manufacturing and testing of electrostatic discharge protection circuits
#6312Method and apparatus for bonding a wire
#6313Semiconductor package
#6314Multi-chip package
#6315Semiconductor device and manufacturing method thereof
#6316Semiconductor device and electronic device
#6317Leadframe with die pad
#6318Semiconductor device and method of manufacturing the same
#6319Bonding pad structure, display panel and bonding pad array structure using the same and manufacturing method thereof
#6320Multi-chip package including at least one semiconductor device enclosed therein
#6321High frequency semiconductor device
#6322Semiconductor package free of substrate and fabrication method thereof
#6323Semiconductor package free of substrate and fabrication method thereof
#6324Semiconductor package free of substrate and fabrication method thereof
#6325Bonding pad arrangement method for semiconductor devices
#6326Testable electrostatic discharge protection circuits
#6327Semiconductor device
#6328Light emitting device
#6329Infrared receiver chip
#6330Ultrasonic bonding apparatus and method
#6331Electrical contact
#6332Semiconductor package free of substrate and fabrication method thereof
#6333Semiconductor package with crossing conductor assembly and method of manufacture
#6334Apparatus for encapsulating a multi-chip substrate array
#6335Interconnect system without through-holes
#6336Method of manufacturing a semiconductor device
#6337Method of surface mounting a semiconductor device
#6338Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus
#6339Intrinsic thermal enhancement for FBGA package
#6340RF package
#6341Semiconductor integrated circuit device
#6342Daisy chaining of serial I/O interface on stacking devices
#6343Optimized power delivery to high speed, high pin-count devices
#6344Semiconductor device and a memory system including a plurality of IC chips in a common package
#6345Semiconductor package free of substrate and fabrication method thereof
#6346Two die semiconductor assembly and system including same
#6347Lead frame and method for manufacturing semiconductor package with the same
#6348Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit
#6349Semiconductor device and method of manufacturing same
#6350Electronic circuit module
#6351Thermal head and bonding connection method therefor
#6352Miniaturized chip scale package structure
#6353Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles
#6354Chip-on-board module, and method of manufacturing the same
#6355Manufacturing method of a semiconductor device utilizing a flexible adhesive tape
#6356High-frequency power amplifier module
#6357Semiconductor device having bonding pad above low-k dielectric film
#6358Wire-bonding method and semiconductor package using the same
#6359Method for assembling a ball grid array package with two substrates
#6360Semiconductor package with passive device integration
#6361Trench-gate semiconductor devices
#6362System and method for automated wire bonding
#6363Flip-chip adaptor package for bare die
#6364High performance RF inductors and transformers using bonding technique
#6365Method and apparatus for high electrical and thermal performance ball grid array package
#6366Assembly and method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part
#6367Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package
#6368Surface mountable hermetically sealed package
#6369METHOD FOR PRODUCING WEDGE-WEDGE WIRE CONNECTION
#6370Interconnection device and system
#6371Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same
#6372Semiconductor device and manufacturing method of them
#6373Semiconductor device
#6374Semiconductor device
#6375Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#6376Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate
#6377Junction member comprising junction pads arranged in matrix and multichip package using same
#6378Hermetic surface mounted power package
#6379Semiconductor device
#6380Manufacturing method for resin sealed semiconductor device
#6381Semiconductor apparatus
#6382Electronic component package
#6383Semiconductor integrated circuit device
#6384Structure of gold fingers
#6385Microelectronic component assemblies and microelectronic component lead frame structures
#6386Partially populated ball grid design to accommodate landing pads close to the die
#6387Microelectronic component assemblies and microelectronic component lead frame structures
#6388Reduced size semiconductor package with stacked dies
#6389Concealable chip leadframe unit structure
#6390Semiconductor device
#6391Methods of making microelectronic assemblies
#6392Method for manufacturing semiconductor device with plural semiconductor chips
#6393Semiconductor integrated circuit device
#6394Stacked IC device having functions for selecting and counting IC chips
#6395Low profile package having multiple die
#6396Electronic device having wiring substrate and lead frame
#6397System and method for increasing the strength of a bond made by a small diameter wire in ball bonding
#6398Semiconductor device and manufacturing method thereof
#6399Method for fabricating a flash-preventing window ball grid array semiconductor package
#6400Alignment and orientation features for a semiconductor package
#6401Method of manufacturing semiconductor device
#6402Semiconductor device and semiconductor module
#6403Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same
#6404Multi-part lead frame with dissimilar materials
#6405Surface mount package
#6406Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area
#6407Strobe light control circuit and IGBT device
#6408Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#6409Chip assembly package
#6410Method of manufacturing a semiconductor device
#6411Leadless semiconductor package
#6412Semiconductor package with increased number of input and output pins
#6413Tapered dielectric and conductor structures and applications thereof
#6414Multiple chip package module having inverted package stacked over die
#6415Wire bonding package
#6416Method of assembling a ball grid array package with patterned stiffener layer
#6417Dual semiconductor die package with reverse lead form
#6418Stack package with improved heat radiation and module having the stack package mounted thereon
#6419Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions
#6420Semiconductor packaging substrate
#6421Semiconductor component arrangement with an insulating layer having nanoparticles
#6422Opto-electronic assembly having an encapsulant with at least two different functional zones
#6423Wire bonding apparatus and method for clamping a wire
#6424Method and apparatus for trace shielding and routing on a substrate
#6425Power module with heat exchange
#6426Inverted J-lead for power devices
#6427Semiconductor device
#6428Ball grid array package substrates with a modified central opening and method for making the same
#6429Semiconductor packages for enhanced number of terminals, speed and power performance
#6430Semiconductor device and fabrication method thereof
#6431Method of incorporating interconnect systems into an integrated circuit process flow
#6432Method of forming land grid array packaged device
#6433Semiconductor device and method of manufacturing thereof
#6434Semiconductor device and a method of manufacturing the same
#6435Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method
#6436Semiconductor device
#6437Semiconductor package with a chip on a support plate
#6438Low-power semiconductor chip with separated power ring, method for manufacturing the same, and method for controlling the same
#6439Chip package and electrical connection structure between chip and substrate
#6440Semiconductor device
#6441Electroplating method for a semiconductor device
#6442Resonator device, electronic equipment provided with resonator device and method of manufacturing resonator device
#6443Circuit layout structure
#6444Stacked chip semiconductor device
#6445Method of manufacturing a semiconductor device including using a sealing resin to form a sealing body
#6446Formation of circuitry with modification of feature height
#6447Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
#6448Parallel design processes for integrated circuits
#6449Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation
#6450Plastic dual-in-line packaging (PDIP) having enhanced heat dissipation
#6451Multi-concentric pad arrangements for integrated circuit pads
#6452Semiconductor device
#6453Methods and apparatus for integrated circuit device power distribution via internal wire bonds
#6454Method of manufacturing a semiconductor device
#6455Frame for semiconductor package
#6456Fretting and whisker resistant coating system and method
#6457Power amplifier device
#6458Encapsulated lead having step configuration
#6459Circuit device and manufacturing method thereof
#6460Semiconductor package
#6461Wafer level stack structure for system-in-package and method thereof
#6462Integrated circuit carrier apparatus method and system
#6463Semiconductor device and manufacturing method thereof
#6464Molded leadless package having a partially exposed lead frame pad
#6465Semiconductor device and manufacturing method thereof
#6466Semiconductor integrated circuit
#6467Integrated circuit device and the manufacturing method thereof
#6468FBGA arrangement
#6469Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#6470Lead frame and semiconductor package with the same
#6471Semiconductor device having a semiconductor chip mounted on external terminals and fabrication method thereof
#6472Semiconductor device
#6473Wire loop height measurement apparatus and method
#6474Stacked semiconductor device including improved lead frame arrangement
#6475Method of forming an electrical contact
#6476Semiconductor chip and semiconductor device including lamination of semiconductor chips
#6477Multi-surface contact IC packaging structures and assemblies
#6478Semiconductor package for memory chips
#6479Antenna-incorporated semiconductor device
#6480Multi-surface IC packaging structures and methods for their manufacture
#6481Semiconductor device, electronic card and pad rearrangement substrate
#6482Semiconductor device, electronic card and pad rearrangement substrate
#6483Power semiconductor device and power semiconductor module
#6484Modular power semiconductor module
#6485Semiconductor device
#6486Plastic package and method of fabricating the same
#6487Method of mounting a circuit component and joint structure therefor
#6488Thin film light emitting diode
#6489Technique for attaching die to leads
#6490Circuit device
#6491Use of a down-bond as a controlled inductor in integrated circuit applications
#6492Circuit device
#6493Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load
#6494Resin molded type semiconductor device and a method of manufacturing the same
#6495Method for reduced input output area
#6496RF circuit electrostatic discharge protection
#6497Cavity-down semiconductor package with heat spreader
#6498Circuit device
#6499Electromagnetic noise shielding in semiconductor packages using caged interconnect structures
#6500Electronic substrate, power module and motor driver
#6501Method for fabricating a semiconductor package with multi layered leadframe
#6502Radio frequency unit analog level detector and feedback control system
#6503System and method for reducing or eliminating semiconductor device wire sweep
#6504Thermally enhanced packaging structure and fabrication method thereof
#6505Output circuit for a semiconductor amplifier element
#6506Electrical interconnection for high-frequency devices
#6507RF amplifier
#6508Method for producing semiconductor device and semiconductor device
#6509Resin-sealed semiconductor device
#6510Semiconductor component and production method suitable therefor
#6511Integrated circuit package with integral leadframe convector and method therefor
#6512Semiconductor device
#6513Chip package and electrical connection structure between chip and substrate
#6514Semiconductor laser device
#6515Semiconductor radiation emitter package
#6516High power light emitting diode device
#6517Integrated circuit package with laminated power cell having coplanar electrode
#6518Ball grid array package with patterned stiffener surface and method of assembling the same
#6519Metallic dam and method of forming therefor
#6520Lead frame, semiconductor device, and method for manufacturing semiconductor device
#6521Transistor having multiple gate pads
#6522Semiconductor device and method for producing the same
#6523Spacerless die stacking
#6524Semiconductor device containing stacked semiconductor chips and manufacturing method thereof
#6525Method of forming a semiconductor package and structure thereof
#6526Circuit carrier and production thereof
#6527Semiconductor package
#6528Single chip and stack-type chip semiconductor package and method of manufacturing the same
#6529Window ball grid array semiconductor package and method for fabricating the same
#6530Window ball grid array semiconductor package with substrate having opening and mehtod for fabricating the same
#6531Receptacle for a programmable, electronic processing device
#6532Via placement for layer transitions in flexible circuits with high density ball grid arrays
#6533Moisture-resistant electronic device package and methods of assembly
#6534Semiconductor device capable of detecting an open bonding wire using weak current
#6535High-frequency module and method for manufacturing the same
#6536Semiconductor apparatus with decoupling capacitor
#6537Circuit device and manufacturing method of circuit device
#6538Lead frame
#6539Semiconductor component arrangement with a reduced oscillation tendency
#6540Semiconductor device and manufacturing method of semiconductor device
#6541System and method for marking the surface of a semiconductor package
#6542Memory card
#6543Semiconductor device
#6544Bonding pad design for impedance matching improvement
#6545BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same
#6546Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same
#6547Multiple cavity/compartment package
#6548Tape substrates with mold gate support structures that are coplanar with conductive traces thereof and associated methods
#6549Semiconductor package having high quantity of I/O connections and method for fabricating the same
#6550Radiation shielded semiconductor package
#6551Electrical contact and connector and method of manufacture
#6552Electrical contact and connector and method of manufacture
#6553Semiconductor device with staggered electrodes and increased wiring width
#6554Semiconductor device
#6555Leadless semiconductor package
#6556Method of fabricating a two die semiconductor assembly
#6557High-frequency chip packages
#6558Integrated circuit package having inductance loop formed from a bridge interconnect
#6559Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure
#6560Integrated circuit package having an inductance loop formed from a multi-loop configuration
#6561Semiconductor device and method for production thereof
#6562High frequency semiconductor integrated circuit device, wireless electric unit and wireless communication system
#6563Circuit device
#6564Semiconductor component having dummy segments with trapped corner air
#6565Wirebonded assemblage method and apparatus
#6566Electronic component and method for manufacturing the same
#6567Semiconductor package using flexible film and method of manufacturing the same
#6568Die-up ball grid array package including a substrate having an opening and method for making the same
#6569Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors
#6570Chip package structure
#6571Power semiconductor module with deflection-resistant base plate
#6572Method for fabricating semiconductor components using mold cavities having runners configured to minimize venting
#6573Probe card assembly
#6574Package substrate and process thereof
#6575Lead frame, semiconductor device using the same and method of producing the semiconductor device
#6576Electronic circuit device
#6577Semiconductor memory module
#6578Semiconductor device
#6579Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks
#6580Semiconductor device structural body and electronic device
#6581Enhanced die-up ball grid array and method for making the same
#6582Integrated circuit package with overlapping bond fingers
#6583Stacked mass storage flash memory package
#6584Lead-frame-based semiconductor package and fabrication method thereof
#6585Topless semiconductor package
#6586Semiconductor module and DC-DC converter
#6587Protection circuit device using MOSFETs and a method of manufacturing the same
#6588Semiconductor device and method of manufacturing the same
#6589Method for checking the quality of a wedge bond
#6590Contact structures and methods for making same
#6591Packaged microelectronic components
#6592Power supply device
#6593Low-inductance circuit arrangement for power semiconductor modules
#6594Voltage protection device
#6595Millimeter wave (MMW) radio frequency transceiver module and method of forming same
#6596High frequency circuit using high output amplifier cell block and low output amplifier cell block
#6597Nickel bonding cap over copper metalized bondpads
#6598Method for assembling a ball grid array package with multiple interposers
#6599Multi-chips module package and manufacturing method thereof
#6600Semiconductor device and its manufacturing method