Simplified multichip packaging and package design

Integrated circuit including silicon wafer with annealed glass paste

Ultra-thin semiconductor package device and method for manufacturing the same

Method for two-stage transfer molding device to encapsulate MMC module

Semiconductor device, method and apparatus for fabricating the same

Power module, and phase leg assembly

Power amplifier module

Methods and systems for rise-time improvements in differential signal outputs

BGA package having substrate with exhaust hole

Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate

Semiconductor packages with asymmetric connection configurations

Semiconductor system with fine pitch lead fingers

Tolerance bondwire inductors for analog circuitry

Semiconductor package device and method for fabricating the same

Integration type semiconductor device and method for manufacturing the same

Staggered wirebonding configuration

Substrate for electrical device and methods for making the same

Multi chip package

IC chip package with isolated vias

Integrated circuit device having flexible leadframe

Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound

Integrated circuit chip package having a ring-shaped silicon decoupling capacitor

Vertical protecting element formed in semiconductor substrate and semiconductor device using the same

Integrated circuit die with logically equivalent bonding pads

Multi-chip package

Methods for designing and tuning one or more packaged integrated circuits

Electrical contact and connector and method of manufacture

Semiconductor device and method for manufacturing same

Cavity-down Package and Method for Fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device and method of fabricating the same

Semiconductor device and a method for manufacturing of the same

Plastic package and semiconductor component comprising such a plastic package, and method for its production

Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module

Stacked semiconductor multi-chip package

Flip chip package including a non-planar heat spreader and method of making the same

IC package structures having separate circuit interconnection structures and assemblies constructed thereof

Method for fabricating semiconductor package with short-prevented lead frame

IC substrate and manufacturing method thereof and semiconductor element package thereby

Cavity-down multiple-chip package

Semiconductor device having element portion and control circuit portion

Iridium oxide nanowires and method for forming same

Circuit carrier and production thereof

Method for making electronic packages

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Multichip leadframe package

Manufacturing method of a semiconductor device

Semiconductor device and its manufacturing method

Semiconductor device and manufacturing method for the same

Stacked die module

Power amplifier module

Power transistor including a leadframe and a semiconductor chip arranged on the leadframe

Semiconductor package structure with microstrip antennan

Die attach paddle for mounting integrated circuit die

Integrated circuit package employing a flexible substrate

Semiconductor device

Power semiconductor module

Mold compound interlocking feature to improve semiconductor package strength

Semiconductor device

Methods for manufacturing semiconductor device, semiconductor device and metal mold

Semiconducting device that includes wirebonds

Surface-mounted microwave package and corresponding mounting with a multilayer circuit

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Semiconductor package with wire bond arrangement to reduce cross talk for high speed circuits

Die down ball grid array package

Reinforced bond pad for a semiconductor device

Semiconductor package with crossing conductor assembly and method of manufacture

Semiconductor package having a heat slug and manufacturing method thereof

Semiconductor device

Semiconductor device having a switch circuit

Semiconductor device

Semiconductor device and semiconductor device unit

Semiconductor device and a method of assembling a semiconductor device

Method of fabricating a semiconductor die package having improved inductance characteristics

Tape ball grid array package with electromagnetic interference protection and method for fabricating the package

Physical quantity sensor, lead frame, and manufacturing method therefor

Method of forming precision leads on a chip-supporting leadframe

Technique for attaching die to leads

Semiconductor package having a partial slot cover for encapsulation process

Wire-bonding method for connecting wire-bond pads and chip and the structure formed thereby

Semiconductor device, lead frame, and methods for manufacturing the same

High density interconnect power and ground strap and method therefor

Semiconductor device

Method of manufacturing semiconductor device

Wire sweep resistant semiconductor package and manufacturing method thereof

Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same

Integrated circuit with substantially perpendicular wire bonds

Apparatus and method for reducing signal cross talk between wire bonds of semiconductor packages

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Semiconductor device having a heat-dissipation member

Electronic component package

Stacked die packaging and fabrication method

Apparatus for improved power distribution in wirebond semiconductor packages

Method of making a semiconductor device adapted to remove noise from a signal

SMT three phase inverter package and lead frame

Floating lead finger on a lead frame, lead frame strip, and lead frame assembly including same

Semiconductor integrated circuit device which restricts an increase in the area of a chip, an increase in the number of lead terminals of a package, and can reduce parasitic inductance

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

Substrate for producing semiconductor packages

Submember mounted on a chip of electrical device for electrical connection

Electronic packages with dice landed on wire bonds

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

Methods for designing spacers for use in stacking semiconductor devices or semiconductor device components

Integrated circuit package including miniature antenna

Probe for semiconductor devices

Low profile, chip-scale package and method of fabrication

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Half-bridge package

Circuit device manufacturing method

Programmable radio transceiver

Method for fabricating semiconductor package with circuit side polymer layer

Method of creating electrostatic discharge protection in a microelectronic module

Apparatus and methods for constructing antennas using wire bonds as radiating elements

Component arrangement having an evaluation circuit for detecting wear on connections

Method and apparatus for stacked die packaging

Optical or electronic module and method for its production

Methods of forming wire bonds for semiconductor constructions

Control unit and method for producing the same

Power amplifier arrangement and method for processing a radiofrequency signal

Semiconductor device and method of manufacturing same

Semiconductor package with stacked chips and method for fabricating the same

Chip structure with redistribution traces

Semiconductor device and a manufacturing method of the same

Electronic device and angular velocity detector

Active plate-connector device with built-in semiconductor dies

Semiconductor device and method of manufacturing a semiconductor device

Semiconductor package and method for its manufacture

Semiconductor device and its manufacturing method

Bonding configurations for lead-frame-based and substrate-based semiconductor packages

Power semiconductor package

Method for fabricating a semiconductor component with contacts situated at the underside

Radiofrequency power semiconductor module with cavity housing, and method for producing it

Semiconductor device

Manufacturing method for magnetic sensor and lead frame therefor

Thermal interposer for cooled electrical packages

Semiconductor component having stacked, encapsulated dice and method of fabrication

Stacked semiconductor device and semiconductor memory module

Plastic encapsulated semiconductor device with reliable down bonds

Semiconductor device

Semiconductor device in which semiconductor chip is mounted on lead frame

Lead frame for improving molding reliability and semiconductor package with the lead frame

Switch elements and a DC/DC converter using the same

Stacked package electronic device

Method for fabricating semiconductor components using conductive layer and grooves

Technique for protecting photonic devices in optoelectronic packages with clear overmolding

In-line wire bonding on a package, and method of assembling same

Methods and apparatus for integrated circuit ball bonding using stacked ball bumps

Packaging stacked chips with finger structure

Low inductance semiconductor device having half-bridge configuration

Semiconductor chip package with thermoelectric cooler

Integrated circuit package including embedded thin-film battery

Quad flat non-leaded package

Circular wire-bond pad, package made therewith, and method of assembling same

Leadless semiconductor package and method for manufacturing the same

Methods for designing carrier substrates with raised terminals

Leadframe for a multi-chip package and method for manufacturing the same

Electrostatic discharge (ESD) protection for integrated circuit packages

Multi-chip semiconductor connector assemblies

Semiconductor device and method of manufacturing the same

Ultra thin dual chip image sensor package structure and method for fabrication

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Components with posts and pads

Sensor equipment having sensing portion and method for manufacturing the same

Prefabricated semiconductor chip carrier

Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same

Multiple device package

Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages

Co-packaged control circuit, transistor and inverted diode

Semiconductor device

Semiconductor apparatus and method of manufacturing semiconductor apparatus

High density chip scale leadframe package and method of manufacturing the package

Method and system for improved wire bonding

Nitride semiconductor device

Spread spectrum isolator

Methods of making microelectronic packages

RF isolator for isolating voltage sensing and gate drivers

RF isolator with differential input/output

Transformer isolator for digital power supply

Electrical contact

Semiconductor device

Ribbon bonding in an electronic package

Stacked semiconductor package having adhesive/spacer structure and insulation

Semiconductor equipment having multiple semiconductor devices and multiple lead frames

On chip transformer isolator

Semiconductor device

Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith

Corrosion resistance enhancement of tin surfaces

Module with multiple power amplifiers and power sensors

Encapsulated chip and method of fabrication thereof

Semiconductor integrated circuit device and method for fabricating the same

Circuit device and manufacturing method thereof

Circuit device and manufacturing method thereof

Semiconductor device including amplifier and frequency converter

Circuit device and manufacturing method thereof

Method of fabricating a semiconductor device used in a stacked-type semiconductor device

IC chip package

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Semiconductor device and a method of manufacturing the same

Integrated circuit leadframe and fabrication method therefor

Circuit device with dummy elements

Semiconductor device

Wire bonding method and apparatus for integrated circuit

Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip

Circuit device and manufacturing method thereof

Moisture-resistant electronic device package and methods of assembly

Method and apparatus for stacking electrical components using outer lead portions and exposed inner lead portions to provide interconnection

Multi-band tunable resonant circuit

Circuit device, manufacturing method thereof, and sheet-like board member

Method and system for applying an adhesive substance on an electronic device

Dual row leadframe and fabrication method

Circuit board and semiconductor device using the same

Double density method for wirebond interconnect

Semiconductor device and manufacturing process thereof

Semiconductor device, method for mounting the same, and method for repairing the same

Semiconductor device and method of manufacturing the same

Packaged integrated circuit with MLP leadframe and method of making same

Power composite integrated semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method therefor

Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

High heat release semiconductor and method for manufacturing the same

Universal interconnect die

Integrated circuit packaging method and structure for redistributing configuration thereof

Solder flow stops for semiconductor die substrates

High electrical performance semiconductor package

Mold gates and tape substrates including the mold gates

Package design and method for electrically connecting die to package

Systems for degating packaged semiconductor devices with tape substrates

Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly

Power module and electric transportation apparatus incorporating the same

Semiconductor micro device

Method and apparatus for decoupling conductive portions of a microelectronic device package

Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components

Whisker inhibition in tin surfaces of electronic components

Semiconductor device

CHIP-PACKAGING WITH BONDING OPTIONS CONNECTED TO A PACKAGE SUBSTRATE

Circuit method integrating the power distribution functions of the circuits and leadframes into the chip surface

High data rate chip mounting

Electronic circuit package

Chip-packaging with bonding options having a plurality of package substrates

Optical surface mount technology package

Leads under chip IC package

Semiconductor device

Single row bond pad arrangement

Method and apparatus for synthesizing high-frequency signals for wireless communications

Semiconductor chip having pads with plural junctions for different assembly methods

Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same

Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging

Method for low loop wire bonding

Power module comprising at least two substrates and method for producing the same

Semiconductor chip having pads with plural junctions for different assembly methods

Semiconductor device and hybrid integrated circuit device

Semiconductor package for a large die

Semiconductor device in which semiconductor chip is mounted on lead frame

High-frequency amplification device

Semiconductor device, semiconductor circuit and method for producing semiconductor device

Semiconductor device

Lead frame and method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device

Semiconductor device

High power Doherty amplifier

Microelectronic assembly having a redistribution conductor over a microelectronic die

Semiconductor device and printed circuit board

Display device

Power semiconductor module

Semiconductor integrated circuit

Semiconductor device

Automatic wiring method and apparatus for semiconductor package and automatic identifying method and apparatus for semiconductor package

Programmable radio transceiver

Integrated circuit package and method having wire-bonded intra-die electrical connections

Semiconductor device and method of fabricating the same

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

Circuit device

Thermally enhanced component interposer: finger and net structures

System for reducing or eliminating semiconductor device wire sweep

Multi-part lead frame

Integrated circuit device having flexible leadframe

Leadless semiconductor package and manufacturing method thereof

Power semiconductor switching-device and semiconductor power module using the device

Die down semiconductor package

Split-gate power module for suppressing oscillation therein

Interposer including adhesive tape

Semiconductor device with non-overlapping chip mounting sections

Semiconductor BGA package having a segmented voltage plane and method of making

Device mounting board and semiconductor apparatus using device mounting board

Power semiconductor module

Programmable radio transceiver

Motor driving system having power semiconductor module life detection function

Resin-sealed semiconductor device and method of manufacturing the same

Multichip semiconductor package

Semiconductor apparatus with improved yield

Semiconductor device

Circuit device and manufacturing method thereof

Multilayer integrated circuit for RF communication and method for assembly thereof

Semiconductor device designed to produce no resonance of loop due to ultrasonic vibration, semiconductor design apparatus and method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Lead on chip semiconductor package

Integrated circuit module package and assembly method thereof

Solid state imaging device having electromagnetic wave absorber attached to a mounting board

Semiconductor chip packaging method with individually placed film adhesive pieces