207827 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
CHIP-ON-LEAD SEMICONDUCTOR DEVICE PACKAGES WITH ELECTRICALLY ISOLATED SIGNAL LEADS
#902Integrated circuit package including miniature antenna
#903Semiconductor package
#904Radio frequency transistor amplifiers and other multi-cell transistors having isolation structures
#905Radio frequency transistor amplifiers and other multi-cell transistors having gaps and/or isolation structures between groups of unit cell transistors
#906Wire bonding between isolation capacitors for multichip modules
#907Semiconductor device, power converter, method for manufacturing semiconductor device, and method for manufacturing power converter
#908Packaged integrated circuit having stacked die and method for therefor
#909Memory package including buffer, expansion memory module, and multi-module memory system
#910Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
#911Packaged multichip module with conductive connectors
#912Multi-branch terminal for integrated circuit (IC) package
#913Bottom package exposed die MEMS pressure sensor integrated circuit package design
#914Dipole antenna via flexible circuitry
#915Flex lead on cell container for electromagnetic shielding
#916Cell-mounted monolithic integrated circuit for measuring, processing, and communicating cell parameters
#917Electronic device package
#918Semiconductor device with electroplated die attach
#919Semiconductor device
#920Positional relationship among components of semiconductor device
#921Inverted leads for packaged isolation devices
#922Method of manufacturing a semiconductor device
#923Semiconductor memory device
#924DC and AC magnetic field protection for MRAM device using magnetic-field-shielding structure
#925SEMICONDUCTOR PRODUCT SUBSTRATE INCLUDING STRESS RELIEF LAYER
#926Rotatable architecture for multi-chip package (MCP)
#927Contact fabrication to mitigate undercut
#928POWER MODULE AND POWER CONVERSION APPARATUS
#929Semiconductor device
#930Package substrates having an electromagnetic bandgap structure and semiconductor packages employing the package substrates
#931Wiring structure of glass substrate, glass substrate and display device
#932COAXIAL WIRE
#933Semiconductor device with island and associated leads
#934DAM LAMINATE ISOLATION SUBSTRATE
#935Wireless communication with dielectric medium
#936Semiconductor device
#937Semiconductor device
#938Power supply circuit and related methods for generating a power supply voltage in a semiconductor package
#939Shielded electronic component package
#940Segmented shielding using wirebonds
#941Semiconductor device and method of manufacturing the same
#942Package-on-package type semiconductor package and method for manufacturing the same
#943Dual-interface IC card module
#944Semiconductor device
#945SEMICONDUCTOR PACKAGE WITH CONTINUOUS LEAD FRAME
#946SEMICONDUCTOR DEVICE
#947Low power heartbeat for low power mode
#948Semiconductor device and method of manufacturing semiconductor device
#949Semiconductor module comprising a first and second connecting element for connecting a semiconductor chip, and also production method
#950Semiconductor device with lead terminals having portions thereof extending obliquely
#951Method of manufacturing semiconductor device
#952QFN pin routing thru lead frame etching
#953Bifurcated memory die module semiconductor device
#954Method, apparatus and system to interconnect packaged integrated circuit dies
#955Semiconductor assemblies using edge stacking and methods of manufacturing the same
#956Semiconductor device including dummy pull-down wire bonds
#957Packaging mechanisms for dies with different sizes of connectors
#958Semiconductor package and method of manufacturing the semiconductor package
#959Stacked semiconductor package
#960Semiconductor device and method for manufacturing the same
#961Method and apparatus for power delivery to a die stack via a heat spreader
#962Power electric switching device
#963MULTI-POINT STACKED DIE WIREBONDING FOR IMPROVED POWER DELIVERY
#964SEMICONDUCTOR DEVICE AND DRIVE CIRCUIT
#965Impedance matching circuit for RF devices and method therefor
#966RECEIVER AND TRANSMITTER CHIPS PACKAGING STRUCTURE AND AUTOMOTIVE RADAR DETECTOR DEVICE USING SAME
#967Interconnect crack arrestor structure and methods
#968Protection from ESD during the manufacturing process of semiconductor chips
#969Stacked semiconductor packages
#970Wiring with external terminal
#971Decoupling capacitor mounted on an integrated circuit die, and method of manufacturing the same
#972Semiconductor device and method for manufacturing the same
#973Environmentally protected sensing device
#974Power semiconductor module with low gate path inductance
#975Semiconductor device
#976Driving device and power module
#977Semiconductor device and semiconductor package
#978Semiconductor power module
#979Semiconductor chip and semiconductor package including the same
#980Electronic device having inverted lead pins
#981Semiconductor device
#982Power semiconductor module
#983Semiconductor device with sealed semiconductor chip
#984Integrated circuit package and method of manufacturing the same
#985Magnetically coupled galvanically isolated communication using lead frame
#986Semiconductor device and method of manufacturing semiconductor device
#987POWER PACKAGE MODULE OF MULTIPLE POWER CHIPS AND METHOD OF MANUFACTURING POWER CHIP UNIT
#988SEMICONDUCTOR DEVICE AND FABRICATING METHOD OF THE SAME
#989Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond
#990Chip package with cross-linked thermoplastic dielectric
#991Semiconductor device and manufacturing method thereof
#992FILLING COMPOSITION FOR SEMICONDUCTOR PACKAGE
#993Sensor device utilizing adhesives and manufacturing method thereof
#994Sensor device having adhesive between sensor portion and casing portion
#995Semiconductor device and manufacturing method of the same
#996Semiconductor device comprising signal terminals extending from encapsulant
#997Microelectronic die stack having at least one rotated microelectronic die
#998MICROELECTRONIC DEVICE STACK HAVING A GROUND SHIELDING LAYER
#999Integrated circuit comprising a chip formed by a high-voltage transistor and comprising a chip formed by a low-voltage transistor
#1000SEMICONDUCTOR PACKAGE HAVING PACKAGE SUBSTRATE CONTAINING NON-HOMOGENEOUS DIELECTRIC LAYER
#1001Power semiconductor module
#1002Semiconductor device and method of manufacturing the semiconductor device
#1003Electronic device
#1004Processing method for package substrate
#1005Current sensor isolation
#1006Light emitting device and method of manufacturing the light emitting device
#1007Fan-out semiconductor package module
#1008Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same
#1009Semiconductor package and method of manufacturing the same
#1010Thin film light emitting diode
#1011BACK-TO-BACK STACKED DIES
#1012Semiconductor packages and methods of forming same
#1013Semiconductor component and method of manufacture
#1014Semiconductor package including multiple semiconductor chips and method of manufacturing the semiconductor package
#1015Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
#1016Semiconductor device
#1017Package comprising carrier with chip and component mounted via opening
#1018Illumination device
#1019Semiconductor device
#1020Semiconductor device
#1021Packaged semiconductor components having substantially rigid support members
#1022Semiconductor package
#1023Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
#1024Semiconductor assemblies using edge stacking and methods of manufacturing the same
#1025Semiconductor packages
#1026Semiconductor Devices and Methods of Manufacture Thereof
#1027Semiconductor device and method of inspecting the same
#1028Semiconductor device
#1029Semiconductor device having multiple gate pads
#1030Power semiconductor module and power semiconductor device
#1031Silicon carbide power module
#1032SEMICONDUCTOR PACKAGES
#1033Physical quantity sensor, inertial measurement unit, electronic apparatus, portable electronic apparatus, and vehicle
#1034Packaged RF power amplifier having a high power density
#1035FAN-OUT SENSOR PACKAGE
#1036Semiconductor device and method for manufacturing semiconductor device
#1037Housing for an electronic component, in particular a semiconductor chip
#1038Bond pad structure for bonding improvement
#1039Substrate-with-support
#1040Semiconductor device, and method for manufacturing semiconductor device
#1041Electronic device
#1042Light emitting device
#1043Stair-stacked dice device in a system in package, and methods of making same
#1044Semiconductor device with protection layer surrounding a bonding pad
#1045Low loss substrate for high data rate applications
#1046Intra-package interference isolation
#1047Semiconductor device and method for manufacturing the same
#1048THERMAL CONDUCTION DEVICES AND METHODS FOR EMBEDDED ELECTRONIC DEVICES
#1049Conductive heat spreader and heat sink assembly for optical devices
#1050Semiconductor package
#1051Semiconductor device assemblies including multiple stacks of different semiconductor dies
#1052Integrated circuit packaging
#1053SEMICONDUCTOR PACKAGE WITH EXTERNALLY ACCESSIBLE WIREBONDS
#1054Wire bonding between isolation capacitors for multichip modules
#1055Integrated circuit package with partitioning based on environmental sensitivity
#1056Semiconductor memory package
#1057System and method of assembling a system
#1058Multi-die integrated circuit packages and methods of manufacturing the same
#1059Wire bond clamp design and lead frame capable of engaging with same
#1060Semiconductor device
#1061INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTURING THE SAME
#1062Semiconducter device with filler to suppress generation of air bubbles and electric power converter
#1063Memory device comprising programmable command-and-address and/or data interfaces
#1064Transmission line optimization for multi-die systems
#1065Gas sensor package
#1066Hetero-epitaxial output device array
#1067Method of manufacturing a semiconductor device
#1068Compensation device for transistors
#1069Through electrode substrate and semiconductor device
#1070Dam laminate isolation substrate
#1071Wafer level flat no-lead semiconductor packages and methods of manufacture
#1072Wafer level flat no-lead semiconductor packages and methods of manufacture
#1073Wafer level flat no-lead semiconductor packages and methods of manufacture
#1074RF power transistors with impedance matching circuits, and methods of manufacture thereof
#1075Semiconductor device and measurement device
#1076Fan-out semiconductor package
#1077Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier
#1078Chip package structure
#1079Resistive element and method of manufacturing the resistive element
#1080Compact wirebonding in stacked-chip system in package, and methods of making same
#1081Switching device and electronic circuit
#1082Method of forming package structure
#1083Integrated passive device for RF power amplifier package
#1084Semiconductor packages
#1085PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE AND METHOD
#1086Recessed lead leadframe packages
#1087Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold
#1088Semiconductor package with a wire bond mesh
#1089Semiconductor device including sensor and driving terminals spaced away from the semiconductor device case wall
#1090Radio frequency isolation structure
#1091Light emitting device
#1092Semiconductor device and method of manufacturing the same
#1093Semiconductor device
#1094Conductor design for integrated magnetic devices
#1095Package structure including at least one connecting module and manufacturing method thereof
#1096PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#1097Electronic device
#1098Semiconductor apparatus and electric power conversion apparatus
#1099Semiconductor device and power conversion device
#1100Electronic package for integrated circuits and related methods
#1101Power amplifier modules including transistor with grading and semiconductor resistor
#1102Integrated circuit connection arrangement for minimizing crosstalk
#1103Semiconductor device and method for manufacturing semiconductor device
#1104SEMICONDUCTOR DEVICES HAVING WIRE BONDING STRUCTURES AND METHODS OF FABRICATING THE SAME
#1105Electronic device and mounting structure of the same
#1106Systems and methods for electromagnetic interference shielding
#1107Semiconductor device package
#1108Semiconductor device and method for manufacturing semiconductor device
#1109Semiconductor device
#1110Method of manufacturing a semiconductor device
#1111Semiconductor devices with package-level configurability
#1112Semiconductor devices with package-level configurability
#1113Optical module
#1114Semiconductor package including processor chip and memory chip
#1115Multiple plated via arrays of different wire heights on same substrate
#1116Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
#1117Reinforcement for electrical connectors
#1118Resin encapsulating mold and method of manufacturing semiconductor device
#1119SEMICONDUCTOR PACKAGE
#1120Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
#1121Detection of foreign particles during wire bonding
#1122Semiconductor packages having semiconductor chips disposed in opening in shielding core plate
#1123Semiconductor arrangement with reliably switching controllable semiconductor elements
#1124Packaging structure with recessed outer and inner lead surfaces
#1125Semiconductor device
#1126Semiconductor memory device
#1127Receiver optical module and process of assembling the same
#1128Semiconductor package assembly
#1129Integrated circuit (IC) die attached between an offset lead frame die-attach pad and a discrete die-attach pad
#1130Heterojunction semiconductor device for reducing parasitic capacitance
#1131Semiconductor device
#1132Fan-out semiconductor package
#1133Amplifier module
#1134Semiconductor device having switching elements to prevent overcurrent damage
#1135Integrally formed bias and signal lead for a packaged transistor device
#1136Package structure of folding magnetic coupling isolator and leadframe component and manufacturing method thereof
#1137Leadless semiconductor packages, leadframes therefor, and methods of making
#1138Thermal management in integrated circuit using phononic bandgap structure
#1139Semiconductor device
#1140Circuit mounting structure and lead frame for system in package (SIP) devices
#1141Chip package structure and method for manufacturing the same
#1142Inverted leads for packaged isolation devices
#1143Power MOSFET device and manufacturing process thereof
#1144Transistor outline housing with high return loss
#1145Semiconductor apparatus
#1146SEMICONDUCTOR DEVICE
#1147Method of manufacturing multi-chip package
#1148METHODS OF FORMING PACKAGE ON PACKAGE ASSEMBLIES WITH REDUCED Z HEIGHT AND STRUCTURES FORMED THEREBY
#1149Semiconductor apparatus
#1150Aluminate fluorescent material, light emitting device, and method for producing aluminate fluorescent material
#1151CIRCUIT HAVING SNUBBER CIRCUIT IN POWER SUPPLY DEVICE
#1152Connection Carrier, Optoelectronic Component and Method for Producing a Connection Carrier or an Optoelectronic Component
#1153Substrate-less stackable package with wire-bond interconnect
#1154Method of manufacturing a semiconductor device
#1155Multichip modules and methods of fabrication
#1156Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#1157Chip packaging structure and method, and electronic device
#1158SEMICONDUCTOR DEVICE
#1159Lead frame and method of manufacturing lead frame
#1160Power supply circuit and related methods for generating a power supply voltage in a semiconductor package
#1161Electronic unit
#1162Molded intelligent power module and method of making the same
#1163Method for manufacturing semiconductor device
#1164Sensor package structure
#1165MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#1166Multiple laser system packaging
#1167Radio frequency shielding within a semiconductor package
#1168Semiconductor device having conductive wire with increased attachment angle and method
#1169Systems, methods, and apparatuses for implementing an organic stiffener with an EMI shield for RF integration
#1170Multilayer frame packages for integrated circuits having a magnetic shield integrated therein, and methods therefor
#1171Semiconductor package device and method of manufacturing the same
#1172Semiconductor chip and semiconductor device provided with same
#1173SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#1174Semiconductor package assembly and method for forming the same
#1175Semiconductor module and method for manufacturing the same
#1176Semiconductor device with first and second transistors and support part
#1177Interchip backside connection
#1178PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
#1179Semiconductor device and method for manufacturing the same
#1180POWER MODULE
#1181Semiconductor packages and methods of forming same
#1182WIREBOND INTERCONNECT STRUCTURES FOR STACKED DIE PACKAGES
#1183Measuring device
#1184Electronic component and method for producing an electronic component
#1185Semiconductor package having an isolation wall to reduce electromagnetic coupling
#1186System and method for controlling switching device in power converter
#1187Method for fabricating glass substrate package
#1188Wire bond wires for interference shielding
#1189Semiconductor device
#1190Sensor package structure
#1191Method, apparatus and system to interconnect packaged integrated circuit dies
#1192Package with backside protective layer during molding to prevent mold flashing failure
#1193Heterojunction semiconductor device for reducing parasitic capacitance
#1194Guard bond wires in an integrated circuit package
#1195Molded intelligent power module for motors
#1196Protection from ESD during the manufacturing process of semiconductor chips
#1197IMAGE SENSOR MOUNTING BOARD AND IMAGING DEVICE
#1198Magneto-resistive chip package including shielding structure
#1199SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAME
#1200Chip on package structure and method