207827 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
Vertical wire connections for integrated circuit package
#1202Interstage matching network
#1203Power semiconductor device load terminal
#1204Power module based on multi-layer circuit board
#1205Semiconductor device
#1206Methods of determining racetrack layout for radio frequency isolation structure
#1207Shielded magnetoresistive random access memory devices and methods for fabricating the same
#1208Light-emitting device and illuminating apparatus
#1209Memory devices with controllers under memory packages and associated systems and methods
#1210Package-on-package assembly with wire bonds to encapsulation surface
#1211Integrated circuit device with plating on lead interconnection point and method of forming the device
#1212Method of manufacturing a semiconductor device including through silicon plugs
#1213Semiconductor device and method for manufacturing the same
#1214Semiconductor device package comprising a dielectric layer with built-in inductor
#1215Electronic device
#1216Semiconductor device with coils in different wiring layers
#1217NITRIDE SEMICONDUCTOR ELEMENT AND NITRIDE SEMICONDUCTOR PACKAGE
#1218Integrated circuit package including miniature antenna
#1219Power converter monolithically integrating transistors, carrier, and components
#1220Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
#1221Method of fabricating a semiconductor package
#1222Universal surface-mount semiconductor package
#1223Semiconductor package device and method of manufacturing the same
#1224Semiconductor device with first and second semiconductor chips connected to insulating element
#1225Package with backside protective layer during molding to prevent mold flashing failure
#1226Semiconductor device
#12273D chip sharing power circuit
#1228Bonding apparatus with rotating bonding stage
#1229Semiconductor apparatus and semiconductor system including the same
#1230Electric conductor track, method, and use
#1231Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system
#1232Chip capacitor, circuit assembly, and electronic device
#1233Power measurement via bond wire coupling
#1234Power semiconductor devices and a method for forming a power semiconductor device
#1235INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
#1236Backside metalization with through-wafer-via processing to allow use of high q bondwire inductances
#1237Shielded module having compression overmold
#1238CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#1239Positional relationship among components of semiconductor device
#1240Semiconductor device
#1241Semiconductor device
#1242Semicondcutor package and manufacturing method thereof
#1243Routable electroforming substrate comprising removable carrier
#1244Apparatus and method for multiplexing data transport by switching different data protocols through a common bond pad
#1245Magnetic detection device, current detection device, method for manufacturing magnetic detection device, and method for manufacturing current detection device
#1246Illumination device
#1247Multiple bond via arrays of different wire heights on a same substrate
#1248Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
#1249Optical detector having a bandpass filter in a lidar system
#1250Parallel plate waveguide for power semiconductor package
#1251Wireless communications with dielectric medium
#1252Semiconductor device and method of manufacturing the same
#1253Semiconductor device
#1254Power electronics assemblies and vehicles incorporating the same
#1255Semiconductor device and method for manufacturing the same
#1256Integrated package assembly for switching regulator
#1257Power semiconductor package having a parallel plate waveguide
#1258Adjustable losses on bond wire arrangement
#1259Vibrator device, oscillator, electronic device, and vehicle
#1260Semiconductor packages having wire bond wall to reduce coupling
#1261Semiconductor device
#1262Methods and apparatus for an improved integrated circuit package
#1263Stackable microelectronic package structures
#1264Semiconductor package structure
#1265Method for fabricating electronic package having a protruding barrier frame
#1266Semiconductor device and method of forming partition fence and shielding layer around semiconductor components
#1267Light emitting apparatus
#1268Method of manufacturing a semiconductor device
#1269Package with different types of semiconductor dies attached to a flange
#1270Electronic component mounting board and electronic device
#1271Semiconductor device
#1272Semiconductor module
#1273Semiconductor package and method of manufacturing the same
#1274Integrated circuit connection arrangement for minimizing crosstalk
#1275Connection arrangements for integrated lateral diffusion field effect transistors
#1276Half-bridge power semiconductor module and method for manufacturing same
#1277Stacked semiconductor die assemblies with die support members and associated systems and methods
#1278Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
#1279Semiconductor device having an electrical connection between semiconductor chips established by wire bonding, and method for manufacturing the same
#1280RESONANCE-COUPLED SIGNALING BETWEEN IC MODULES
#1281Electronic component mounting board, electronic device, and electronic module
#1282Leadframe and integrated circuit connection arrangement
#1283Fan-out semiconductor package
#1284High voltage device with multi-electrode control
#1285Substrate-less stackable package with wire-bond interconnect
#1286SEMICONDUCTOR DEVICE
#1287Semiconductor package device
#1288Semiconductor package with a wire bond mesh
#1289Apparatus for communication across a capacitively coupled channel
#1290Magnetically coupled galvanically isolated communication using lead frame
#1291Semiconductor module
#1292Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#1293THERMOELECTRIC BONDING FOR INTEGRATED CIRCUITS
#1294Method for manufacturing semiconductor device
#1295Semiconductor device and method of manufacturing the same
#1296Semiconductor device
#1297Electronic device and method for manufacturing electronic device
#1298Air-cavity package with enhanced package integration level and thermal performance
#1299Semiconductor module comprising transistor chips, diode chips and driver chips arranged in a common plane
#1300Preformed lead frame and lead frame packaged structure including the same
#1301Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#1302SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern
#1303Structures and methods for shielding magnetically sensitive components
#1304Semiconductor device and semiconductor module
#1305MANUFACTURING METHOD FOR PACKAGE DEVICE
#1306Semiconductor device and method for manufacturing the same
#1307Semiconductor device with sealing portion to suppress connection corrosion
#1308Semiconductor device and semiconductor module provided with same
#1309Integrated circuit package having wirebonded multi-die stack
#1310Wire bonding method and apparatus for electromagnetic interference shielding
#1311Semiconductor device with frame having arms and related methods
#1312Three-phase switching unit
#1313SEMICONDUCTOR CHIP PACKAGE WITH CAVITY
#1314Electronic device with integrated galvanic isolation, and manufacturing method of the same
#1315Wiring with external terminal
#1316Antenna apparatus having bond wires
#1317High-frequency module
#1318LEADFRAME WITH LEAD PROTRUDING FROM THE PACKAGE
#1319Method of manufacturing semiconductor products, corresponding semiconductor product and device
#1320Electro-optic device, electro-optic unit, and electronic apparatus
#1321Semiconductor device including plural semiconductor chips
#1322SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#1323Electronic device and mounting structure of the same
#1324Semiconductor device and method of making semiconductor device
#1325POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD
#1326Method for manufacturing a semiconductor device
#1327QFN pin routing thru lead frame etching
#1328Doherty amplifiers and amplifier modules with shunt inductance circuits that affect transmission line length between carrier and peaking amplifier outputs
#1329Semiconductor device having a protruding interposer edge face
#1330Semiconductor device including die bond pads at a die edge
#1331Wire bonded wide I/O semiconductor device
#1332Wafer level flat no-lead semiconductor packages and methods of manufacture
#1333Light source comprising a number of semi-conductor components
#1334METHOD FOR PREPARING A WAFER LEVEL CHIP-ON-CHIP SEMICONDUCTOR STRUCTURE
#1335WAFER LEVEL CHIP-ON-CHIP SEMICONDUCTOR STRUCTURE
#1336Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires
#1337Methods, circuits and systems for a package structure having wireless lateral connections
#1338Amplifier die with elongated side pads, and amplifier modules that incorporate such amplifier die
#1339Semiconductor device having semiconductor chip with large and small irregularities on upper and lower side surface portions thereof
#1340Semiconductor device
#1341INTEGRATED CIRCUIT PACKAGE COMPRISING LEAD FRAME
#1342Nitride semiconductor element and nitride semiconductor package
#1343Package structure and method of forming thereof
#1344Semiconductor device including a bidirectional switch
#1345Methods related to implementing surface mount devices with ground paths
#1346IGBT die structure with auxiliary P well terminal
#1347Semiconductor package
#1348Semiconductor package including package substrate and chip stack in which a lower chip has a respective dummy pad by which each upper chip is connected to the package substrate
#1349Multi-chip package and method of providing die-to-die interconnects in same
#1350Manufacturing method of semiconductor device
#1351Optical transmitter module
#1352Sensorless temperature compensation for power switching devices
#1353Semiconductor device including sense insulated-gate bipolar transistor
#1354Semiconductor packages with leadframes and related methods
#1355Wire bonding methods and systems incorporating metal nanoparticles
#1356SEMICONDUCTOR SYSTEM AND DEVICE PACKAGE INCLUDING INTERCONNECT STRUCTURE
#1357Semiconductor device with island and associated leads
#1358Thermal dissipation device and semiconductor package device including the same
#1359Amplifier devices with back-off power optimization
#1360Stacked semiconductor package
#1361Semiconductor package and method of manufacturing the semiconductor package
#1362High-frequency circuit
#1363Semiconductor device
#1364Light emitting device and method for manufacturing light emitting device
#1365Semiconductor package
#1366Semiconductor device and method of manufacture
#1367Electronic device
#1368SEMICONDUCTOR DEVICE
#1369HIGH POWER AND HIGH FREQUENCY PLASTIC PRE-MOLDED CAVITY PACKAGE
#1370Semiconductor device
#1371Semiconductor Device Having Leadframe With Pressure-Absorbing Pad Straps
#1372Ink printed wire bonding
#1373Multi-chip package and method of manufacturing the same
#1374Semiconductor package
#1375Semiconductor package structure and method for manufacturing the same
#1376Manufacturing method of package carrier
#1377Transient voltage suppressor apparatus
#1378Semiconductor device and manufacturing method of the same
#1379Semiconductor device and method of manufacturing the same
#1380Resonance-coupled signaling between IC modules
#1381Semiconductor device and wiring board design method
#1382Thermally conductive semiconductor device and manufacturing method thereof
#1383Electrical interface for package and die
#1384Semiconductor package including stacked semiconductor chips electrically connected to redistribution layers
#1385SENSING CHIP PACKAGE HAVING ESD PROTECTION AND METHOD MAKING THE SAME
#1386Semiconductor device and lead frame with high density lead array
#1387Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet
#1388LEADFRAME-LESS SURFACE MOUNT SEMICONDUCTOR DEVICE
#1389Semiconductor device
#1390Dual-sided radio-frequency package with overmold structure
#1391Semiconductor package
#1392Reversible semiconductor die
#1393SEMICONDUCTOR DEVICE HAVING TWO ENCAPSULANTS
#1394Compound semiconductor substrate and fabrication method therefor, compound semiconductor device and fabrication method therefor, power supply apparatus and high-output amplifier
#1395Integrated circuit package assembly with wire end above a topmost component
#1396SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
#1397Semiconductor device
#1398Semiconductor device
#1399Electronic module assembly having low loop inductance
#1400Semiconductor device
#1401Air cavity packages and methods for the production thereof
#1402Semiconductor device, measurement device, and correction method
#1403Fan-out semiconductor package
#1404Semiconductor device and method of manufacturing the same
#1405Semiconductor module having supporting portion for fastening portion inside a through hole in a resin case
#1406Semiconductor device and method of manufacturing the same
#1407Array substrate, fabrication method for forming the same, and display device containing the same
#1408Multiple interconnections between die
#1409Semiconductor packages and methods of fabricating the same
#1410Method of manufacturing semiconductor device and semiconductor device
#1411Semiconductor packages including an adhesive pattern
#1412Electronic package structure with multiple electronic components
#1413Power transistor with harmonic control
#1414Wire bond wires for interference shielding
#1415Air-cavity package with enhanced package integration level and thermal performance
#1416Method for remapping a packaged extracted die
#1417Semiconductor device and method of manufacturing the same
#1418POWER SEMICONDUCTOR DEVICE
#1419METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES, AND CORRESPONDING DEVICE
#1420Integrated circuit die having a split solder pad
#1421Battery protecting apparatus
#1422Intelligent power module and manufacturing method thereof
#1423Semiconductor device
#1424Semiconductor integrated circuit device
#1425SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#1426Method of manufacturing a semiconductor device
#1427Support terminal integral with die pad in semiconductor package
#1428Semiconductor device with lead terminals having portions thereof extending obliquely
#1429Memory device comprising programmable command-and-address and/or data interfaces
#1430Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#1431Electronic package having a protruding barrier frame
#1432Semiconductor device and manufacturing method thereof
#1433Power module and motor drive circuit
#1434Power electronics module with first and second coolers
#1435Semiconductor device
#1436Wire bonding method and apparatus for electromagnetic interference shielding
#1437Sintered multilayer heat sinks for microelectronic packages and methods for the production thereof
#1438Heterojunction semiconductor device having source and drain pads with improved current crowding
#1439Dies-on-package devices and methods therefor
#1440Package-on-package devices with same level WLP components and methods therefor
#1441Package-on-package assembly with wire bond vias
#1442Integrated passive device for RF power amplifier package
#1443FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
#1444Fan out semiconductor device including a plurality of semiconductor die
#1445Radio frequency (RF) devices
#1446Stretchable electronics fabrication method with strain redistribution layer
#1447Semiconductor package
#1448Chip package with thermal dissipation structure and method for forming the same
#1449Semiconductor module and power converter
#1450Bottom package exposed die MEMS pressure sensor integrated circuit package design
#1451Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereof
#1452Semiconductor device with solders of different melting points and method of manufacturing
#1453Semiconductor device and measurement device
#1454Magnetic memory device
#1455SEMICONDUCTOR LIGHT EMITTING ELEMENT WITH DISPERSIVE OPTICAL UNIT AND ILLUMINATION DEVICE COMPRISING THE SAME
#1456Semiconductor device
#1457Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
#1458SIMULTANEOUS DOUBLE WIRE WEDGE BONDING METHOD, SYSTEM, KIT AND TOOL
#1459Semiconductor device including interconnected package on package
#1460SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
#1461Semiconductor component and method of manufacture
#1462Semiconductor device and method of manufacturing the same
#1463Repackaged integrated circuit assembly method
#1464Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#1465Semiconductor device with first and second chips and connections thereof and a manufacturing method of the same
#1466Tamper detection for a chip package
#1467Semiconductor device, method of manufacturing the same and generation method of unique information
#1468Semiconductor device
#1469Wafer level chip scale semiconductor package
#1470Packaging mechanisms for dies with different sizes of connectors
#1471METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#1472Electrical interface for printed circuit board, package and die
#1473Camera module and electronic device
#1474Integrated circuit package including miniature antenna
#1475Semiconductor package
#1476Ring-frame power package
#1477Magnetic sensor
#1478Substrate with integrated heat spreader
#1479Semiconductor device, power conversion apparatus, and vehicle
#1480Half-bridge power semiconductor module and method of manufacturing same
#1481Mounting jig for semiconductor device
#1482Non-volatile dual in-line memory module (NVDIMM) multichip package
#1483Semiconductor device and method of manufacture
#1484Power semiconductor module and electric power steering apparatus using the same
#1485Semiconductor package and fabrication method thereof
#1486DEVICE PACKAGE WITH WIRE BOND ASSISTED GROUNDING AND INDUCTORS
#1487Semiconductor package assembly
#1488Racetrack layout for radio frequency isolation structure
#1489Semiconductor device and method of manufacturing the same
#1490Bond pad structure for bonding improvement
#1491CTE compensation for wafer-level and chip-scale packages and assemblies
#1492Low loss substrate for high data rate applications
#1493Semiconductor device including sensor and driving terminals spaced away from the semiconductor device case wall
#1494Method of fabricating a circuit module
#1495Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof
#1496OPTOELECTRONIC SYSTEM
#1497Integrated circuit assembly that includes stacked dice
#1498SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#1499Apparatuses for communication systems transceiver interfaces
#1500Semiconductor device having die pad