Integrated interposer solutions for 2D and 3D IC packaging

Power semiconductor device with small contact footprint and the preparation method

3D packages and methods for forming the same

Method for manufacturing semiconductor device

Method of manufacturing light emitting device package

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Light emitting device

Submount based light emitter components and methods

Semiconductor device

Structure and method for integrated circuits packaging with increased density

Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits

Package in package (PiP) electronic device and manufacturing method thereof

Methods for surface attachment of flipped active components

Alignment mark design for packages

Submount based light emitter components and methods

Method for manufacturing light emitting device and light emitting device

Light emitting device and method of manufacturing the same

Side-view light emitting device including base body having protruding component

Carrier, carrier leadframe, and light emitting device

Structure of a semiconductor array

Semiconductor device including plural semiconductor chips stacked on substrate

Molded chip package and method of manufacturing the same

3D IC method and device

Fabrication method of package having ESD and EMI preventing functions

Method for producing an optoelectronic semiconductor device, and optoelectronic semiconductor device

Semiconductor device

Optical semiconductor lighting apparatus

Off-chip vias in stacked chips

Semiconductor device including filling material provided in space defined by three semiconductor chips

Pick-and-place tool for packaging process

Gang clips having distributed-function tie bars

Electronic device package including metal blocks

Semiconductor device, semiconductor stacked module structure, stacked module structure and method of manufacturing same

Power amplifier modules with bifet and harmonic termination and related systems, devices, and methods

Power amplifier modules including bipolar transistor with grading and related systems, devices, and methods

Power amplifier modules including wire bond pad and related systems, devices, and methods

MEMS component and method for encapsulating MEMS components

LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate

Semiconductor packages including electrical insulation features

Chip package and method for forming the same

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

Chip package and method for forming the same

Devices and methods for processing singulated radio-frequency units

Semiconductor device

Electronic device module and manufacturing method thereof

Substrate block for PoP package

Semiconductor package and fabrication method thereof and carrier structure

Semiconductor device with step portion having shear surfaces

Ultra-thin semiconductor device and preparation method thereof

Light emitting diode display with redundancy scheme

Method of forming wafer-level molded structure for package assembly

Stacked dies with wire bonds and method

Method of fabricating semiconductor package, semiconductor package formed thereby, and semiconductor device including the same

Hot-melt type curable silicone composition for compression molding or laminating

Methods of fabrication and testing of three-dimensional stacked integrated circuit system-in-package

Wafer, package structure and method of manufacturing the same

Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the same

Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same

Low-profile footed power package

METHOD AND SYSTEM FOR ALIGNING AND ORIENTING DIES

Three-terminal printed devices interconnected as circuits

Fan-out stacked system in package (SIP) and the methods of making the same

SYSTEMS AND METHODS FOR CARRYING SINGULATED DEVICE PACKAGES

SINGULATED UNIT SUBSTRATE FOR A SEMICONDCUTOR DEVICE

Chip-scale packaging with protective heat spreader

Semiconductor apparatus including a heat dissipating member

Pressure transmitting device for bonding chips onto a substrate

Method of fabricating a semiconductor package

Method of fabricating a packaging substrate including a carrier having two carrying portions

Connection using conductive vias

Printed circuit board

Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

3D integrated circuit package with through-mold first level interconnects

Multiple die layout for facilitating the combining of an individual die into a single die

Semiconductor device and manufacturing method thereof

Manufacture of a circuit board and circuit board containing a component

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Mounting method

Semiconductor sensor device and method of producing a semiconductor sensor device

Semiconductor device, semiconductor apparatus and method for manufacturing semiconductor device

Method of packaging stacked dies on wafer using flip-chip bonding

Semiconductor device including semiconductor chips mounted over both surfaces of substrate

PREVENTION OF WARPING DURING HANDLING OF CHIP-ON-WAFER

Semiconductor device with thick bottom metal and preparation method thereof

Semiconductor device having lead frame with notched inner leads

Dual-interface IC card components and method for manufacturing the dual-interface IC card components

Compliant micro device transfer head

Optoelectronic package and method of manufacturing the same

Stack package and method for manufacturing the same

Semiconductor package with via-coupled power transistors

Semiconductor device and method of manufacturing the same

Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package

Stacked die integrated circuit

Pressure sensor device with through silicon via

System-in-package module and method for forming the same

Bleed-out preventing agent, composition for preventing bleed-out including the same, and method of preventing bleed-out

Semiconductor light-emitting device

Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof

Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure

3D integrated circuit package processing with panel type lid

Integrated circuit assemblies with reinforcement frames, and methods of manufacture

Chip arranging method

Power semiconductor package with conductive clips

Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication

Manufacturing method of semiconductor device and semiconductor device

Isolation rings for packages and the method of forming the same

Method for manufacturing semiconductor device and semiconductor device

Methods for controlling warpage in packaging

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

Grinding wheel design with elongated teeth arrangement

Electronic component built-in multi-layer wiring board and method of manufacturing the same

Optical apparatus having resin encased stacked optical and semiconductor devices

Mold chase for integrated circuit package assembly and associated techniques and configurations

Interconnect structure for package-on-package devices and a method of fabricating

Exposed die power semiconductor device

Semiconductor device and manufacturing method thereof

Ultra-thin semiconductor device and preparation method thereof

Semiconductor device with thin redistribution layers

Electronic component having encapsulated wiring board and method for manufacturing the same

Method for producing a multiplicity of optoelectronic semiconductor components

Method of fabricating semiconductor package

Method of producing a fluorescent material containing sealant

Microelectronic elements with post-assembly planarization

Integrated circuit package

Semiconductor device grid array package

Embedded die ball grid array package

Package substrates, packages including the same, methods of fabricating the packages with the package substrates, electronic systems including the packages, and memory cards including the packages

Semiconductor device with plated lead frame, and method for manufacturing thereof

Semiconductor device

Methods for improving thermal performance of flip chip packages

Electronic devices with improved thermal performance

Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP)

Integrated circuit package configurations to reduce stiffness

Fingerprint module and manufacturing method for same

Semiconductor device having wires connecting connection pads

Thermal performance structure for semiconductor packages and method of forming same

Bottom package with metal post interconnections

Substrate design for semiconductor packages and method of forming same

Substrate design for semiconductor packages and method of forming same

Substrate design for semiconductor packages and method of forming same

Substrate design for semiconductor packages and method of forming same

Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation

Chip support substrate, chip support method, three-dimensional integrated circuit, assembly device, and fabrication method of three-dimensional integrated circuit

Method of manufacturing a semiconductor device including applying ultrasonic waves to a ball portion of the semiconductor device

Semiconductor modules with semiconductor dies bonded to a metal foil

Integrated circuit package fabrication

Wiring substrate, semiconductor package, and method for manufacturing semiconductor package

Semiconductor device package and method of manufacture

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

Polymer frame for a chip, such that the frame comprises at least one via in series with a capacitor

Electronic component module and manufacturing method thereof

Dual solder layer for fluidic self assembly and electrical component substrate and method employing same

Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof

Device and method of manufacturing the same

Selective planishing method for making a semiconductor device

Multi-dimensional integrated circuit structures and methods of forming the same

Power semiconductor device and method of fabricating the same and cutoff ring

Method of manufacturing semiconductor device

Stacked semiconductor system having interposer of half-etched and molded sheet metal

Packages with stacked dies and methods of forming the same

Probing chips during package formation

Semiconductor device having multiple contact clips

Leadframe area array packaging technology

Methods and structures for packaging semiconductor dies

Electronic component package and method for manufacturing the same

Structure and approach to prevent thin wafer crack

Assembly bonding

Methods for fabricating a plurality of optoelectronic devices from a wafer that includes a plurality of light detector sensor areas

Fine pitch BVA using reconstituted wafer with area array accessible for testing

Semiconductor device and manufacturing method thereof

High-definition LED display screen and surface-mounted LED composite lamp with ultra-small point distance thereof

Semiconductor light emitting device

Chip to wafer package with top electrodes and method of forming

Miniaturized SMD diode package and process for producing the same

Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices

Chip arrangement and method of manufacturing the same

Method for manufacturing semiconductor device, and semiconductor device

Structure and method for 3D IC package

Molding package assembly and molding material

Package on package bonding structure and method for forming the same

Apparatus, system, and method for wireless connection in integrated circuit packages

Semiconductor device and method comprising thickened redistribution layers

Semiconductor package having EMI shielding and method of fabricating the same

Semiconductor device

Semiconductor device

Inclined photonic chip package for integrated optical transceivers and optical touchscreen assemblies

Electronic component module and an assembly including the same

Method of fabricating white LED devices

Arrangement with a component on a carrier substrate, an arrangement and a semi-finished product

Method of making stacked multi-chip packaging structure

Method of fabricating semiconductor package

Semiconductor device and method of forming build-up interconnect structures over a temporary substrate

Semiconductor packaging structure and process

Backside redistribution layer (RDL) structure

Semiconductor packages having emi shielding layers, methods of fabricating the same, electronic systems including the same, and memory cards including the same

Semiconductor device and method of forming stress relief layer between die and interconnect structure

Semiconductor device and method of forming fine pitch RDL over semiconductor die in fan-out package

Pre-molded integrated circuit packages

Semiconductor device and method of making embedded wafer level chip scale packages

Columnar light emitting device and manufacturing method of the same

Molding method for COB-EUSB devices and metal housing package

Light emitting device

Manufacturing method of a conductive shield layer in semiconductor device

Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices

Chip-on-substrate packaging on carrier

Semiconductor device and method of reducing warpage using a silicon to encapsulant ratio

Conductive shield for semiconductor package

Method of manufacturing semiconductor device and semiconductor device

Method of manufacturing a semiconductor device

Molding structure for wafer level package

Method of manufacturing an inductor core for a chip assembly and chip assembly

MEMS package and a method for manufacturing the same

Electronic component-mounted structure, IC card and COF package

Light-emitting dies incorporating wavelength-conversion materials and related methods

Packaged semiconductor devices and methods of packaging semiconductor devices

Devices and stacked microelectronic packages with package surface conductors and adjacent trenches and methods of their fabrication

Interposer-chip-arrangement for dense packaging of chips

Electronic package, package carrier, and method of manufacturing package carrier

Packaged semiconductor devices and methods of manufacturing

System and method for manufacturing a fabricated carrier

Etched trenches in bond materials for die singulation, and associated systems and methods

Techniques for adhesive control between a substrate and a die

Semiconductor package with package-on-package stacking capability and method of manufacturing the same

Method for fabricating EMI shielding package structure

Leadless semiconductor package with optical inspection feature

Multi-layer substrate for semiconductor packaging

Pop structures and methods of forming the same

Resin-encapsulated semiconductor device and method of manufacturing the same

Packages with molding material forming steps

High heat-radiant optical device substrate

Semiconductor device packaging

Mechanisms for forming package structure

Embedded semiconductive chips in reconstituted wafers, and systems containing same

Apparatus for dicing interposer assembly

Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die

Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP

Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects

Thermally enhanced package with lid heat spreader

Semiconductor package

Semiconductor chip with electrically conducting layer

Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor device

Method for manufacturing optical element for backlight unit and optical element and optical element array manufactured by method

Semiconductor device and method of forming wire bondable fan-out EWLB package

Semiconductor device assembly with package interconnect extending into overlying spacer material, and associated systems, devices, and methods

Stacked microelectronic devices

Semiconductor assembly and method of manufacturing the same

Semiconductor light-emitting element and manufacturing method for the same

Heat spreading substrate with embedded interconnects

Fabrication method of semiconductor package

Packaging methods for semiconductor devices

Methods of forming wire interconnect structures

Method of electrically isolating leads of a lead frame strip

Method for forming electronic components

Semiconductor device and semiconductor device connection structure

Configurable routing for packaging applications

Semiconductor element

Semiconductor package and manufacturing method thereof

Semiconductor package with package-on-package stacking capability and method of manufacturing the same

Method of electrically isolating shared leads of a lead frame strip

MODULE IC PACKAGE STRUCTURE WITH ELECTRICAL SHIELDING FUNCTION AND METHOD FOR MANUFACTURING THE SAME

Optical-semiconductor device and method for manufacturing the same

Printed circuit board and method of manufacturing the same

Via placement in radio frequency shielding applications

Apparatus and method of attaching solder ball and method of fabricating semiconductor package including solder ball

Die-to-die gap control for semiconductor structure and method

Electronic modules having grounded electromagnetic shields

Chip device packages and fabrication methods thereof

Ball grid array semiconductor package and method of manufacturing the same

Semiconductor package including a plurality of chips

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Electric component mounting method

Semiconductor die laminating device with independent drives

Chip on package structure and method

Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern

Chip on package structure and method

Semiconductor device and method for manufacturing a semiconductor device

Die up fully molded fan-out wafer level packaging

Microelectronic packages having layered interconnect structures and methods for the manufacture thereof

Methods of stress balancing in gallium arsenide wafer processing

Array substrate for mounting chip and method for manufacturing the same

Manufacturing method of forming an etch-back type semiconductor package with locking anchorages

3-D package having plurality of substrates

Semiconductor device and manufacturing method thereof

Package on package structure and method of manufacturing the same

Semiconductor device including two or more chips mounted over wiring substrate

Semiconductor structure and manufacturing method thereof

Semiconductor device

High-voltage packaged device

Method of manufacturing a semiconductor package including a surface profile modifier

Method of manufacturing a semiconductor device

Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements

Stacked packaging improvements

Semiconductor package and method of fabricating the same

Integrated fan-out structure with openings in buffer layer

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

Mechanism for forming patterned metal pad connected to multiple through silicon vias (TSVs)

Chip-stacked semiconductor package and method of manufacturing the same

Methods and configuration for manufacturing flip chip contact (FCC) power package

Packaged semiconductor device having multilevel leadframes configured as modules