Optoelectronic light-emitting component and leadframe assemblage

Compact opto-electronic modules and fabrication methods for such modules

Micro device integration into system substrate

Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure

Method of thinning and packaging a semiconductor chip

Semiconductor package with embedded components and method of making the same

Semiconductor device and method of manufactures

Method of manufacturing fan out wafer level package

Manufacturing method of ultra-thin semiconductor device package assembly

Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package

Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealing

Leadless chip carrier having improved mountability

Manufacturing method of semiconductor device

Methods of manufacturing wide band gap semiconductor device and semiconductor module, and wide band gap semiconductor device and semiconductor module

Method of manufacturing semiconductor device

Semiconductor apparatus and manufacturing method for same

IC package

Packaged semiconductor device having leadframe features preventing delamination

Semiconductor package with package-on-package stacking capability and method of manufacturing the same

Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die

Method of manufacturing a semiconductor device including through silicon plugs

Embedded semiconductive chips in reconstituted wafers, and systems containing same

Package, light-emitting device, and method for manufacturing the same

Shaped phosphor to reduce repeated reflections

Method of manufacturing semiconductor device

Light emitting device

Packaged semiconductor devices and methods of packaging semiconductor devices

Semiconductor packages and related methods

Laser assisted transfer welding process

Mold release film and process for producing semiconductor package

Mold release film and process for producing semiconductor package

Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device

Wafer level package for a MEMS sensor device and corresponding manufacturing process

Solution for reducing poor contact in info packages

Low cost package warpage solution

Semiconductor package having a metal paint layer

Semiconductor device and lead frame having two leads welded together

Making a flat no-lead package with exposed electroplated side lead surfaces

Light emitting device and method of manufacturing light emitting device

Pre-applying supporting materials between bonded package components

Silicon package for embedded electronic system having stacked semiconductor chips

Structure and formation method of chip package structure

Integrated circuit package with probe pad structure

Interconnect structures for wafer level package and methods of forming same

EMI/RFI shielding for semiconductor device packages

Method of marking a semiconductor package

Semiconductor package to reduce warping

Package structure and fabrication method thereof

Process of fabrication of electronic devices and electronic device with a double encapsulation ring

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

Single layer low cost wafer level packaging for SFF SiP

Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form

Radio frequency isolation structure with racetrack

Packaging devices and methods for semiconductor devices

Semiconductor device

Semiconductor package having improved package-on-package interconnection

Racetrack layout for radio frequency shielding

Electronic component housing package and electronic apparatus

Light emitting device mount, leadframe, and light emitting apparatus

Method of multi-chip wafer level packaging

Method and apparatus for chip-to-wafer integration

Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication

Electronic packages and methods of making and using the same

Via structure for packaging and a method of forming

Semiconductor package and method of forming the same

Semiconductor packages having through electrodes and methods of fabricating the same

3D integration of fanout wafer level packages

Integrated circuit packages and methods of forming same

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

Electronic device with stacked chips

Semicondutor device and method of manufacture

Semiconductor chip stack with identification section on chip side-surfaces for stacking alignment

Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP)

Forming a panel of triple stack semiconductor packages

Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication

Semiconductor device including an embedded surface mount device and method of forming the same

Wafer-level stack chip package and method of manufacturing the same

Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture

Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages

Electromagnetic wave shielding support base-attached encapsulant, encapsulated substrate having semicondutor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, and semiconductor apparatus

Semiconductor package and fabrication method thereof

Method for manufacturing semiconductor device, and semiconductor device

Heat spreader with wiring substrate for reduced thickness

Packaged semiconductor devices and methods of packaging semiconductor devices

Method of manufacturing a semiconductor device

Embedding low-k materials in antennas

Fan-out wafer level chip package structure and manufacturing method thereof

Integrated fan-out structure and method

Electrostatic discharge protection structure and method

Bonding method of semiconductor chip and bonding apparatus of semiconductor chip

Cavity package with pre-molded cavity leadframe

Lead frame strip with molding compound channels

Package frame and method of manufacturing semiconductor package using the same

Semiconductor package with dual second level electrical interconnections

Method of manufacturing light emitting diode package

Semiconductor light emitting device

Mechanisms for forming package structure

Semiconductor package

Semiconductor device and method of fabricating 3D package with short cycle time and high yield

Lead frame and manufacturing method of lead frame

Electronic device provided with an encapsulation structure with improved electric accessibility and method of manufacturing the electronic device

Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereof

Molding compound supported RDL for IC package

Thin film RDL for IC package

Package with metal-insulator-metal capacitor and method of manufacturing the same

Method of fabricating semiconductor device

Interconnect structure for wafer level package

Method of fabricating semiconductor package having an interposer structure

Epoxy resin composition for optical semiconductor device, and lead frame for optical semiconductor device, encapsulation type optical semiconductor element unit and optical semiconductor device each obtainable by using the epoxy resin composition

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

Methods of forming 3-D circuits with integrated passive devices

Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof

Semiconductor package and method of fabricating the same

Method of forming a chip assembly with a die attach liquid

Package on package structure and method for forming the same

Packaged semiconductor devices and packaging methods thereof

Bonding process for a chip bonding to a thin film substrate

Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip

METHOD AND SYSTEM FOR EXTENDING DIE SIZE AND PACKAGED SEMICONDUCTOR DEVICES INCORPORATING THE SAME

Electronic device with redistribution layer and stiffeners and related methods

Electronic device and method for manufacturing same

Contact smart card

LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate

Light-emitting dies incorporating wavelength-conversion materials and related methods

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Circuit substrate interconnect

Semiconductor package and method of manufacturing the same

Through package circuit in fan-out wafer level package

Electronic module comprising a plurality of encapsulation layers and a method for producing it

Semiconductor device having markings and package on package including the same

Panel level fabrication of package substrates with integrated stiffeners

Light emitting device with light transmissive member and method for manufacturing thereof

Wafer level integration of passive devices

Power semiconductor device and the preparation method

Inline measurement of molding material thickness using terahertz reflectance

Substrate for alternative semiconductor die configurations

Inclined photonic chip package for integrated optical transceivers and optical touchscreen assemblies

Method of forming an interference shield on a substrate

Semiconductor light-emitting device, method for producing same, and display device

Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component

Method of manufacturing a LED package structure for preventing lateral light leakage

Lighting apparatus including an optoelectronic component

Stackable molded microelectronic packages with area array unit connectors

Three dimensional integrated circuits stacking approach

Semiconductor package structure with polymeric layer and manufacturing method thereof

Semiconductor devices and methods of manufacture thereof

Method for manufacturing semiconductor device and semiconductor device

Semiconductor device and method of adaptive patterning for panelized packaging

Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structure

Electronic-component mounting apparatus

Electronic packaged device

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Method for manufacturing light-emitting device

Semiconductor device and method for making the device

Wafer process for molded chip scale package (MCSP) with thick backside metallization

Package with UBM and methods of forming

Semiconductor package including an embedded surface mount device and method of forming the same

Graphene based filler material of superior thermal conductivity for chip attachment in microstructure devices

Semiconductor packages and other circuit modules with porous and non-porous stabilizing layers

Package structure and fabrication method thereof

Fan-out wafer level packages having preformed embedded ground plane connections and methods for the fabrication thereof

Packages and methods of forming packages

Semiconductor package having conductive pillars

Semiconductor device having recessed edges and method of manufacture

Electronic module and fabrication method thereof

Method of manufacturing semiconductor device package

Semiconductor device including semiconductor chips stacked over substrate

Semiconductor package and method of forming the same

Intramodule radio frequency isolation

Front side package-level serialization for packages comprising unique identifiers

Method of manufacturing a semiconductor device and inspecting an electrical characteristic thereof using socket terminals

Method for manufacturing a chip arrangement

Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

Electrical interconnect structure for an embedded semiconductor device package and method of manufacturing thereof

Method of manufacturing semiconductor device

Semiconductor packages and methods of forming the same

Interconnect structures for wafer level package and methods of forming same

Semiconductor device

Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

Multiple bond via arrays of different wire heights on a same substrate

Radio frequency module including segmented conductive ground plane

Semiconductor device and method

Thin plastic leadless package with exposed metal die paddle

Radio frequency module including segmented conductive top layer

Semiconductor modules and semiconductor packages

Via density in radio frequency shielding applications

Photocoupling device manufacturing method, photocoupling device, and power conversion system

LED with high thermal conductivity particles in phosphor conversion layer

Batch process for connecting chips to a carrier

Semiconductor device and method of forming double-sided fan-out wafer level package

UNDERFILL PROCESS AND MATERIALS FOR SINGULATED HEAT SPREADER STIFFENER FOR THIN CORE PANEL PROCESSING

Reinforcing sheet and method for producing secondary mounted semiconductor device

Light emitting device and method of manufacturing the same

Semiconductor device having multiple semiconductor chips laminated together and electrically connected

Chip package and chip assembly

Miniaturized SMD diode package and process for producing the same

Method for forming package structure

Method of manufacturing electronic device

Stacked packaging improvements

Semiconductor package with conformal EM shielding structure and manufacturing method of same

Package and method of manufacturing the same

Semiconductor device packages, packaging methods, and packaged semiconductor devices

Semiconductor package system and method

Support member, wiring substrate, method for manufacturing wiring substrate, and method for manufacturing semiconductor package

Semiconductor package having etched foil capacitor integrated into leadframe

Source down semiconductor devices and methods of formation thereof

Leadless semiconductor package and method

Semiconductor device

Packaging for ultraviolet optoelectronic device

Semiconductor device

Solder layer of a semiconductor chip arranged within recesses

Semiconductor device

Semiconductor device having single layer substrate and method

Package structure and method for fabricating the same

Wafer level flat no-lead semiconductor packages and methods of manufacture

SMD, IPD, and/or wire mount in a package

Optical semiconductor structure for emitting light through aperture

Functional spacer for SIP and methods for forming the same

Method for fabricating an interposer

Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member

Semiconductor package structure and method for manufacturing the same

Anti-fuse on and/or in package

Semiconductor device

Method for reducing cross contamination in integrated circuit manufacturing

Apparatus and methods for micro-transfer-printing

Light-emitting apparatus

Light emitting device package

Light emitting device package

Package-on-package structure and methods for forming the same

RDL-first packaging process

High density chip-to-chip connection

Methods of packaging semiconductor devices and packaged semiconductor devices

Electronic device

Semiconductor device and method of forming wafer-level interconnect structures with advanced dielectric characteristics

Methods for forming fan-out package structure

Electronic device

Semiconductor structure and method of fabricating the same

Semiconductor device packages, packaging methods, and packaged semiconductor devices

Semiconductor devices with recessed interconnects

PACKAGE SUBSTRATE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

Semiconductor device packages, packaging methods, and packaged semiconductor devices

Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion

Sensor and method for producing a sensor

Device for electrically coupling a plurality of semiconductor device layers by a common conductive layer

Light emitting diode (LED) components including contact expansion frame

White light emitting diode, manufacturing method and packaging material thereof

Semiconductor device

Semiconductor device with face-to-face chips on interposer and method of manufacturing the same

STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LEAD QFN LEADFRAMES

Semiconductor device and method for making semiconductor device

Structure and Method of Batch-Packaging Low Pin Count Embedded Semiconductor Chips

Semiconductor device and method for manufacturing same

Four D device process and structure

Matrix lid heatspreader for flip chip package

EXPOSED DIE QUAD FLAT NO-LEADS (QFN) PACKAGE

Packaging structural member

Semiconductor device with through molding vias and method of making the same

Package structure

Substrate and method for manufacturing semiconductor package

Light emitting device

Camera module and method of manufacturing the same

Fan-out package structure and methods for forming the same

Microelectronic packages having embedded sidewall substrates and methods for the producing thereof

Universal surface-mount semiconductor package

Semiconductor device having low on resistance

Semiconductor package

Self-similar and fractal design for stretchable electronics

Methods of packaging semiconductor devices and packaged semiconductor devices

Advanced structure for info wafer warpage reduction

Glass/ceramic replacement of epoxy for high temperature hermetically sealed non-axial electronic packages

Method of making a system-in-package device, and a system-in-package device

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Compact light sensing modules including reflective surfaces to enhance light collection and/or emission, and methods of fabricating such modules

Light emitting diode packaging structure and liquid crystal display device

High density film for IC package

Method for fabricating a semiconductor package

Micro lead frame structure having reinforcing portions and method

Semiconductor package

Semiconductor die encapsulation or carrier-mounting method, and corresponding semiconductor die encapsulation or carrier-mounting apparatus

Microfluidic delivery member with filter and method of forming same

Method of manufacturing semiconductor light emitting device package including light transmissive substrate having wavelength conversion regions

Electrically stackable semiconductor wafer and chip packages

LED light-emitting device

Direct die solder of gallium arsenide integrated circuit dies and methods of manufacturing gallium arsenide wafers

Method for building up a fan-out RDL structure with fine pitch line-width and line-spacing

Stacked semiconductor devices and methods of forming same

Quad flat no lead package and method of making

Integrated circuit packages and methods of forming same

Extremely thin package

Reflecting resin sheet, light emitting diode device and producing method thereof

Engineered-phosphor LED packages and related methods

Method for producing a plurality of optoelectronic components and optoelectronic component

Package-on-package semiconductor device

Method of manufacturing a chip package

Discontinuous patterned bonds for semiconductor devices and associated systems and methods

Package structure and methods of forming the same

Structure and method for package warpage control using dummy interconnects

Methods, circuits and systems for a package structure having wireless lateral connections

Packaged semiconductor devices and packaging devices and methods