Semiconductor device

Chip carrier configured for delamination-free encapsulation and stable sintering

Discrete polymer in fan-out packages

SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE

Semiconductor device

Method for manufacturing semiconductor device

Method of manufacturing semiconductor device and semiconductor device

Pressure-activated electrical interconnection by micro-transfer printing

Semiconductor package including antenna substrate and manufacturing method thereof

Integrated fan-out package including voltage regulators and methods forming same

Semiconductor package

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING AN ELEMENT

Fine pitch BVA using reconstituted wafer with area array accessible for testing

CARRIER ULTRA THIN SUBSTRATE

Electrical interconnect structure for an embedded electronics package

Semiconductor device manufacturing method and underfill film

Semiconductor device including two or more chips mounted over wiring substrate

Semiconductor package and method for fabricating the same

Chip package structure comprising encapsulant having concave surface

Double-sided semiconductor package and dual-mold method of making same

Method of manufacturing semiconductor package

Package-on-package structure and method

Chip assembly

Chip packaging method and chip packaging structure

Semiconductor device with thin redistribution layers

Semiconductor device and method of forming a PoP device with embedded vertical interconnect units

SSI PoP

Methods and apparatus for self-alignment of integrated circuit dies

Manufacturing method for semiconductor device

Fan-out wafer level packages having preformed embedded ground plane connections

Light-emitting device and manufacturing method thereof

Semiconductor package device and method of manufacturing the same

Methods of manufacturing semiconductor packages

Chip package array, and chip package

Semiconductor device with plated lead frame

Semiconductor package with multiple molding routing layers and a method of manufacturing the same

Semiconductor package and manufacturing method thereof

Method for producing a printed circuit board

Semiconductor device and mounting structure of semiconductor device

Light emitting device and method of manufacturing the same

Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same

Method for forming a package structure including a package layer surrounding first connectors beside an integrated circuit die and second connectors below the integrated circuit die

Method of mass transferring electronic device

Process for manufacturing a surface-mount semiconductor device having exposed solder material

PRE-BUMPED REDISTRIBUTION LAYER STRUCTURE AND SEMICONDUCTOR PACKAGE INCORPORATING SUCH PRE-BUMPED REDISTRIBUTION LAYER STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Single-shot encapsulation

Method of manufacturing redistribution circuit structure and method of manufacturing integrated fan-out package

Package comprising switches and filters

Molding for large panel fan-out package

LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE ATTACH PADS

Semiconductor device packages and stacked package assemblies including high density interconnections

Electronic component, electronic component mounting substrate, and electronic component mounting method to facilitate positional alignment between the electronic component and the mounting substrate

Wafer-level package with enhanced performance

Wafer level package for a MEMS sensor device and corresponding manufacturing process

Method for manufacturing light emitting device including light emitting element and color conversion material layer

Substrate designed to provide EMI shielding

Dense redistribution layers in semiconductor packages and methods of forming the same

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Strip-type substrate for producing chip card modules

Semiconductor devices comprising protected side surfaces and related methods

Flat panel display formed by self aligned assembly

Method and apparatus for making integrated circuit packages

Fan-out package and methods of forming thereof

Electronic circuit package

Package structures and method of forming the same

Electronic device comprising an encapsulating block locally of smaller thickness

Packaged semiconductor devices and methods of packaging semiconductor devices

Embedded semiconductive chips in reconstituted wafers, and systems containing same

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Compact optoelectronic modules

3D semiconductor package interposer with die cavity

Systems and methods for bonding semiconductor elements

Electronic component and manufacturing method thereof

Method and structure of three-dimensional chip stacking

SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE SHIELDING FOR INTEGRATED CIRCUIT MODULES

Semiconductor package and method of manufacturing the same

Wiring substrate and semiconductor package

Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package

Package on-package structure

Semiconductor device and method of forming PoP semiconductor device with RDL over top package

Antenna in embedded wafer-level ball-grid array package

Lead frame and method of fabricating the same

Semiconductor device with solders of different melting points and method of manufacturing

Electronic package and manufacturing method thereof

System for applying interface materials

Optical-semiconductor device with bottom surface including electrically conductive members and light-blocking base member therebetween, and method for manufacturing the same

Light emitting device and method of manufacturing the light emitting device

Semiconductor device and method of forming build-up interconnect structures over a temporary substrate

Semiconductor package and manufacturing method thereof

Multiple pixel surface mount device package

Integrated circuit package assemblies including a chip recess

Semiconductor package and fabricating method thereof

Shielded package with integrated antenna

Package structure and method for forming the same

Lead frame and method of producing a chip housing

Method for manufacturing semiconductor structure

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Wiring substrate and semiconductor device

LED package with integrated features for gas or liquid cooling

Method of manufacturing semiconductor device

Light emitting diode array on a backplane and method of making thereof

Semiconductor package structure and method for forming the same

Semiconductor device including semiconductor chips mounted over both surfaces of substrate

Semiconductor device

LED with high thermal conductivity particles in phosphor conversion layer

Light-emitting apparatus

Semiconductor device assembly with heat transfer structure formed from semiconductor material

Manufacturing method of integrated circuit package

DEVICE COMPRISING A SUBSTRATE THAT INCLUDES AN IRRADIATED PORTION ON A SURFACE OF THE SUBSTRATE

Electronic part embedded substrate and method of producing an electronic part embedded substrate

Self-similar and fractal design for stretchable electronics

Manufacturing method of semiconductor package

SEMICONDUCTOR PACKAGES WITH SUB-TERMINALS AND RELATED METHODS

Semiconductor package using a coreless signal distribution structure

Encapsulated circuit module, and production method therefor

Devices and methods related to singulated radio-frequency devices

Semiconductor package with multiple molding routing layers and a method of manufacturing the same

Semiconductor package with multiple molding routing layers and a method of manufacturing the same

Electronic-component mounting apparatus

Light emitting device and method of manufacturing the same

Micro device integration into system substrate

Substrate based light emitter devices, components, and related methods

Methods of assembling a flip chip on a locking dual leadframe

Encapsulated circuit module, and production method therefor

Methods of forming wire interconnect structures

Semiconductor packaging structure and process

Integrated circuit package configurations to reduce stiffness

Method of fabricating package structures

Advanced INFO POP and method of forming thereof

Transferring method, manufacturing method, device and electronic apparatus of micro-LED

Packaged semiconductor devices and packaging devices and methods

Method of manufacturing a semiconductor device and inspecting an electrical characteristic thereof using test socket terminals

Fan-out wafer level chip package structure

Semiconductor device and method of making embedded wafer level chip scale packages

Racetrack layout for radio frequency isolation structure

SEMICONDUCTOR DEVICE

Semiconductor device and method of manufacturing the same

Transferring method, manufacturing method, device and electronic apparatus of micro-LED

Assembling method, manufacturing method, device and electronic apparatus of flip-die

Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits

Semiconductor package

Embedded multi-device bridge with through-bridge conductive via signal connection

Electronic component package and method of manufacturing the same

Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof

Stacked wafer-level packaging devices

Integrated circuit assembly that includes stacked dice

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor die assemblies with heat sink and associated systems and methods

Semiconductor package and manufacturing method thereof

Light emitting device and fluidic manufacture thereof

Three-layer Package-on-Package structure and method forming same

Stacked semiconductor devices

Integrated interposer solutions for 2D and 3D IC packaging

Package with vertical interconnect between carrier and clip

Device including a semiconductor chip monolithically integrated with a driver circuit in a semiconductor material

Semiconductor device and method for manufacturing the same

Method for manufacturing semiconductor structure

3D IC method and device

Methods and devices for fabricating and assembling printable semiconductor elements

Chip on package structure and method

Locking dual leadframe for flip chip on leadframe packages

Bonding method of semiconductor chip and bonding apparatus of semiconductor chip

Electronic circuit package

Substrate designed to provide EMI shielding

Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

Fabrication method of electronic module

Structures and methods for reliable packages

Conveyor apparatus and method for transporting leadframe

Manufacturing method of semiconductor package

Mechanisms for forming package structure

Chip packages and methods of manufacture thereof

Methods and structures for packaging semiconductor dies

Three-dimensional chip stack and method of forming the same

PACKAGE AND METHOD OF MANUFACTURING THE SAME

Vertical interconnects for self shielded system in package (SiP) modules

Semiconductor package having a metal paint layer

Electronic circuit package

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices

Silicon package for embedded semiconductor chip and power converter

Silicon package for embedded semiconductor chip and power converter

Methods of forming 3-D circuits with integrated passive devices

Method of manufacturing glass sheet

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

Method of producing optoelectronic modules and an assembly having a module

Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages

Electronic circuit package

Flat No-Leads Package With Improved Contact Pins

Mounting apparatus

Embedded chip packages and methods for manufacturing an embedded chip package

Lead frame including hanger lead, package, and light-emitting device

Package on package structure and method for forming the same

Systems and methods for electromagnetic interference shielding

Alignment mark design for packages

Multi-chip package structure manufacturing process and wafer level chip package structure manufacturing process

Pressure-activated electrical interconnection by micro-transfer printing

VACUUM LAMINATING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS

Package support, fabrication method and LED package

Light emitting device and method of manufacturing the same

Package-on-package semiconductor device

Package process and package structure

Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP)

SEALING SHEET, SEALING SHEET WITH SEPARATOR, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

Process for manufacturing a packaged device, in particular a packaged micro-electro-mechanical sensor, having an accessible structure, such as a mems microphone and packaged device obtained thereby

Electric component with sensitive component structures and method for producing an electric component with sensitive component structures

Package on package (PoP) bonding structures

LED MODULE AND LED MODULE MOUNTING STRUCTURE

Semiconductor package and fabricating method thereof

Semiconductor device and method of forming embedded wafer level chip scale packages

Dual lead frame semiconductor package and method of manufacture

Backside drill embedded die substrate

Semiconductor packages with embedded bridge interconnects

Printed circuit board and method of fabricating an element

Leadframe leads having fully plated end faces

CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING SAME

Integrated fan-out package, integrated fan-out package array, and method of manufacturing integrated fan-out packages

Electronic device

EMI/RFI shielding for semiconductor device packages

System-in-package devices with magnetic shielding

Integrated fan-out package including voltage regulators and methods forming same

Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB

Semiconductor package with sidewall-protected RDL interposer

Power amplifier modules with bonding pads and related systems, devices, and methods

Methods of making semiconductor device packages and related semiconductor device packages

Localized redistribution layer structure for embedded component package and method

Micro-transfer printable electronic component

Wafer level shielding in multi-stacked fan out packages and methods of forming same

SOC with integrated voltage regulator using preformed MIM capacitor wafer

Module for heat generating electronic component

Microelectronic elements with post-assembly planarization

Semiconductor device and method of stacking semiconductor die for system-level ESD protection

Semiconductor package and rework process for the same

Efficiently micro-transfer printing micro-scale devices onto large-format substrates

Thermal performance structure for semiconductor packages and method of forming same

Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package

Alignment mark design for packages

Semiconductor device

Electronic device comprising an encapsulating block locally of smaller thickness

Conductive coating material for shielding electronic component package and method for producing shielded package

Semiconductor package incorporating redistribution layer interposer

Light emitting device

Semiconductor device and method of forming interconnect substrate for FO-WLCSP

Semiconductor package device including electromagnetic wave shield and method of manufacturing the same

Carrier, carrier leadframe, and light emitting device

Light-emitting apparatus

Packages and methods of forming packages

Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package

Method for a stacked and bonded semiconductor device

Apparatuses and methods for forming die stacks

Manufacture of wafer—panel die package assembly technology

Tri-layer CoWoS structure

Attaching chip attach medium to already encapsulated electronic chip

Encapsulated electronic device mounted on a redistribution layer

Info coil structure and methods of manufacturing same

Semiconductor device packaging assembly, lead frame strip and unit lead frame with molding compound channels

IC packaging method and a packaged IC device

Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package

Sawing underfill in packaging processes

Shielded QFN package and method of making

Semiconductor device and manufacturing method thereof

Semiconductor light-emitting device and optical-semiconductor-mounting substrate

Compact opto-electronic modules and fabrication methods for such modules

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Semiconductor packages having redistribution substrate

Thermally enhanced semiconductor assembly with three dimensional integration and method of making the same

Light emitting device

Method of fabricating low CTE interposer without TSV structure

Fan-out multi-chip package with plurality of chips stacked in staggered stack arrangement

Semiconductor device and method

Via structure for packaging and a method of forming

Semiconductor package and method for fabricating the same

MIMCAP structure in a semiconductor device package

Leadless electronic packages for GAN devices

Printed adhesion deposition to mitigate integrated circuit package delamination

Conductor pad for flexible circuits and flexible circuit incorporating the same

Structure and formation method for chip package

Electromagnetic interference shielding for system-in-package technology

Electronic package having electromagnetic interference shielding and associated method

Method of marking a semiconductor package

Semiconductor device package and manufacturing method thereof

Power semiconductor device with small contact footprint and the preparation method

Semiconductor device and method of forming ultra high density embedded semiconductor die package

Adhesive film for semiconductor chip with through electrode

Method of manufacturing light emitting device

Package, light-emitting device, and method for manufacturing the same

Flipped die stacks with multiple rows of leadframe interconnects

Semiconductor device

Leadframe strip assembly and method of processing

METHOD FOR PRODUCING ELECTRONIC DEVICES

Method of fabricating low-profile footed power package

Opto-electronic apparatus and manufacturing method thereof

Electronic package having a supporting board and package carrier thereof

Eliminate sawing-induced peeling through forming trenches

Packages with molding structures and methods of forming the same

High power and high frequency plastic pre-molded cavity package

Interposer registration elements

Semiconductor light-emitting device, method for producing same, and display device

PACKAGED SEMICONDUCTOR DEVICES AND RELATED METHODS

Semiconductor assembly having anti-warping controller and vertical connecting element in stiffener