207867 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Semiconductor device
#2102SEMICONDUCTOR PACKAGES INCLUDING SIDE SHIELDING PARTS
#2103Semiconductor package with antenna
#2104Flat no-lead packages with electroplated edges
#2105Connector block with two sorts of through connections, and electronic device comprising a connector block
#2106Method of manufacturing light emitting device
#2107Methods of forming connector pad structures, interconnect structures, and structures thereof
#2108Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof
#2109Devices and methods related to packaging of radio-frequency devices on ceramic substrates
#2110Method for fabricating piezoelectric quartz resonator
#2111Integrated circuit packages and methods of forming same
#2112Fully molded peripheral package on package device
#2113Semiconductor device package
#2114Substrate-less integrated components
#2115Semiconductor package including a semiconductor die having redistributed pads
#2116Sintering materials and attachment methods using same
#2117Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#2118Three layer stack structure
#2119Semiconductor package and method of manufacturing the same
#2120Carrier ultra thin substrate
#2121Method for fabricating an electronic device and a stacked electronic device
#2122Methods and systems to improve yield in multiple chips integration processes
#2123Method of packaging integrated circuit die and device
#2124Semiconductor Device and Method of Forming Inverted Pyramid Cavity Semiconductor Package
#2125Leadless semiconductor packages, leadframes therefor, and methods of making
#2126Leadframe and semiconductor device
#2127Semiconductor device and method of using a standardized carrier in semiconductor packaging
#2128Light emitting device mount, leadframe, and light emitting apparatus
#2129Chip-stacked semiconductor package and method of manufacturing the same
#2130Stacked integrated circuit structure and method of forming
#2131Semiconductor device and method of forming DCALGA package using semiconductor die with micro pillars
#2132Semiconductor packages and methods of forming the same
#2133Gallium arsenide devices with copper backside for direct die solder attach
#2134Circuit package with segmented external shield to provide internal shielding between electronic components
#2135Leadframe
#2136Semiconductor device and manufacturing method thereof
#2137Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus
#2138LED light bar manufacturing method and LED light bar
#2139Semiconductor device and method
#2140Leadframe package with pre-applied filler material
#2141Packaging for ultraviolet optoelectronic device
#2142Apparatus and methods for micro-transfer-printing
#2143Semiconductor device and method for manufacturing the same
#2144Multi-die package comprising unit specific alignment and unit specific routing
#2145Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package
#2146Configurable routing for packaging applications
#2147Die attachment for packaged semiconductor device
#2148Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#2149Interconnection structure, LED module and method
#2150Chip packaging module
#2151Package structures and method of forming the same
#2152Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors
#2153Backside redistribution layer (RDL) structure
#2154ON-PACKAGE CONNECTOR
#2155SEMICONDUCTOR PACKAGE
#2156Production of optoelectronic components
#2157Method of forming 3D integrated circuit package with panel type lid
#2158Semiconductor apparatus, stacked semiconductor apparatus and encapsulated stacked-semiconductor apparatus each having photo-curable resin layer
#2159Semiconductor device including electromagnetic interference (EMI) shielding layer and method for manufacturing the semiconductor device
#2160Fully molded miniaturized semiconductor module
#2161Semiconductor device, embedded capacitor unit, semiconductor package, and method of manufacturing embedded capacitor unit
#2162Wafer-level flipped die stacks with leadframes or metal foil interconnects
#2163Cascode semiconductor package and related methods
#2164Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
#2165Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device
#2166Wafer-level packaging using wire bond wires in place of a redistribution layer
#2167Semiconductor package and method of forming the same
#2168Semiconductor chip package and method of manufacturing the same
#2169Semiconductor device packages, packaging methods, and packaged semiconductor devices
#2170Semiconductor assembly with electromagnetic shielding and thermally enhanced characteristics and method of making the same
#21713DIC package and methods of forming the same
#2172Semiconductor Device and Method of Forming Interconnect Structure and Mounting Semiconductor Die in Recessed Encapsulant
#2173Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
#2174Production of optoelectronic components
#2175Semiconductor device and manufacturing method thereof
#2176Universal BGA substrate
#2177Semiconductor devices and methods of making the same
#2178Dicing in wafer level package
#2179Package structures and method of forming the same
#2180Packaged semiconductor device having leadframe features preventing delamination
#2181Semiconductor device and manufacturing method thereof
#2182Semiconductor package and manufacturing method thereof
#2183Coaxial copper pillar
#2184Method for packaging circuits
#2185Side-view type light emitting device including base body having protruding component
#2186Solid-state imaging apparatus to suppress flare and ghosts
#2187Method of assembly semiconductor device with through-package interconnect
#2188Devices and methods of packaging semiconductor devices
#2189Three dimensional integrated circuits stacking approach
#2190Through package via (TPV)
#2191Methods of forming wire interconnect structures
#2192Integrated circuits protected by substrates with cavities, and methods of manufacture
#2193Stacked die integrated circuit
#2194Semiconductor device having conductive shield layer
#2195Semiconductor package structure and method for forming the same
#2196Antenna in embedded wafer-level ball-grid array package
#2197Semiconductor device
#2198Semiconductor device and method of forming small Z semiconductor package
#2199Semiconductor package
#2200Methods for controlling warpage in packaging
#2201Manufacturing method of a flip-chip light emitting diode package module
#2202Display apparatus and manufacturing method thereof
#2203Interconnect structure for package-on-package devices and a method of fabricating
#2204Self shielded system in package (SiP) modules
#2205Heatsink very-thin quad flat no-leads (HVQFN) package
#2206Micro device transfer head heater assembly and method of transferring a micro device
#2207Waveguide and semiconductor packaging
#2208Die bonding to a board
#2209Electronic device module and method of manufacturing the same
#2210Flipped die stack
#2211Semiconductor device including a connection unit and semiconductor device fabrication method of the same
#2212Flip chip bonding alloys
#2213Microelectronic assemblies with cavities, and methods of fabrication
#2214SOC with integrated voltage regulator using preformed MIM capacitor wafer
#2215Compliant micro device transfer head
#2216Light emitting device
#2217Methods of making semiconductor device packages and related semiconductor device packages
#2218Integrated fan-out structure with openings in buffer layer
#2219Semiconductor packages with thermal-enhanced conformal shielding and related methods
#2220Insulated die
#2221Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP
#2222Smart pixel surface mount device package
#2223Method of manufacturing a semiconductor package
#2224Chip package
#2225Semiconductor package system and method
#2226Flat No-Leads Package With Improved Contact Pins
#2227Method of fabricating a semiconductor device
#2228Power amplifier modules including tantalum nitride terminated through wafer via and related systems, devices, and methods
#2229Power amplifier modules with harmonic termination circuit and related systems, devices, and methods
#2230High voltage device with multi-electrode control
#2231Molded semiconductor package
#2232Semiconductor device having recessed edges and method of manufacture
#2233Die package with low electromagnetic interference interconnection
#2234Die packaging with fully or partially fused dielectric leads
#2235Power amplifier modules with power amplifier and transmission line and related systems, devices, and methods
#2236Semiconductor package in package
#2237Apparatus, system, and method for wireless connection in integrated circuit packages
#2238Power semiconductor package device having locking mechanism, and preparation method thereof
#2239Method for making semiconductor device with sidewall recess and related devices
#2240Heat isolation structures for high bandwidth interconnects
#2241Structures and methods for reliable packages
#2242Semiconductor packages including interposer and methods of manufacturing the same
#2243Method and apparatus for assembling a component with a flexible foil, as well as the assembled product
#2244Light emitting device and method of manufacturing the same
#2245Electronic device with redistribution layer and stiffeners and related methods
#2246Package substrate and semiconductor package including the same
#2247Electrically testable microwave integrated circuit packaging
#2248Method of electrically isolating leads of a lead frame strip by laser beam cutting
#2249Semiconductor light-emitting device
#2250Method of fabricating a semiconductor device and the semiconductor device
#2251Method of manufacturing wafer level packaging including through encapsulation vias
#2252Method and apparatus for using universal cavity wafer in wafer level packaging
#2253Semiconductor device that transfers an electric signal with a set of inductors
#2254Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
#2255Bonding apparatus and bonding method
#2256MRAM magnetic shielding with fan-out wafer level packaging
#2257Light-emitting apparatus
#2258Apparatus for stacked semiconductor packages and methods of fabricating the same
#22593-D package having plurality of substrates
#2260Method for bonding substrates
#2261Semiconductor devices including dummy chips
#2262Electronic part embedded substrate and method of producing an electronic part embedded substrate
#2263Methods of fabricating a semiconductor package structure including at least one redistribution layer
#2264Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#2265Thermally enhanced face-to-face semiconductor assembly with built-in heat spreader and method of making the same
#2266Method for manufacturing a semiconductor package
#2267Electronic component package including electronic component, metal member, and sealing resin
#2268Package for a surface-mount semiconductor device and manufacturing method thereof
#2269Surface-mount semiconductor device having exposed solder material
#2270Semiconductor device including lead frames with downset
#2271Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern
#2272Semiconductor package assembly and method for forming the same
#2273Semiconductor device assembly with heat transfer structure formed from semiconductor material
#2274Semiconductor device including semiconductor chips mounted over both surfaces of substrate
#2275Embedded multi-device bridge with through-bridge conductive via signal connection
#2276System, apparatus, and method for embedding a 3D component with an interconnect structure
#2277Molding compound structure
#2278Semiconductor lead frame, semiconductor package, and manufacturing method thereof
#2279System, apparatus, and method for embedding a device in a faceup workpiece
#2280Semiconductor device including at least one element
#2281Flip chip module with enhanced properties
#2282Chip on flex optical subassembly
#2283Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element
#2284Adhesive composition, resin cured product obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element
#2285Discontinuous patterned bonds for semiconductor devices and associated systems and methods
#2286Electronic component package and package-on-package structure including the same
#2287Semiconductor package structure and method for manufacturing the same
#2288Method of forming a semiconductor package
#2289Electronic component package and method of manufacturing the same
#2290Molding structure for wafer level package
#2291Integrated fan-out structure with guiding trenches in buffer layer
#2292SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#2293Methods of packaging semiconductor devices and packaged semiconductor devices
#2294Package on package bonding structure and method for forming the same
#2295Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices
#2296Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability
#2297Semiconductor device and manufacturing method thereof
#2298Multi-chip package structure having blocking structure, wafer level chip package structure having blocking structure and manufacturing process thereof
#2299Semiconductor package manufacturing method
#2300Multi-chip package structure, wafer level chip package structure and manufacturing process thereof
#2301MOSFET with reduced resistance
#2302Discrete polymer in fan-out packages
#2303Methods of forming multiple conductive features in semiconductor devices in a same formation process
#2304Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
#2305Electrical connectivity for circuit applications
#2306Packaging solutions for devices and systems comprising lateral GaN power transistors
#2307Structure and method to minimize warpage of packaged semiconductor devices
#2308Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package
#2309Method for producing optoelectronic semiconductor components and optoelectronic semiconductor component
#2310Semiconductor device and method of forming a package in-fan out package
#2311Double side mounting memory integration in thin low warpage fanout package
#2312Integrated circuit packaging system with shielding and method of manufacturing thereof
#2313Double-sided semiconductor package and dual-mold method of making same
#2314Packaged semiconductor devices and methods of packaging semiconductor devices
#2315Plated terminals with routing interconnections semiconductor device
#2316Plated terminals with routing interconnections semiconductor device
#2317Chip package and method for fabricating the same
#2318Integrated circuit structure and method of forming
#2319Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#2320Production method for light-emitting device
#2321LED packages and manufacturing method thereof
#2322Methods and devices for fabricating and assembling printable semiconductor elements
#2323Compact optoelectronic modules
#2324Semiconductor device
#2325Chip on package structure and method
#2326Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof
#2327System-in-package and fabrication method thereof
#2328Micro device transfer system with pivot mount
#2329Semiconductor packages with socket plug interconnection structures
#2330Circuit assemblies with multiple interposer substrates, and methods of fabrication
#2331Plated terminals with routing interconnections semiconductor device
#2332Die-on-interposer assembly with dam structure and method of manufacturing the same
#2333Semiconductor assembly with built-in stiffener and integrated dual routing circuitries and method of making the same
#2334Integrated circuit package configurations to reduce stiffness
#2335Manufacturing method of package substrate and package manufacturing method of semiconductor device
#2336RF amplifier module and methods of manufacture thereof
#2337RF amplifier with conductor-less region underlying filter circuit inductor, and methods of manufacture thereof
#2338Magnetic shielding of MRAM package
#2339Package on package (PoP) bonding structures
#2340Package-on-package semiconductor device
#2341Fan-out interconnect structure and method for forming same
#2342Encapsulated dies with enhanced thermal performance
#2343Methods and devices for fabricating and assembling printable semiconductor elements
#2344Method of embedding WLCSP components in e-WLB and e-PLB
#2345Three-dimensional chip stack and method of forming the same
#2346Semiconductor device and method of forming PoP semiconductor device with RDL over top package
#2347Integrated circuit assemblies with reinforcement frames, and methods of manufacture
#2348Semiconductor package and mobile device using the same
#2349Semiconductor device and method of forming an embedded SoP fan-out package
#2350Lead frames with wettable flanks
#2351Non-vertical through-via in package
#2352Semiconductor device and method of forming stacked vias within interconnect structure for FO-WLCSP
#2353Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package
#2354Semiconductor device and method to minimize stress on stack via
#2355Semiconductor device and method of forming build-up interconnect structures over carrier for testing at interim stages
#2356METHOD AND APPARATUS FOR MAKING INTEGRATED CIRCUIT PACKAGES
#2357Semiconductor device and manufacturing method thereof
#2358Resin sheet for sealing electronic device and method for manufacturing electronic-device package
#2359Fan-out pop stacking process
#2360Semiconductor device and method of manufacturing the same
#2361High performance package and process for making
#2362Method for Manufacturing Electronic Component
#2363Semiconductor packages and methods of fabricating the same
#2364Packaging solutions for devices and systems comprising lateral GaN power transistors
#2365Packaging solutions for devices and systems comprising lateral GaN power transistors
#2366Fan out system in package and method for forming the same
#2367Package-on-package stacked microelectronic structures
#2368Fully molded peripheral package on package device
#2369Source down semiconductor devices and methods of formation thereof
#2370Semiconductor device
#2371Electronic package and fabrication method thereof
#2372Light emitting device, lead frame and resin cavity molding package
#23733D semiconductor package interposer with die cavity
#2374Semiconductor device package and method of manufacturing the same
#2375Semiconductor structure and manufacturing method thereof
#2376Method of manufacturing semiconductor device
#2377Packaging module of power converting circuit and method for manufacturing the same
#2378Package module of power conversion circuit and manufacturing method thereof
#2379Integrated circuit package and method of making the same
#2380Method of manufacturing semiconductor device and semiconductor device
#2381Array Formed From A Multiplicity Of Electric Integrated Circuits, and Method For Production Thereof
#2382Packages with stacked dies and methods of forming the same
#2383Method and apparatus for interconnecting stacked dies using metal posts
#2384Bonded system and a method for adhesively bonding a hygroscopic material
#2385Flip-chip light emitting diode and method for manufacturing the same
#2386Method for Manufacturing Semiconductor Device, Sheet-Shaped Resin Composition, and Dicing Tape-Integrated Sheet-Shaped Resin Composition
#2387Light-emitting apparatus
#2388Semiconductor device packages and method of making the same
#2389Singulation method for semiconductor package with plating on side of connectors
#2390Semiconductor device and method
#2391Package structures and method of forming the same
#2392Methods for making a multilevel leadframe by etching a conductive sheet from two opposite sides
#2393Microfluidic delivery member with filter and method of forming same
#2394Method of manufacturing semiconductor device
#2395Semiconductor package using a coreless signal distribution structure
#2396Semiconductor device and manufacturing method thereof
#2397Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package
#2398Semiconductor die assemblies with heat sink and associated systems and methods
#2399Semiconductor package structure with preferred heat dissipating efficacy without formation of short circuit
#2400Semiconductor package and method of fabricating the same