Package structure with a retarding structure and method of making same

Semiconductor package, method for manufacturing the same and lead frame for use in the same

Bonding pad structure

Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components

Surface acoustic wave apparatus

Integrated interconnect package

Semiconductor chip and semiconductor device including lamination of semiconductor chips

Semiconductor device

Semiconductor device and method for fabricating the same

BGA package with component protection on bottom

Multi-surface contact IC packaging structures and assemblies

Semiconductor circuit with multiple contact sizes

Method of manufacturing a semiconductor device having an enhanced electrode pad structure

Semiconductor device and method of manufacturing the same

Interconnection element for BGA housings and method for producing the same

Support body for semiconductor element, method for manufacturing the same and semiconductor device

ASIC-embedded switchable antenna arrays

Multi-chip module

Semiconductor package for memory chips

Semiconductor package with lid heat spreader

Semiconductor apparatus

Semiconductor device having metal plates and semiconductor chip

Antenna-incorporated semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device, process of producing semiconductor device, and ink jet recording head

Multi-surface IC packaging structures and methods for their manufacture

Flip-chip sub-assembly, methods of making same and device including same

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor device, electronic card and pad rearrangement substrate

Power semiconductor device and power semiconductor module

Modular power semiconductor module

Chip package and substrate

Window type case for memory card

Semiconductor device

Plastic package and method of fabricating the same

Method of mounting a circuit component and joint structure therefor

Tape circuit substrate and semiconductor apparatus employing the same

Semiconductor package capable of absorbing electromagnetic wave

Semiconductor device and method of fabricating the same

Solid state light-emitting element, method for producing the element, and projector

IC package with stacked sheet metal substrate

Light emitting element and light emitting device

Optoelectronic component and method for producing it

Thin film light emitting diode

Technique for attaching die to leads

Broad-spectrum A1InGaN light emitting diodes and solid state white light emitting devices

Semiconductor device and wire bonding method

Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece

Bath and method for high rate copper deposition

Circuit device

Solderless electronics packaging and methods of manufacture

Method of manufacturing a lead frame

Integrating an antenna and a filter in the housing of a device package

Use of a down-bond as a controlled inductor in integrated circuit applications

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Method of forming multi-piled bump

Method of fabricating ultra thin flip-chip package

Method for forming solder bump structure

Stacked semiconductor packages

Manufacturing method of ball grid array package

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Card manufacturing technique and resulting card

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Optical printed circuit board system having tapered waveguide

Semiconductor laser beam device

Circuit device

Solid-state imaging device

Robust antenna connection for an electronics component assembly in a tire

Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load

Circuit arrangement having a load transistor and a voltage limiting circuit and method for driving a load transistor

Resin molded type semiconductor device and a method of manufacturing the same

Electronic component and panel and method for producing the same

Method for reduced input output area

RF circuit electrostatic discharge protection

Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof

Flip chip package using no-flow underfill and method of fabrication

Depopulation of a ball grid array to allow via placement

Ball grid array package and method thereof

Flip-chip light emitting diode package structure

Cavity-down semiconductor package with heat spreader

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

Back-face and edge interconnects for lidded package

Circuit device

Electromagnetic noise shielding in semiconductor packages using caged interconnect structures

Microelectronic component and assembly having leads with offset portions

Power module flip chip package

Chip package structure and process for fabricating the same

Wiring substrate for mounting semiconductor components

Electronic substrate, power module and motor driver

Chip scale package and method of fabricating the same

Method for fabricating a semiconductor package with multi layered leadframe

Integrated circuit bond pad structures and methods of making

Light transmissive cover, device provided with same and methods for manufacturing them

Electrode structure, and semiconductor light-emitting device having the same

Optoelectronic semiconductor device and light signal input/output device

Vertical removal of excess solder from a circuit substrate

Automated filament attachment system for vacuum fluorescent display

Device for processing a wire

Pressure sensing device incorporating pressure sensing chip in resin case

Micro-control apparatus for circular knitting machines

Conductive adhesive and piezo-electric device having piezo-electric element mounted thereon using such adhesive

Radio frequency unit analog level detector and feedback control system

Method of forming bumps

Manufacturing method of an electronic device package

System and method for reducing or eliminating semiconductor device wire sweep

Structure and method of making capped chips using sacrificial layer

Thermally enhanced packaging structure and fabrication method thereof

Method of manufacturing a semiconductor device

Thinned, strengthened semiconductor substrates and packages including same

Method for the production of light-guiding LED bodies in two chronologically separate stages

Semiconductor device manufacturing method

Semiconductor test board having laser patterned conductors

Method for producing wiring substrate

Optical module, and optical transmission device

Optical bench for mounting optical element and manufacturing method thereof

Output circuit for a semiconductor amplifier element

Dielectric thermal stack for the cooling of high power electronics

Liquid cooled semiconductor device

Electrical interconnection for high-frequency devices

RF amplifier

Semiconductor circuit arrangement for controlling a high voltage or a current of high current intensity

White light emitting diode with first and second LED elements

[IMPROVED STRUCTURE OF LED]

LED with good heat-dissipating capability

Method for producing semiconductor device and semiconductor device

Resin-sealed semiconductor device

High-speed signaling interface and method for communicating across across an interface

Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion

Semiconductor device and a method of manufacturing the same

Prevention of contamination on bonding pads of wafer during SMT

Semiconductor device and method of enveloping an integrated circuit

Semiconductor component and production method suitable therefor

Integrated circuit with copper interconnect and top level bonding/interconnect layer

Electronic circuit device and porduction method therefor

Adapter for non-permanently connecting integrated circuit devices to multi-chip modules and method of using same

Integrated circuit package with integral leadframe convector and method therefor

Semiconductor device

Simplified stacked chip assemblies

Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same

Semiconductor device containing stacked semiconductor chips and manufacturing method thereof

Structure and self-locating method of making capped chips

Structure and method of making sealed capped chips

Package for semiconductor device having a device-supporting polymeric material covering a solder ball array area

Tape circuit substrate and semicondutor chip package using the same

Chip package and electrical connection structure between chip and substrate

STRUCTURE OF WAFER LEVEL PACKAGE WITH AREA BUMP

Light source with a light-emitting element

Light emitting diode and manufacturing method thereof

Optical semiconductor device

Large bumps for optical flip chips

Large bumps for optical flip chips

Semiconductor laser device

Optical semiconductor housing with transparent chip and method for making same

IC card

Portable electronic device

Self-locking wire bond structure and method of making the same

Thermopile IR detector package structure

Printed circuit board assembly and method

Method for controlling resonant tag frequency

Module integration integrated circuits

Wirebond structure and method to connect to a microelectronic die

Fabrication method for light-emitting chips

Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection

Method for stacking chips within a multichip module package

Optical device and production method thereof

Optimization of routing layers and board space requirements for a ball grid array package

Method for producing a multichip module and multichip module

Forming of the last metallization level of an integrated circuit

Optimization of routing layers and board space requirements for a ball grid array land pattern

Die pillar structures and a method of their formation

Semiconductor radiation emitter package

Vertically stacked pre-packaged integrated circuit chips

Miniaturized small memory card structure

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Semiconductor device having heat radiation plate and bonding member

High power light emitting diode device

Integrated circuit package

Small memory card

Method and structure for a wafer level packaging

Integrated circuit package with laminated power cell having coplanar electrode

Method and structure for a wafer level packaging

Semiconductor device

Package type semiconductor device

Leadframe for use in a semiconductor package

Semiconductor component with electromagnetic shielding device

Ball grid array package with patterned stiffener surface and method of assembling the same

LED and its manufacturing process

Light-emitting diode and method of manufacturing the light-emitting diode

Semiconductor package

Light emitting device having a divalent-europium-activated alkaline earth metal orthosilicate phosphor

Wavelength converted light emitting apparatus using phosphor and manufacturing method thereof

Light-emitting diode chip package body and packaging method thereof

LED luminaire

Integrally packaged imaging module

Optical device and production method thereof

Stacked small memory card

Bonding tool with polymer coating

Ball grid array (BGA) package having corner or edge tab supports

Printed circuit board unit with detachment mechanism for electronic component

Method of making a resonant frequency tag

Inter-chip and intra-chip wireless communications systems

Local multilayered metallization

Method of fabricating a wire bond pad with Ni/Au metallization

Method of manufacturing a semiconductor device including a bump forming process

Method for producing ultra-thin semiconductor device

Method of making circuitized substrate

Metallic dam and method of forming therefor

Process for producing resin-sealed type electronic device

Process for manufacturing photosensitive module

Method for manufacturing solid-state imaging devices

Method of using pre-applied underfill encapsulant

Optical module

Tunable dispersion compensator

Light emitting device

Semiconductor laser

Laser module

Lightemitting device and method of manufacturing the same

Integrated optical filter

Integrated circuit package bond pad having plurality of conductive members

Semiconductor electronic device and method of manufacturing thereof

Semiconductor device with electrode pad having probe mark

Quad flat no-lead package structure and manufacturing method thereof

Integrated circuit incorporating flip chip and wire bonding

Semiconductor device and method of fabricating the same

Sealing and protecting integrated circuit bonding pads

Wireless coupling of staked dies within system in package

Semiconductor device having heat conducting plate

Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate

Wafer level package for micro device

Semiconductor device and method of fabricating the same

Conductive trace structure and semiconductor package having the conductive trace structure

Semiconductor device and a method for securing the device in a carrier tape

Overmolded optical package

Semiconductor component and system having stiffener and circuit decal

Leadless semiconductor package

Lead frame, semiconductor device, and method for manufacturing semiconductor device

Multichip wafer level packages and computing systems incorporating same

Input/output structure and integrated circuit using the same

Encapsulated light receiving and processing semiconductor module with enhanced shielding and grounding properties

Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof

Transistor having multiple gate pads

Semiconductor laser

Light emitting device assembly

Light-emitting device and process for producing thereof

Method of forming low wire loops and wire loops formed using the method

Device for detecting magnetic azimuth

Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate

Reliable metal bumps on top of I/O pads after removal of test probe marks

Method of mounting wafer on printed wiring substrate

Method for fabricating wafer-level chip scale packages

Method of manufacturing a semiconductor device

FBAR based duplexer device and manufacturing method thereof

Lead-free solder composition for substrates

Laser diode module, laser apparatus and laser processing apparatus

Bus structure for power switching circuits

LED and LED lamp

Thin film circuit board device and method for manufacturing the same

Method of producing an electronic component and a panel with a plurality of electronic components

Semiconductor device and method for producing the same

Method and apparatus for a dual substrate package

Semiconductor apparatus and method of fabricating the same

Reinforced bond pad

Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond pad

Semiconductor device with multilayered metal pattern

Semiconductor device and method of manufacturing the same

Optical semiconductor device

Apparatus for connecting an IC terminal to a reference potential

Semiconductor device and electronic apparatus equipped with the semiconductor device

Spacerless die stacking

Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps

Method of establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate

Semiconductor device containing stacked semiconductor chips and manufacturing method thereof

Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another

Memory expansion and chip scale stacking system and method

Semiconductor device containing stacked semiconductor chips and manufacturing method thereof

Package having integral lens and wafer-scale fabrication method therefor

Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit

Method of forming a semiconductor package and structure thereof

Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate

Fine pitch electronic flame-off wand electrode

Hybrid integrated circuit device and method of manufacturing the same

Method of manufacturing a module

Circuit carrier and production thereof

ULTRA-FINE CONTACT ALIGNMENT

Methods relating to forming interconnects and resulting assemblies

Multi-chip semiconductor package and fabrication method thereof

Method for manufacturing an electronic circuit device and electronic circuit device

Method for mounting passive components on wafer

Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device

Suspended microchannel detectors

Optical device package with turning mirror and alignment post

Semiconductor laser diode having a PCB type lead frame

Multidirectional light emitting diode unit

Ceramic packaging for high brightness LED devices

Modular mounting arrangement and method for light emitting diodes

Placement of sacrificial solder balls underneath the PBGA substrate

Static electricity protective circuit and high-frequency circuit apparatus incorporating the same

Microelectronic devices and methods for packaging microelectronic devices