Surface acoustic wave filter

Green light emitting phosphor and light emitting device

Semiconductor package

Bridge connection type of chip package and fabricating method thereof

I/C chip suitable for wire bonding

Designs and methods for conductive bumps

Bonded structure using conductive adhesives, and a manufacturing method thereof

Package assembly for electronic device

Single chip and stack-type chip semiconductor package and method of manufacturing the same

Manufacturing a bump electrode with roughened face

Substrate with terminal pads having respective single solder bumps formed thereon

Integrating chip scale packaging metallization into integrated circuit die structures

Window ball grid array semiconductor package and method for fabricating the same

Window ball grid array semiconductor package with substrate having opening and mehtod for fabricating the same

Integral heatsink ball grid array

Semiconductor package

Memory expansion and chip scale stacking system and method

Integrated circuit package design

Chip on glass package

Electronic package having a folded flexible substrate and method of manufacturing the same

Reinforced die pad support structure

Semiconductor device and method for fabricating the same

Receptacle for a programmable, electronic processing device

Wafer-level packaging of optical receivers

Optical receiver package

Method for manufacturing electronic device including package

Light emitting apparatus

Light emission diode (LED)

Semiconductor light emitting device and manufacturing method for the same

Optoelectronic device packaging with hermetically sealed cavity and integrated optical element

Surface emitting laser package having integrated optical element and alignment post

Method of fabrication of semiconductor integrated circuit device

Wire bonding method and apparatus

Via placement for layer transitions in flexible circuits with high density ball grid arrays

Method for the production of LED bodies

Cooling system for a semiconductor device and method of fabricating same

Method for the lateral contacting of a semiconductor chip

Methods of forming backside connections on a wafer stack

Method of manufacturing semiconductor device

Image sensor packages

Light emitting device processes

Dynamic integrated circuit clusters, modules including same and methods of fabricating

Light emission device and manufacturing method thereof

Light source and vehicle lamp

Moisture-resistant electronic device package and methods of assembly

Head assembly, disk unit, and bonding method and apparatus

Micro electro mechanical systems device, method of manufacturing the same and micro electro mechanical systems module

Semiconductor device capable of detecting an open bonding wire using weak current

Signal isolators using micro-transformers

Semiconductor light-emitting device

Electrical circuit assembly with improved shock resistance

Dynamic integrated circuit clusters, modules including same and methods of fabricating

Super-thin high speed flip chip package

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME

Method of fabricating integrated electronic chip with an interconnect device

High frequency circuit block unit, method for producing same, high frequency module device and method for producing same

Semiconductor device

Semiconductor device having a pair of heat sinks and method for manufacturing the same

High-frequency module and method for manufacturing the same

Semiconductor apparatus with decoupling capacitor

Lead frame with flag support structure

Method of encapsulating interconnecting units in packaged microelectronic devices

Power module package having improved heat dissipating capability

Method of manufacturing wafer level package type FBAR device

Circuit device and manufacturing method of circuit device

Lead frame

High breakdown voltage junction terminating structure

Semiconductor package with through-hole

Semiconductor dice with edge cavities

Stress sensitive microchip with premolded-type package

Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element

Light-emitting device with enlarged active light-emitting region

Integrated emitter devices having beam divergence reducing encapsulation layer

Optoelectronic component and optoelectronic arrangement with an optoelectronic component

Semiconductor device and method of manufacturing thereof

Light-emitting device

Surface light emitting element, optical module, light transmission device

Chip scale package structure for an image sensor

Method of locating conductive spheres utilizing screen and hopper of solder balls

Apparatus for locating conductive spheres utilizing screen and hopper of solder balls

Mounting pad, package, device, and method of fabricating the device

Electronic component and method of manufacturing the same

Thermal interface adhesive

Method for manufacturing a piezoelectric oscillator

Semiconductor device and method of manufacturing the same

Semiconductor device which employs an interlayer insulating film of a low mechanical strength and a highly reliable metal pad, and a method of manufacturing the same

Method for forming ball pads of BGA substrate

Wire bonding method, semiconductor chip, and semiconductor package

Semiconductor device having fuse circuit on cell region and method of fabricating the same

Semiconductor component arrangement with a reduced oscillation tendency

Method for encapsulating a chip and/or other article

Using benzocyclobutene based polymers as underfill materials

Semiconductor device and manufacturing method of semiconductor device

Thin semiconductor package having stackable lead frame and method of manufacturing the same

Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby

System and method for marking the surface of a semiconductor package

Illuminated electric toothbrushes emitting high luminous intensity toothbrush

Protective sealing of optoelectronic modules

Surface-emitting type semiconductor laser, optical module, and optical transmission device

Memory card

Integrated circuit card and a method of manufacturing the same

Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof

Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring board

Display device

Power amplifier circuitry and method

Power amplifier circuitry and method

Power amplifier circuitry and method

Integrated circuit, interface circuit used in the integrated circuit, and apparatus using the integrated circuit

Power amplifier circuitry and method

I/O architecture for integrated circuit package

Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow

Semiconductor device

Bonding pad design for impedance matching improvement

BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same

Thick metal layer integrated process flow to improve power delivery and mechanical buffering

Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same

Multiple cavity/compartment package

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Stacked chip package having upper chip provided with trenches and method of manufacturing the same

Tape substrates with mold gate support structures that are coplanar with conductive traces thereof and associated methods

Flip chip substrate design

Semiconductor package having high quantity of I/O connections and method for fabricating the same

Integrated circuit package with leadframe enhancement and method of manufacturing the same

Lead frame, manufacturing method of the same, and semiconductor device using the same

Semiconductor device having transferred integrated circuit

LOOK DOWN IMAGE SENSOR PACKAGE

Semiconductor device and a method of manufacturing the same

Semiconductor package and method of manufacturing the same

Solid metal block mounting substrates for semiconductor light emitting devices

Nitride-based semiconductor light-emitting device and manufacturing method thereof

Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element

Electronic device contact structures

Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same

Process of manufacturing a solder-fill for applying to semiconductor package

Method and system for stud bumping

Copper paste and wiring board using the same

Radiation shielded semiconductor package

Electric toothbrush comprising an electrically powered element

Toothbrush with severable electrical connections

Electrical contact and connector and method of manufacture

Electrical contact and connector and method of manufacture

Method for chemical etch control of noble metals in the presence of less noble metals

Bond pad techniques for integrated circuits

Method for fabricating thermally enhanced semiconductor device

Diffusion solder position, and process for producing it

Ball film for integrated circuit fabrication and testing

Method of forming a bond pad

Method of making a circuitized substrate

Semiconductor device and manufacturing method thereof

Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus

Self-assembled nanometer conductive bumps and method for fabricating

Microbeam assembly and associated method for integrated circuit interconnection to substrates

Super high density module with integrated wafer level packages

Manufacturing method of solid-state image sensing device

Light emitting diode and method for producing it

Substrate frame

Optical transmitting module having a de-coupling inductor therein

Optical device and method for manufacturing the same, optical module, and optical transmission device

Optical transmitting module having a can type package and providing a temperature sensor therein

Can-type optical transmitting module utilizing a laser diode with impedance matching resistors

Laser diode module

Memory module

Lighting device composed of a thin light emitting diode module

Method for making a lamp string

Electronic part mounting substrate and method for producing same

Heat sink structure with embedded electronic components for semiconductor package

Method for fixing a lens of an optic group with respect to an optical sensor inside an electronic device able to acquire images and corresponding device

Multi-channel laser pump source for optical amplifiers

Substrate having microstrip line structure, semiconductor device having microstrip line structure, and manufacturing method of substrate having microstrip line structure

Embedded RF vertical interconnect for flexible conformal antenna

White-Light Emitting Device, and Phosphor and Method of Its Manufacture

Resin-encapsulated semiconductor apparatus and process for its fabrication

Semiconductor package structure and method for manufacturing the same

Resin-encapsulated package, lead member for the same and method of fabricating the lead member

Semiconductor device with sensor and/or actuator surface and method for producing it

Semiconductor device with staggered electrodes and increased wiring width

Integrated circuit device with embedded passive component by flip-chip connection and method for manufacturing the same

Flip-chip package

Multi-dice chip scale semiconductor components

Buried solder bumps for AC-coupled microelectronic interconnects

Semiconductor device, semiconductor module and method of manufacturing semiconductor device

Tape circuit substrate and semiconductor chip package using the same

Bonding material and circuit device using the same

Zero capacitance bondpad utilizing active negative capacitance

Pad structures including insulating layers having a tapered surface

Semiconductor device

Adhesive sheet for producing a semiconductor device

Semiconductor device with pipe for passing refrigerant liquid

Electronic package with insert conductor array

Array-molded package heat spreader and fabrication method therefor

Leadframe-based mold array package heat spreader and fabrication method therefor

Leadless semiconductor package

Unit semiconductor chip and multi chip package with center bonding pads and methods for manufacturing the same

Method of fabricating a two die semiconductor assembly

Stacked-chip semiconductor package and fabrication method thereof

Chip stack package and manufacturing method thereof

High-frequency chip packages

Invertible microfeature device packages

Semiconductor device

Integrated circuit package having inductance loop formed from a bridge interconnect

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Integrated circuit package having an inductance loop formed from a multi-loop configuration

Light emitting diode with high heat dissipation

System and method for enhanced LED thermal conductivity

Package for a semiconductor light emitting device

Semiconductor light-emitting device having a semiconductor light-emitting element mounted on a substrate with anisotropically conductive adhesive interposed therebetween

Thermal conductive material utilizing electrically conductive nanoparticles

Data carrier card

IC card

Solder-fill application for mounting semiconductor chip on PCB

Wafer-level chip scale package

Wirebonding insulated wire and capillary therefor

Stacked microfeature devices and associated methods

Circuit component built-in module and method for manufacturing the same

Current sensor

Integrated capacitor-like battery and associated method

Solid-state imaging device and method for manufacturing the same

Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations

Method for forming plating film

Programmed material consolidation processes for protecting intermediate conductive structures

Wire bonding for thin semiconductor package

Active area bonding compatible high current structures

Methods of processing of gallium nitride

Fluxless assembly of chip size semiconductor packages

Semiconductor device having silicon on insulator structure and method of fabricating the same

Semiconductor device and method for production thereof

Photo-semiconductor module and method for manufacturing the same

Method of fabricating an integrated circuit that seals a MEMS device within a cavity

Process for making contact with and housing integrated circuits

Methods for processing semiconductor devices in a singulated form

Optoelectronics processing module and method for manufacturing thereof

Optical device and method of manufacturing same

Information media using information of defect in an article

Semiconductor device suitable for system in package

Method for making an integrated circuit substrate having embedded back-side access conductors and vias

Boron nitride agglomerated powder

Capacitor module and semiconductor

Transparent member in a solid-state image pick-up apparatus supported through use of micro-lenses larger in size than pixel micro-lenses and a method for producing the micro-lenses and transparent member

Image display device and light emission device

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device

Microelectronic assemblies with springs

Apparatus and method to reduce signal cross-talk

Near hermetic power chip on board device and manufacturing method therefor

Ball grid array package, stacked semiconductor package and method for manufacturing the same

[CHIP STRUCTURE]

Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

High-frequency semiconductor device

Relaxed tolerance flip chip assembly

Coolant cooled type semiconductor device

Semiconductor package with improved chip attachment and manufacturing method thereof

Circuit device

Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument

Area array type package stack and manufacturing method thereof

Semiconductor component having dummy segments with trapped corner air

Substantially hermetic packages for semiconductor devices and substantially hermetically packaged, semiconductor devices

Semiconductor device including a semiconductor chip mounted on a metal base

Wirebonded assemblage method and apparatus

Light emitting diode systems

Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element

Method of fabricating a light emitting device

Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element

Optical semiconductor device

Method of metal sputtering for integrated circuit metal routing

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

Electronic circuit unit and method of manufacturing same

Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives

Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance

Singulation method used in leadless packaging process

Semiconductor device and production method therefor

Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same

Method of manufacturing heat conductive substrate

Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion

Method for manufacturing solid-state imaging devices

Method for manufacturing semiconductor devices

Semiconductor packaging structure and method for forming the same

Method for manufacturing high-frequency module device

Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element

Electrochemical cell and fabrication method of the same

Transmitter and/or receiver arrangement of optical signal transmission

Electronic component and method for manufacturing the same

Electromagnetic wave absorption material and an associated device

Semiconductor electronic device and method of manufacturing thereof

Semiconductor package using flexible film and method of manufacturing the same

Wire bonding method for copper interconnects in semiconductor devices

Semiconductor device and method of manufacturing the same, circuit board and electronic instrument

Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnection

Multiple stacked-chip packaging structure

Bump transfer fixture

Die-up ball grid array package including a substrate having an opening and method for making the same

Semiconductor chip with bumps and method for manufacturing the same

Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors

Chip package structure

Heat releasing member, package for accommodating semiconductor element and semiconductor device

Power semiconductor module with deflection-resistant base plate

Stacked chip assembly with encapsulant layer

Method for fabricating semiconductor components using mold cavities having runners configured to minimize venting

Small-sized image pick up module

Light emitting diode