Module board having embedded chips and components and method of forming the same

Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate

Inductive device including bond wires

Vertical die chip-on-board

Plural leds mounted within a central cutout of a surrounding circular reflective electrode

Method of manufacturing an optoelectronic package

Information storage apparatus and electronic device in which information storage apparatus is installed

Semiconductor device

Arrangement of a chip package constructed on a substrate and substrate for production of the same

Semiconductor device and a method of manufacturing the same

Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested thereto

Internally reinforced bond pads

Offset-bonded, multi-chip semiconductor device

Semiconductor device manufacturing method and semiconductor device manufactured thereby

Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method

Semiconductor component and corresponding fabrication/mounting method

Semiconductor device package utilizing proud interconnect material

Semiconductor device and manufacturing method thereof

Thinned die integrated circuit package

Semiconductor device

Semiconductor device with stacked chips

Lead-free integrated circuit package structure

Stackable integrated circuit packaging

Temperature sustaining flip chip assembly process

Semiconductor device and method for fabricating the same

Semiconductor package with a chip on a support plate

Method for making dual gauge leadframe

Low-power semiconductor chip with separated power ring, method for manufacturing the same, and method for controlling the same

Chip package and electrical connection structure between chip and substrate

Hermetically sealed silicon micro-machined electromechanical system (MEMS) device having diffused conductors

Protective device

Chip and wafer integration process using vertical connections

Semiconductor device

Light emitting device

Semiconductor light emitting devices and submounts

Feed through structure for optical semiconductor package

Semiconductor device and a method of manufacturing the same

Surface emitting device, manufacturing method thereof and projection display device using the same

Capillary with contained inner chamfer

Multi-part capillary

Electroplating method for a semiconductor device

Wiring layout of auxiliary wiring package and printed circuit wiring board

Method for electrical interconnection of angularly disposed conductive patterns

Isolated pressure transducer

Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices

Method of manufacturing semiconductor device and system of manufacturing semiconductor device

Methods of reducing bleed-out of underfill and adhesive materials

Techniques for joining an opto-electronic module to a semiconductor package

Method for manufacturing a light emitting diode device

Lamp of reflector device and method of manufacturing same

Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling

Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling

Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling

Electronic device and method of manufacturing same

Optical transmission module with temperature control

Camera module and method for packaging the same

Resonator device, electronic equipment provided with resonator device and method of manufacturing resonator device

Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification

Circuit layout structure

Packages for image sensitive electronic devices

Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip

Stacked semiconductor device

Acoustic wave device and method of fabricating the same

Semiconductor interconnect having conductive spring contacts

Support structure for low-k dielectrics

Microelectronic element having trace formed after bond layer

Selective deposition of solder ball contacts

Semiconductor device having curved leads offset from the center of bonding pads

Semiconductor testing device

Method of making multichip wafer level packages and computing systems incorporating same

Semiconductor package with heat spreader

Stacked chip semiconductor device

Substrate and method of manufacture thereof

Method of manufacturing a semiconductor device including using a sealing resin to form a sealing body

Formation of circuitry with modification of feature height

Switching media for chip carrier device

Circuit module

Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)

Light emitting diode lamp

Circuit interconnect for optoelectronic device

Optoelectronic semiconductor component

Illumination assembly

Solid-state imaging apparatus, wiring substrate and methods of manufacturing the same

Method of manufacturing a solid state image sensing device

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

Micromechanical sensor

Chip assembling structure and socket

Parallel design processes for integrated circuits

Analysis of integrated circuits for high frequency performance

Multi-chip package type memory system

Medical device and method of manufacturing

Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation

Roughened bonding pad and bonding wire surfaces for low pressure wire bonding

Integrating passive components on spacer in stacked dies

Semiconductor device and its manufacturing method, and semiconductor device manufacturing system

Semiconductor device and method of fabricating the same

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Wiring base with wiring extending inside and outside of a mounting region

Bond pad

Wire bond integrity test system

Bonding structure with buffer layer and method of forming the same

Photoelectric conversion module and optical transceiver using the same

Memory card with push-push connector

Packaged microelectronic imagers and methods of packaging microelectronic imagers

Microscopic batteries for MEMS systems

Light source apparatus with light-emitting chip which generates light and heat

Low coefficient of thermal expansion (CTE) semiconductor packaging materials

Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device

Semiconductor chip, semiconductor device, circuit board, and electronic instrument

Bump-on-lead flip chip interconnection

Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same

Method for mounting semiconductor chip and semiconductor chip-mounted board

Semiconductor device and method of manufacturing the same, circuit board, and electronic apparatus

Semiconductor device

Semiconductor device

Semiconductor device, its manufacturing method, circuit board, and electronic unit

Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC)

Customized microelectronic device and method for making customized electrical interconnections

Plastic dual-in-line packaging (PDIP) having enhanced heat dissipation

Multi-concentric pad arrangements for integrated circuit pads

Module assembly and method for stacked BGA packages

Highly reliable stack type semiconductor package

Semiconductor device

Chip adhesive

Overlap stacking of center bus bonded memory chips for double density and method of manufacturing the same

Diode housing

Lead frame, resin-encapsulated semiconductor device, and method of producing the same

Optical module and an optical receiver using the same

LED package

Tri-color ZnSe white light emitting diode

White color light emitting device

Light-Emitting Diode and Semiconductor Light-Emitting Device

LED lamp having heat dissipating portion

Photodiode array and method for establishing a link between a first semiconductor element and a second semiconductor element

Solid-state imaging device with molded resin ribs and method of manufacturing

Low loop height ball bonding method and apparatus

Flip chip bonding tool tip

Bonding apparatus

Bonding tool with resistance

Methods and apparatus for integrated circuit device power distribution via internal wire bonds

Device having a complaint element pressed between substrates

Digital output MEMS pressure sensor and method

Phosphonamides, process for producing the same, and use thereof

Wire bonding process for copper-metallized integrated circuits

Method of manufacturing a semiconductor device

Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same

Method of manufacturing semiconductor device, semiconductor device, circuit board, and electronic instrument

Semiconductor/printed circuit board assembly, and computer system

Techniques for packaging multiple device components

In-line die attaching and curing apparatus for a multi-chip package

Frame for semiconductor package

Phototherapy device and system

Fretting and whisker resistant coating system and method

Method of applying a pattern of particles to a substrate

Structure and method for lead free solder electronic package interconnections

Laser diode device with an APC inside the cap

Memory card with adapter

LED device and the manufacturing method thereof

Microtransformer for system-on-chip power supply

High frequency package

Power amplifier device

Impedance matching commonly and independently

LED lamp with light-emitting junction arranged in three-dimensional array

LED-based white-emitting illumination unit

Integrated circuit chip packaging process

Method for producing molding compound resin tablet for wavelength conversion, and method for manufacturing white light emitting diode by using the production method

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Substrate-based package for integrated circuits

Conductive bumps with insulating sidewalls and method for fabricating

Bond pad for flip chip package

Conductive bumps with non-conductive juxtaposed sidewalls

Flip chip device having supportable bar and mounting structure thereof

Seedless wirebond pad plating

Barrier layers for tin-bearing solder joints

Electric connection terminal and method of manufacturing the same, semiconductor device and method of mounting the same

Mounting structure for semiconductor parts and semiconductor device

Use of palladium in IC manufacturing with conductive polymer bump

Semiconductor chip package having decoupling capacitor and manufacturing method thereof

STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY

Corrosion-resistant bond pad and integrated device

Encapsulated lead having step configuration

Wafer-level package and its manufacturing method

Method of fabricating semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface

Heat spreader and semiconductor device package having the same

Circuit device and manufacturing method thereof

Carbon-carbon and/or metal-carbon fiber composite heat spreaders

Semiconductor package

Heat spreader and semiconductor device package having the same

Chip package structure and manufacturing method thereof

Electronic device

Semiconductor device

Optimum padset for wire bonding RF technologies with high-Q inductors

Redistribution of substrate interconnects

Semiconductor chip package and method

Multi-chip module

Stacked BGA packages

Wafer level stack structure for system-in-package and method thereof

Methods and apparatus for packaging integrated circuit devices

Method for fabricating lead frame and method of fabricating semiconductor device using the same

Integrated circuit carrier apparatus method and system

Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices having conductive complementary structures

Semiconductor device and manufacturing method thereof

Molded leadless package having a partially exposed lead frame pad

Semiconductor device and manufacturing method thereof

Semiconductor element, semiconductor device, and method for manufacturing semiconductor element

EMI shielded integrated circuit packaging apparatus method and system

Semiconductor component and sensor component for data transmission devices

Optical receiver

Semiconductor light emitting diode and method for manufacturing the same

Flexible array

Semiconductor component, wafer and package having an optical sensor

Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer

Flip-chip mounting circuit board, manufacturing method thereof and integrated circuit device

Pressure sensor having sensor chip and signal processing circuit mounted on a common stem

Semiconductor integrated circuit

Compliant interconnect assembly

Sensor module

Etching method and method of manufacturing circuit device using the same

Integrated circuit device and the manufacturing method thereof

Method of manufacturing a semiconductor device

Transfer mold semiconductor packaging processes

Method and system for hermetically sealing packages for optics

Semiconductor chip, chip stack package and manufacturing method

Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same

Process for manufacturing a through insulated interconnection in a body of semiconductor material

Quad flat flip chip packaging process and leadframe therefor

Optical receiver

Techniques for joining an opto-electronic module to a semiconductor package

High-frequency signal transmitting optical module and method of fabricating the same

Compact laser package with integrated temperature control

Stacked memory, memory module and memory system

Light-emitting device

Hyperbga buildup laminate

Washing device for washing the transparent layer of the image sensor package

Optical deflector array

Image sensor module

Image pickup device and a manufacturing method thereof

Multiple chips image sensor package

Inductor formed in an integrated circuit

Surface acoustic wave device, package for the device, and method of fabricating the device

Transparent small memory card

Semiconductor device having a bond pad and method therefor

Bonding structure with compliant bumps

Relaxed tolerance flip chip assembly

Method for producing an adhesive bond and adhesive bond between a chip and a planar surface

Method and semiconductor device having copper interconnect for bonding

Using backgrind wafer tape to enable wafer mounting of bumped wafers

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Method of fabricating an interconnection for chip sandwich arrangements

Direct contact semiconductor cooling

Semiconductor package having ultra-thin thickness and method of manufacturing the same

Chip package structure

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

FBGA arrangement

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Small memory card

Integrated circuit package having a resistant layer for stopping flowed glue

Image sensor package

Jig device for packaging an image sensor

Lead frame and method for fabricating semiconductor package employing the same

Lead frame and semiconductor device having the same as well as method of resin-molding the same

Bumped chip carrier package using lead frame and method for manufacturing the same

Lead frame and semiconductor package with the same

Semiconductor device having a semiconductor chip mounted on external terminals and fabrication method thereof

Semiconductor device

Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof

Surface emitting laser package having integrated optical element and alignment post

Image sensor package

Apparatus and method for mounting electronic components

Apparatus and method for low pressure wirebond

Optoelectronic component assembly

High-frequency signal transmitting device

Electronic part, and electronic part mounting element and an process for manufacturing such the articles

Semiconductor device

Fabrication method of semiconductor package with heat sink

Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same

Semiconductor device and manufacturing method thereof

Structure and method of making capped chips having vertical interconnects

Process for strengthening semiconductor substrates following thinning

Process for manufacturing semiconductor device

Robust Group III light emitting diode for high reliability in standard packaging applications

Fabrication method of semiconductor integrated circuit device

Wire loop height measurement apparatus and method

Semiconductor laser assembly

Stacked semiconductor device including improved lead frame arrangement

Apparatus for conditioning power and managing thermal energy in an electronic device

Magnetic thin film, magnetic component that uses this magnetic thin film, manufacturing methods for the same, and a power conversion device

Red phosphor and method of preparing the same, and red light emitting diode, white light emitting diode, and active dynamic liquid crystal device using the red phosphor

Radar sensor

Film acoustically-coupled transformer with increased common mode rejection

Film acoustically-coupled transformer with reverse C-axis piezoelectric material

Thin-film acoustically-coupled transformer

Radio frequency power amplifier module

Carrier for cleaning sockets for semiconductor components having contact balls

Method of forming an electrical contact

Garnet phosphor materials having enhanced spectral characteristics

Film acoustically-coupled transformers with two reverse c-axis piezoelectric elements

Microscopic batteries for MEMS systems

Heat sinkable package

Semiconductor device