Wavelength-converting LED

Opposed terminal structure having a nitride semiconductor element

Semiconductor device having a light emitting element

Semiconductor light-emitting element

Structure of light-emitting diode array module

Semiconductor package having light sensitive chips

Opto-coupler

Semiconductor light emitting diode and semiconductor light emitting device

Probe card assembly

Package substrate and process thereof

Semiconductor light-emitting device and method of manufacturing the same and mounting plate

Encapsulated component which is small in terms of height and method for producing the same

Semiconductor sensor and method of plating semiconductor devices

Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads

Component connecting apparatus

Medical illuminator, and medical apparatus having the medical illuminator

Composition for removing photoresist and method of forming a bump electrode in a semiconductor device using the composition

Asymmetric plating

Method for reducing defects in post passivation interconnect process

Low fabrication cost, fine pitch and high reliability solder bump

Method of wafer bumping for enabling a stitch wire bond in the absence of discrete bump formation

Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Lead frame, semiconductor device using the same and method of producing the semiconductor device

Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials

PROBE TIP DESIGN APPLIED IN A FLIP CHIP PACKAGING PROCESS

Method for creating adhesion during fabrication of electronic devices

Module for an analysis device, applicator as an exchange part of the analysis device and analysis device associated therewith

Electronic circuit device

Semiconductor memory module

Light-emitting diode lamp having a terminal portion with a notch portion

Light emitting diode

Cooler for cooling electric part

Image capturing device

Filter for printhead assembly

High frequency circuit module

Surface acoustic wave element, surface acoustic wave device, surface acoustic wave duplexer, and method of manufacturing surface acoustic wave element

Semiconductor device

Semiconductor device

Current sensor and current sensor manufacturing method

Arrangement of luminescent materials, wavelength-converting casting compound and light source

Method for mounting surface acoustic wave element and surface acoustic wave device having resin-sealed surface acoustic wave element

Semiconductor device and wire bonding apparatus

Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks

Tin/indium lead-free solders for low stress chip attachment

Multi-chip module

Multi-chip semiconductor device with specific chip arrangement

Multi-functional solder and articles made therewith, such as microelectronic components

Semiconductor device structural body and electronic device

Enhanced die-up ball grid array and method for making the same

Semiconductor apparatus and method of manufacturing the same

Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts

Integrated circuit package with overlapping bond fingers

Semiconductor device and an electronic device

Stacked mass storage flash memory package

Solid-state image sensor including a microlens

Module with embedded semiconductor IC and method of fabricating the module

Semiconductor device and method of manufacturing thereof

Lead-frame-based semiconductor package and fabrication method thereof

Leadframe and semiconductor package made using the leadframe

Semiconductor package including flip chip

Topless semiconductor package

Optical semiconductor device and method of manufacturing the same

Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus

Semiconductor module and DC-DC converter

Solid-state image sensing device, manufacturing method and attachment method thereof, imaging apparatus and image read unit for imaging apparatus

Protection circuit device using MOSFETs and a method of manufacturing the same

Silicon building blocks in integrated circuit packaging

Molded ball grid array

Semiconductor die packages with recessed interconnecting structures

Light emitting diodes packaged for high temperature operation

Semiconductor device and method of manufacturing the same

LED fabrication via ion implant isolation

Multi-functional solder and articles made therewith, such as microelectronic components

Wire bonders and methods of wire-bonding

Method for checking the quality of a wedge bond

Process for the production of improved metallized films

Multi-functional solder and articles made therewith, such as microelectronic components

Semiconductor pressure sensor device to detect micro pressure

Contact structures and methods for making same

Method for producing a semiconductor device in chip format

Integrated underfill process for bumped chip assembly

Inhibition of tin oxide formation in lead free interconnect formation

ENCAPSULATED PIN STRUCTURE FOR IMPROVED RELIABILITY OF WAFER

Fabrication of stacked microelectronic devices

Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads

Bonding structure with pillar and cap

Fabrication of stacked microelectronic devices

Ultrathin leadframe BGA circuit package

Method of fabricating semiconductor device and semiconductor device

Composite lid for land grid array (LGA) flip-chip package assembly

Conductive block mounting process for electrical connection

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Manufacturing method of semiconductor device

Packaged microelectronic components

Method of manufacturing a semiconductor device

Method of manufacturing semiconductor device

Method of bonding semiconductor devices

Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same

Light-transmitting module containing an driving device in a package

Optical transmission module

Multiple power levels for a chip within a multi-chip semiconductor package

Power supply device

System and method for integrating a digital core with a switch mode power supply

Light-emitting unit, light-emitting unit assembly, and lighting apparatus produced using a plurality of light-emitting units

Low-inductance circuit arrangement for power semiconductor modules

Voltage protection device

Electronic component protected against electrostatic discharges

Dimmable rearview assembly having a glare sensor

Semiconductor device, liquid crystal module adopting same, method of manufacturing liquid crystal module, and electronic equipment adopting same

Millimeter wave (MMW) radio frequency transceiver module and method of forming same

High frequency circuit using high output amplifier cell block and low output amplifier cell block

Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer

Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structure

Variable thickness pads on a substrate surface

Pad over active circuit system and method with meshed support structure

Semiconductor apparatus including a radiator for diffusing the heat generated therein

Nickel bonding cap over copper metalized bondpads

High reliability chip scale package

Method for assembling a ball grid array package with multiple interposers

Multi-chip module having bonding wires and method of fabricating the same

Transistor module

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor wafer, semiconductor device, method for manufacturing the semiconductor device, circuit board, and electronic apparatus

Multi-chips module package and manufacturing method thereof

Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

Curable encapsulant compositions

Method of forming a package

Techniques for packaging a multiple device component

Semiconductor device and its manufacturing method

Semiconductor chip package and stacked module having a functional part and packaging part arranged on a common plane

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

Stacked chip-packaging structure

Packaged microelectronic devices and methods of forming same

Method for fabricating semiconductor component with chip on board leadframe

Semiconductor component having chip on board leadframe

Multi media card formed by transfer molding

Electronic device package

Healing of micro-cracks in an on-chip dielectric

Standoffs for centralizing internals in packaging process

Light source unit

Flip chip light emitting diode devices having thinned or removed substrates

Mount for semiconductor light emitting device

Light emitting diode including a cover covering a light emitting diode element

Surface-mounted LED and light emitting device

Chip type photo coupler

Optical coupling device including lead frame having a convexity and method of manufacturing the device

Image pickup device, radiation image pickup device and image processing system

IC card and IC chip module

Method of manufacturing a semiconductor device by forming plating layers having differing thicknesses

Printed wiring board and manufacturing method therefor

Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate

Laminated wiring board and its mounting structure

Printed circuit board with a heat dissipation element and package comprising the printed circuit board

Method of making a semiconductor device having an opening in a solder mask

Apparatus used to package multimedia card by transfer molding

Structure having flush circuit features and method of making

Nickel bonding cap over copper metalized bondpads

Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging

Method for forming bump protective collars on a bumped wafer

Bumping process

Methods of forming conductive structures including titanium-tungsten base layers and related structures

Semiconductor integrated circuit device and process for manufacturing the same

Method and apparatus for attaching microelectronic substrates and support members

Large area flat image sensor assembly

Method for making electronic devices including silicon and LTCC and devices produced thereby

Charge coupled device package

Multiple substrate microelectronic devices and methods of manufacture

Semiconductor package having semiconductor constructing body and method of manufacturing the same

Fabrication method of semiconductor integrated circuit device

Nucleation of diamond films using higher diamondoids

Optoelectronic module with transmitter chip and connecting piece for the module with respect to an optical fiber and with respect to a circuit board, and methods for producing the same

Computer system including at least one stress balanced semiconductor package

Memory package

Vehicular lamp and light source module

Vehicular lamp and light source module

Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density

Signal transmission structure having a non-reference region for matching to a conductive ball attached to the signal transmission structure

Methods and devices for providing bias to a monolithic microwave integrated circuit

Module part

Method and apparatus for processing semiconductor devices in a singulated form

IC chip with improved pillar bumps

Ball grid array package substrate and method for manufacturing the same

Semiconductor component of semiconductor chip size with flip-chip-like external contacts, and method of producing the same

Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same

Electronic assembly having a die with rounded corner edge portions and a method of fabricating the same

Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumps

Wirebond pad for semiconductor chip or wafer

Semiconductor component having conductors with wire bondable metalization layers

Semiconductor device with connections for bump electrodes

Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one wafer

Structure of multi-tier wire bonding for high frequency integrated circuit

Thermal enhanced extended surface tape for integrated circuit heat dissipation

Manufacture of mountable capped chips

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same

Ball grid array structures having tape-based circuitry

Semiconductor device voltage supply for a system with at least two, especially stacked, semiconductor devices

Method of stacking semiconductor element in a semiconductor device

Semiconductor device and switching element

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

[MULTI-CHIP PACKAGE]

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

Micromachine package and method for manufacturing the same

Method for forming a chip package

Process for fabricating a semiconductor package and semiconductor package with leadframe

Chip light emitting diode and fabrication method thereof

Radiation-emitting semiconductor chip, method for production thereof and radiation-emitting component

Flip-chip bonding of light emitting devices

Light-emitting semiconductor component

Semiconductor light emitting element, its manufacturing method and semiconductor light emitting device

Semiconductor device and method for manufacturing the same

[PROCESS FOR FABRICATING BUMPS]

Methods for enclosing a thermoplastic package

Method for optimizing routing layers and board space requirements for a ball grid array land pattern

Method of manufacturing semiconductor device and manufacturing apparatus of semiconductor device

Method, system, and apparatus for transfer of dies using a pin plate

Substrate holder and plating apparatus

Method for forming a bond pad interface

Method of making a semiconductor device having an opening in a solder mask

Methods for protecting intermediate conductive elements of semiconductor device assemblies

Method for fabricating semiconductor photodetector

Stencil mask design method and under bump metallurgy for C4 solder bump

Manufacturing process of memory module with direct die-attachment

Manufacturing method for sealing a semiconductor device

Radiation emitting semiconductor component with luminescent conversion element

Method for processing semiconductor devices in a singulated form

Memory card with raised portion

Optical component and method of manufacturing the same

Semiconductor laser module having a co-axial package and transmission lines for complementary driving signal

Peripheral card with hidden test pins

Image sensor and method for manufacturing the same

Capacitor device and method of manufacturing the same

Electronic component-built-in module

Piezoelectric oscillator, manufacturing method therefor, mobile phone apparatus using piezoelectric oscillator, and electronic apparatus using piezoelectric oscillator

Method of manufacturing a semiconductor light-emitting device

Conversion LED having a phosphor component based on an agglomeration of phosphor particles and pores

Semiconductor assembly encapsulation mold and method for forming same

Chip package structure

Wafer-level chip scale package and method for fabricating and using the same

Semiconductor device, semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module

Semiconductor interconnect having compliant conductive contacts

Semiconductor device including a diffusion layer

Wiring board, stacked wiring board and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Reconnectable chip interface and chip package

Under-bump metallugical structure

Method of surface-mounting semiconductor chip on PCB

Semiconductor unit with cooling system

Enhanced die-down ball grid array and method for making the same

Power semiconductor device with a control circuit board that includes filled through holes

Multiple die stack apparatus employing T-shaped interposer elements

BGA package with stacked semiconductor chips and method of manufacturing the same

Electronic package having a folded package substrate

Cutting method and method of manufacturing semiconductor device

Hybrid integrated circuit

Reconnectable chip interface and chip package

Modular power semiconductor module

Integrated circuit package with a balanced-part structure

Semiconductor device including inclined cut surface and manufacturing method thereof

Lead for integrated circuit package

Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

Semiconductor packaging structure

Dual gauge leadframe

Image sensor having an improved transparent layer

Semiconductor device including a potential drawing portion formed at a corner

Semiconductor device

Semiconductor device having a flip-chip construction

Flange for integrated circuit package

Semiconductor device wiring structure

Compound semiconductor light emitting device and its manufacturing method

Light emitting diode package structure

Thermoplastic material

Sialon-based phosphor and its production method

Camera module for compact electronic equipments

Image sensor and method for packaging the same

Image sensor and method for packaging the same

Image sensor module and method for manufacturing the same

Memory card with and without enclosure

Method of fabricating an electronic device

Method for shielding integrated circuit devices

Method and apparatus for generating a device ID for stacked devices

High frequency power amplifier module and semiconductor integrated circuit device

Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device

Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby

Wafer level bumping process

Method for forming a bonding pad of a semiconductor device including a plasma treatment

Manufacturing method for semiconductor device

Method for manufacturing semiconductor device

Aluminum cap with electroless nickel/immersion gold

Underfill and encapsulation of carrier substrate-mounted flip-chip components

Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages

Method for sealing semiconductor component

Semiconductor device and method of manufacturing the same, cirucit board, and electronic instrument

Packaging method for thin integrated circuits

Process for producing semiconductor device and semiconductor device

Optoelectronic packaging with embedded window

Semiconductor integrated device including support substrate fastened using resin, and manufacturing method thereof

Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it

Method of fabrication of stacked semiconductor devices